• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.31-31
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• 1996

• Proceedings of the Korean Vacuum Society Conference
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• 1998.06a
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• pp.167-167
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• 1998

• Proceedings of the Korean Vacuum Society Conference
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• 2003.08a
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• pp.77-78
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• 2003

• International journal of advanced smart convergence
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• v.8 no.4
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• pp.200-206
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• 2019

In this study, we compared the VacCAD and VacSim^(Multi), commercial vacuum simulators, to verify the advantages of VacCAD's efficiency. It was emphasized on immediacy and simplicity of simulation modelling, and characteristics of the pump combinations, pumping down curves, and vacuum materials. First, usability of simulation mechanism was estimated through the modeling schematics and obtained simulation results of each employed simulator were compared to evaluate the applicability in practice. Simulation reliability of each simulator was also probed by comparing the pumping characteristics of commercially available high vacuum systems. In addition, the degree of tolerances on VacCAD was also investigated through pumping down analysis considering outgassing effect due to chamber material variations. The higher effectiveness and expediency of VacCAD than VacSim^(Multi) has been presented, and it was expected that the utilization of VacCAD in vacuum applications to be increased.

• International journal of advanced smart convergence
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• v.5 no.2
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• pp.1-7
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• 2016

Recently, with the development of advanced thin film devices comes the need for constant high quality vacuum as the deposition pressure is more demanding. It is for this reason our research seeks to understand how the variable design factors are employed in such vacuum systems. In this study, the effects of design factor applications on the vacuum characteristics were simulated to obtain the optimum design modeling of variable models on an ultra high vacuum system. The commercial vacuum system simulator, $VacSim^{(multi)}$, was used in our investigation. The reliability of the employed simulator was verified by the simulation of the commercially available models of ultra high vacuum system. Simulated vacuum characteristics of the proposed modeling aligned with the observed experimental behavior of real systems. Simulated behaviors showed the optimum design models for the ideal conditions to achieve optimal pressure, pumping speed, and compression ratio in these systems.

• Journal of the Korean Vacuum Society
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• v.19 no.4
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• pp.265-274
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• 2010

The excellent performance and stability of dry-vacuum-pump is essential to create and maintain high quality vacuum condition in semiconductor and display process. The development of dry-vacuum-pump needs systematic consideration for target application as well as delicate mechanical issues. Here, we introduce a development procedures of dry-vacuum-pump for semiconductor-process-class.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.6
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• pp.449-457
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• 2011

Effect of pump combinations on the vacuum characteristics of vacuum system was simulated for optimum design of system. In this investigation, the feasibility of modelling mechanism for VacSimMulti simulator was proposed. Simulation results of various pumping combinations showed the possibilities and reliabilities of simulation for the performance of vacuum system in specific semiconductor processing. Simulation of roughing pump presented the expected pumping behaviors based on commercial specifications of employed pumps. Application of booster pump exhibited the high pumping efficiency for middle vacuum range. Combinations of optimum backing pump for diffusion and turbo vacuum system were obtained. And, the predictable characteristics of process application of both simulated systems were also acquired.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.110-110
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• 2000

Cantilever-shaped lateral field emitters were fabricated and their electrical characteristics were tested. As shown in Fig.1, poly-silicon cantilevers were fabricated by the surface micromachining and they were used to the vacuum magnetic field sensors. The tunneling devices were vacuum sealed with the tubeless packaging method, as shown in Fig.2 and Fig.3. The soda-lime glasses were used for better encapsulation, so the sputtered silicon and the glass layers on the soda-lime glasses were bonded together at 1x10$^{-6}$ Torr. The getter was activated after the vacuum sealing fur the stable emissions. The devices were tested outside of the vacuum chamber. Through vacuum packaging, the tunneling sensors can be utilized. Fig.4 shows that the sensor operates with the switching of the magnetic field. When the magnetic field was applied to the device, the anode currents were varied by the Lorentz force. The difference of anode currents can be varied with the strength of the applied magnetic field.

• Proceedings of the Korean Vacuum Society Conference
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• 1993.02a
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• pp.27-28
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• 1993

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.53-53
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• 2008