Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2000.04a
- /
- Pages.110-110
- /
- 2000
Vacuum Packaging and Operating Properties of Micro-Tunneling Sensors
- Park, H.W. (Electronic Materials and Devices Research Center, KIST) ;
- Lee, D.J. (Electronic Materials and Devices Research Center, KIST) ;
- Son, Y. B. (Electronic Materials and Devices Research Center, KIST) ;
- Park, J.H. (Dept. of Electroncis Engineering, Korea University) ;
- Oh, M. H. (Electronic Materials and Devices Research Center, KIST) ;
- Ju, B. K. (Electronic Materials and Devices Research Center, KIST)
- Published : 2000.04.01
Abstract
Cantilever-shaped lateral field emitters were fabricated and their electrical characteristics were tested. As shown in Fig.1, poly-silicon cantilevers were fabricated by the surface micromachining and they were used to the vacuum magnetic field sensors. The tunneling devices were vacuum sealed with the tubeless packaging method, as shown in Fig.2 and Fig.3. The soda-lime glasses were used for better encapsulation, so the sputtered silicon and the glass layers on the soda-lime glasses were bonded together at 1x10
Keywords