• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.139-142
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• 1995

Polyimide(PI) thin films are fabricated by vapor deposition polymerization(VDP) from PMDA and DDE. The IR spectrum show that PAA the films are changed into PI films by curing. The activation energy of PI films is estimated to be 0.32 [eV] at the electric field of 0.133 [Mv/cm]. The resistivity is about 4.5${\times}$10$\_$16/ [$\Omega$$.$cm] at room temperature.

• 전기학회논문지
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• 제56권1호
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• pp.139-141
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• 2007

Thin films of polyimide (Pl) were fabricated by a vapor deposition polymerization method (VDPM) and studied for the photosensitive characteristic. Polyamic acid (PAA) thin films fabricated by vapor deposition polymerization (VDP) from 6FDA and 4-4' DDE were converted to PI thin films by thermal curing. From AFM and Ellipsometer experimental, the films thickness was decreased and the reflectance was increased as the curing temperature was increased. Those results implies that thin film is uniform. From UV-Vis spectra, PI thin films showed high absorbance in 225 $\sim$ 260 [nm] region.

• 한국전기전자재료학회논문지
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• 제11권5호
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• pp.340-346
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• 1998

In this study, we intended to investigate aging effect of polyimide prepared by VDPD(vapor deposition polymerized method). The prepared polymide was treated by the oxygen and argon gas plasma. And we evaluated the polyimide treated by plasma from contact angle, surface leakage current, FT-IR and SEM. We know that the structure of polyimide at surface are changed to amide structure by plasma treating. It seems that strong energy of plasma causes breaking the molecular chin of the polyimide. And surface roughness increases with plasma treating time increased and sequentially the wettability and leakage current increases.

• 한국진공학회지
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• 제7권3호
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• pp.229-236
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• 1998

본 논문에서는 건식중합법에 속하는 진공증착 중합법을 이용하여 내열 절연성 박막 을 제작하고 열경화 온도에 따른 박막의 물성과 전기적 특성에 대해 연구하였다. hexafluoroisopropyliden-2,2-bis[phthalicanhydride](6FDA)와 4,4'-diamino diphenyl ether (DDE) 단량체를 화학량론적으로 최적의 온도인 $214^{\circ}C$, $137^{\circ}C$부분에서 같은 증발율을 보일 때 폴리이미드를 형성하였다. 진공증착 중합된 박막은 열경화에 의해 이미드특성 피이크가 증가되며, 폴리아믹산의 형태에서 폴리이미드 형태로 축중합되어짐을 알 수 있었다. 열경화 온도가 증가함에 따라 박막의 두께는 감소되고 굴절율은 증가된다. 열경화 온도가 $300^{\circ}C$인 경우 최적임을 알았고, 이 온도에서 열경화 시킨 폴리이미드의 전기적 특성에서 100Hz~ 200kHz주파수에서는 3.7의 비유전율을 나타내었고, 유전정접은 0.008의 낮은 값을 보였다. 또한, 30~에서 약1.05$\times$1015$\Omega$cm의 저항율을 보였다.

• 전기학회논문지
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• 제56권6호
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• pp.1080-1086
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• 2007

The aim of this paper is to establish the optimum fabrication condition of specimens, using the Vapor Deposition Polymerization Method(VDPM), which is one of modesto prepare functional organic thin films using a dry process, and to develop a thin film type humidity sensor which has good humidity sensitive characteristics. The inner part of the film became denser and roughness of the film surface eased as curing temperature increased so that thickness of the film could be made uniform. This also shows the appropriate curing temperature was $250^{\circ}C$. The basic structure of the humidity sensor is a parallel capacitor which consists of three layers of Aluminum/Polyimide/Aluminum. The result of SEM and AFM measurement shows that the thickness of PI thin films decreased and the refraction increased as curing temperature increased, which indicates that a capacitance-type humidity sensor utilizing polyimide thin film is fabricated on a glass substrate. The characteristics of fabricated samples were measured under various conditions, and the samples had linear characteristics in the range of 20-80 %RH, independent of temperature change, and low hysteresis characteristic.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1394-1396
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• 1994

Polyimide thin films were fabricated an using vapor deposition polymerization apportus, and their FT-IR and TGA characteristics were investigated. The peaks of $720cm^{-1}$ and $1380cm^{-1}$ show C=O stretch mode and C-N stretch mode, and that of the cured polyimide at $350^{\circ}C$ were sturated. $T_d$(Depolymerization temperature) was showed at $405^{\circ}C$ from research of thermal resistivity characteristics by TGA It was possible to fabrication of polyimide thin film by VDPM.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1487-1489
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• 1998

In this paper, thin films of PI were fabricated VDPM of dry processes which are easy to control the film's thickness and hard to pollute due to volatile solvents. From FT-lR, PAA thin films fabricated by VDP were changed to PI thin films by thermal curing. From SEM, AFM and Ellipsometer experimental, as the higher curing temperatures the films thickness decreases and reflectance increases. Therefore, Pl could be fabricated stable by increasing curing temperature. The relative permitivity and dissipation loss factor were 3.7 and 0.008. Also, the resistivity was about $1.05{\times}10^{15}{\Omega}cm$ at $30^{\circ}C$.