• 한국태양에너지학회 논문집
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• 제34권2호
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• pp.44-52
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• 2014

The main purpose of this paper is to develop the new BIPV module equipped with vacuum glass. Beacuse BIPV module has a function of architectural materials, thermal and PV performance should be simultaneously evaluated. To improve the thermal performance of BIPV module, this study developed BIPV module equipped with a vacuum glass. Those BIPV module was tested with a variety of encapsulants. The results are as follows. When a vacuum glass is laminated with EVA or PVB, it was broken. The reason seems to be bending by unbalance of heat expansion with center and edge of vacuum glass. In case of lamination with resin, there is no breakage and no bending of vacuum glass. Because production was conducted in low pressure & low temperature conditions. And it was also found that vacuum glass does not interfere with the UV curing process.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권1호
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• pp.37-40
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• 2001

New package process for PDP was proposed based on the glass-to-glass vacuum-electrostatic bonding process and tubeless packaging concept derived from the previous study. Hermeticity and operating performance of PDP test panel through the seal-off process application and the possibility for practical use might be high if the process simplicity and productivity-related effort was sequentially carried out.

• 한국태양에너지학회 논문집
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• 제35권1호
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• pp.61-68
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• 2015

The advanced counties effort to the supplement of the zero energy buildings for the global building energy saving. In the middle of the development of passive technology, the government has to effort to the energy saving of buildings by enhanced performance of the window thermal insulation. By the method of enhanced performance of window thermal insulation, the use of vacuum double glazing saves the energy consumption in building. This glazing has low U-value(heat transmission coefficient) than normal double glazing. The vacuum glazing enhanced thermal insulation performance by vacuum space of between the glass and glass. For this vacuum glazing, pillar maintain the space between glass and glass. But this structure cause the raising the heat transmission coefficient in pillar approaching glass. This study confirmed the U-value by the test method of thermal resistance for windows and doors. Also this study confirmed the variation of heat transmission coefficient by the structure of vacuum glazing. And this study measured the surface temperature of the vacuum glazing about pillar approaching glass and vacuum space in cool chamber and hot box. That result, this study confirmed U-value of $0.422W/m^2{\cdot}K$ of vacuum glazing. Also this study confirmed U-value of $0.300{\sim}0.422W/m^2{\cdot}K$ by various the structure of vacuum glazing. And this study confirmed the heat flow in pillar approaching glass.

• 조명전기설비학회논문지
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• 제23권5호
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• pp.29-35
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• 2009

FED는 잠재적인 평판기술에 따라 현재 연구되고 있다. 이 논문의 제안은 FED 핵심적인 개발을 위한 진공 패키징 기술에 대한 연구결과를 보여준다. FED 진공 패키징을 위해서는 유리/유리 접합, 진공배기, 게터기술, 그리고 시뮬레이션, 진공패키징 기술을 연구하였다. 유리/유리 접합은 프릿 글래스를 사용하므로 형태에 따르고, 내부 압력은 $2{\times}10^{-5}$[Torr]이며 패널로서 완성을 보여준다. 게터의 결과에 따라 그것은 압력의 증가는 박막 게터에 의해 불순기체가 줄어드는 것을 보여주었다.

• 센서학회지
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• 제29권5호
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• pp.354-359
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• 2020

The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10^-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.371-372
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• 2008

In this paper, we experimentally investigated discharge phenomena inside vacuum interrupter at 1 to 20 Torr to simulate the vacuum leakage. We used glass type of vacuum interrupter where the internal pressure and the type of gasses can be varied according to requirement. The experiment is conducted under ac applied voltage and the experimental circuit is constructed to simulate the actual circuit used in cubical type insulated switchgear. We used two types of gases such as air and $SF_6$. The use of glass type vacuum interrupter allowed us to measure discharges occurring in vacuum interrupter optically. We measured and discussed the discharge occurring in both gases with a current transformer and ICCD camera. We also revealed that electromagnetic wave spectra emitted by the discharge have same frequency range for both gasses.

• 대한기계학회논문집B
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• 제33권11호
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• pp.886-893
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• 2009

To develop glass panel vacuum lift system for the post process in module line of FPD(Flat panel display) such as LCD and PDP, new vacuum adsorption parts of this system are proposed. These parts are composed of variable geometry configurations utilizing ceramic porous medium for variable size of glass panels. In order to design this device, detail understanding of flow phenomena in the flow path of vacuum adsorption system is essential. Thus, CFD analysis and designs are performed for several configurations in terms of pressure drop and balancing force at the adsorption side. From the result, new configuration is recommended for optimum design and manufacturing purpose.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.103-106
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• 1999

In this paper, we suggest the FED packaging technology that have 4mm thickness, using sodalime glass-to-sodalime glass electrostatic bonding. It based on conventional silicon-glass bonding. The silicon film was deposited an around the exhausting hole on FED backside panel. And then, the silicon film of panel was successfully bonded with capping(bare) glass in vacuum environment and the FED panel was vacuum-sealed. In this method, we could achieve more 153 times increased conductance and 200 times increased vacuum efficiency than conventional tube packaging method. The vacuum level in panel, by SRG test, was maintained about low 10$_{-4}$ Torr during above two months And, the light emission was observed to 0.7-inch tubeless packaged FED. Then anode current was 34 $\mu$ A. Emission stability was constantly measured for 10 days.

• 설비공학논문집
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• 제25권11호
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• pp.573-577
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• 2013

An external window directly affects the energy performance of its building. In modern well-insulated buildings, U-values for walls of 0.36 $W/m^2K$ or even lower can be realized. In such buildings, glazing with typical U-value of 2.1 $W/m^2K$ or higher creates thermal weak spots on the facade. The performance of the existing triple glass window has been limited to energy savings and condensation prevention. In this study, the performance of condensation prevention of a vacuum multi-layer glass was analyzed. The final conclusion through mock-up experiments is as follows. The surface temperature of the vacuum multi-layer glass was $2^{\circ}C$ higher, and the temperature difference ratio (TDR) was 0.07 lower, than the corresponding values of the triple glass.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.7-12
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• 2000

유리 프릿과 유리 튜브를 사용하지 않고 FED, VFD와 PDP를 봉입할 수 있는 기반 기술로서, 진공 내에서 두 장의 sodalite유리 기판들을 정전 열 접합하는 공정을 연구하였으며, 대기 중에서 정전 열 접합한 기판 쌍들과 비교하여 접합 특성을 비교.분석하였다. 진공 분위기 내에서 비정질 실리콘 interlayer를 이용하여 접합된 유리 기판 쌍의 경우, 대기압의 경우와 비교할 때 동일한 접합 온도와 전압에서 접합 강도가 상대적으로 낮은 것으로 측정되었으며, 산소 분위기의 경우 접합 강도가 증가하였음을 확인하였다. XPS와 SIMS를 통한 비정질 실리콘 표면 및 유리기판 표면의 조성 변화 분석으로부터, 진공내에서 산소가 부족함으로써 정전 열 접합 과정에서 부가적으로 수반되는 실리콘 산화막이 불완전하게 형성된 것으로 해석 할 수 있다.