• Progress in Superconductivity and Cryogenics
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• v.9 no.1
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• pp.1-4
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• 2007

The total Fluorine content in the precursor solution for MOD processing of YBCO coated conductors can be significantly reduced by synthesizing precursor solution with F-free Y & Cu precursor and Barium trifluoroacetate(TFA). It was shown that crack-free and uniform precursor films were formed after calcinations in humidified oxygen atmosphere. Less than 2 hours are required to finish the calcinations process and XRD measurement shows that $BaF_2,\;CuO,\;Y_2O_3$ are major constituent of calcined precursor films. Film thickness after calcinations was improved to be 2.8um by applying slot-die coating method. In particular, addition of Samarium shows critical current of $I_c=273A/cm-w(J_c=3.8MA/cm^2)$. It is shown that uniform and fast processing route to YBCO coated conductor with high Ic can be provided by employing F-free Y & Cu precursor solution in MOD process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.26-35
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• 2024

Aluminum-induced crystallization (AIC) as a route to reduce the fabrication cost and to obtain polycrystalline Si (p-Si) thin-film of large grain size is a promising alternative of single-crystalline (s-Si) substrate or p-Si thin-film obtained by conventional methods such as solid phase crystallization (SPC) and laser-induced crystallization (LIC). As the AIC process occurs at the interface between a-Si and Al thin-films, there are various process and interface parameters. Also, it directly means that there is a certain parametric window to obtain p-Si of large grain size having uniform crystal orientation. In this article, we investigate the effect of the various process and interface parameters to obtain p-Si of large grain size and uniform crystal orientation from the literature review. We also suggest the potential use of the p-Si as a virtual substrate for the growth of various compound semiconductors in a form of low-dimension as well as thin-film as a way for their monolithic integration on Si.

• Textile Coloration and Finishing
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• v.30 no.3
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• pp.168-179
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• 2018

The modified surface of specialty carbon black(SCB) is one of the main technical factors for producing a uniform color and stable dispersion. In this work, the carboxylation or sulfonation process of SCB was used to improve the dispersive properties of hydrophilic solvents such as 1,6-hexanediol and propylene glycol monomethyl ether acetate(PGMEA). The results showed that the color strength of SCB DC2500G changed little with a range of 0.128~0.941(${\Delta}E$) compared to other SCB DC2500G material. In contrast, in the case of SCB EG410, there was a uniform color value with a range of 0.144~0.252(${\Delta}E$). Also, in our experiments, a modified SCB was confirmed by printing ink material as a melt coating paper. It may be possible that the SCB EG410 material can be advantageous as a gravure ink product. Finally, the modified SCB obtained from this research will have a large impact on the industry as a potential material for toners, paint, rubber, fillers, and other carbon black additives.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.180-183
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• 1997

The forming process of metal matrix composites by the die casting and squeeze casting process are limited in size and dimension in term of final parts without machining. The thixoforming process for metal matrix composites has numerous advantages compared to die casting, squeeze casting and compocasting. The characteristics of thixoforming process can decrease the liquid segregation because of he improvement in fluidity in a globular microstructure state and utilizes flow without air entrapment. Therefore, in order to obtain the sound parts of metal matrix composites by using thixoforming process which as co-existing solidus-liquidus pahse, it si very important to obtain reheating condition. However, for he thixoforming process, the billet with the desired volume fraction must be heated to obtain a uniform temperature distribution over the entire cross-sectional areas. To obtain the reheating conditions of composites, the particulate reinforced metal matrix composites for thixoforming were fabricated by combined stirring process which is simultaneously performed with electro-magnetic stirring process which is simultaneously performed with electro-magnetic stirring and mechanical stirring process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.3
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• pp.42-50
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• 2020

This study explores the effects of repair width on the deposition characteristics and mechanical properties of stainless steel samples repaired using direct energy deposition (DED). In the DED repair process, defects such as pores and cracks can occur at the interface between the substrate and deposited material. In this study, we changed the width of the pre-machined zone for repair in order to prevent cracks from occurring at the inclined surface. As a result of the experiment, cracks of 10-40 ㎛ in length were formed along the inclined slope regardless of the repair width. Yield and tensile strength decreased slightly as the repair width increased, but the total and uniform elongation increased. This is due to the orientation of the crack. For specimens with a repair width of 20 mm, yield and tensile strength were 883 MPa and 1135 MPa, respectively. Total and uniform elongations were 14.3% and 8.2%, respectively. During observation of the fracture specimens, we noted that the fracture of the specimen with an 8 mm repair width occurred along the slope, whereas specimens with 14 mm and 20 mm repair depths fractured at the middle of the repaired region. In conclusion, we found that tensile properties were dependent upon the repair width and the inclination of the crack occurred at the interface.

• Journal of IKEEE
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• v.25 no.1
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• pp.64-68
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• 2021

We demonstrate an effect of annealing temperature on imprinting process of BiLaO thin film for liquid crystal alignment. BiLaO prepared sol-gel process was deposited by spin coating on a glass substrate, and then transferred to a pre-fabricated aligned pattern which is fabricated on a silicon wafer by laser interference lithography. Thin film was annealed at different temperature of 100, 150, 200, and 250 ℃. From the polarized optical microscopy analysis, the liquid crystal orientation was not uniform at the annealing temperature of 200 ℃ or lower and the uniform liquid crystal alignment characteristics were confirmed at the annealing temperature of 250 ℃. From atomic force microscopy, the pattern was not transferred at a temperature of 200 ℃ or lower. In contrast, the pattern was transferred at 250 ℃. Anisotropy of the thin film was obtained by the alignment pattern transferred at a temperature of 250 ℃, and the liquid crystal molecules could be evenly oriented on the thin film. Therefore, it was confirmed that the liquid crystal alignment process by the imprinting process of the BiLaO oxide film was affected by the annealing temperature.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.10 no.5
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• pp.58-64
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• 2011

In this paper, research on the manufacturing technology of hexagonal structure core is investigated. Also the optimal forming process of the honeycomb core is developed and the rolling process is analyzed using finite element code, $DEFORM^{TM}$-3D. The standard honeycomb has a uniform hexagonal structure defined by the material, cell size, cell wall thickness and bulk density. Honeycomb core products can be made from any thin, flat material. The most common cell configuration is the hexagon but there are many other shapes for special applications. Because of the precision shape and the thin thickness, the honeycomb core is not easy to manufacture in the metal forming process. Through this study it was confirmed that after the rolling process, the section of honeycomb close to the standard shape can be obtained. This result is reflected to the manufacturing process design for the honeycomb core.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• Journal of Korea Water Resources Association
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• v.37 no.5
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• pp.387-395
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• 2004

A computer model was proposed to simulate channel changes and bed material sorting of the meandering channels with different grain size in time and space simultaneously. The bed at the outside of the meandering channel with mixed sediments was scoured deeply and composed of coarser materials, and at the inside was aggradated and composed of finer materials. The sorting process started at the upstream inflection point and was finished at the downstream inflection point. At the natural with complicated boundaries and non-uniform grain sizes, the bed near the outside at the bend and narrow width was scoured deeper with coarse materials than in the channel with uniform grain sizes. The point bars showed lip at the inside near the bend and the bed materials were finer The bed at the outside near the bend and in the narrow width was scoured deeply with the coarser materials.

• KDI Journal of Economic Policy
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• v.42 no.1
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• pp.57-95
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• 2020

As a case study of an ex-post evaluation of regulations, in this paper I evaluate the 'uniform settlement rate requirement', a regulation that was introduced in 1986 and that was applied to the international telephone market in the U.S. for more than 20 years. In a bilateral market between the U.S. and a foreign country, each U.S. firm and its foreign partner jointly provide international telephone service in both directions, compensating each other for terminating incoming calls to their respective countries. The per-minute compensation amount for providing the termination service, referred to as the settlement rate, is determined by a bargaining process involving the two firms. In principle, each U.S. firm could have a different settlement rate for the same foreign country. In 1986, however, the Federal Communications Commission introduced the Uniform Settlement Rate Requirement (USRR), which required all U.S. firms to pay the same settlement rate to a given foreign country. The USRR significantly affected the relative bargaining positions of the U.S. and foreign firms, thereby changing negotiated settlement rates. This paper identifies two main routes through which the settlement rates are changed by the implementation of the USRR: the Competition-Induced-Incentive Effect and the Most-Favored-Nation Effect. I then empirically evaluate the USRR by estimating a bargaining model and conducting counterfactual experiments aimed at measuring the size of the two effects of the USRR. The experiments show remarkably large impacts due to the USRR. Requiring a uniform settlement rate, for instance, results in an average 32.2 percent increase in the negotiated settlement rates and an overall 13.7 percent ($3.43 billion) decrease in the total surplus in the U.S. These results provide very strong evidence against the implementation of the USRR in the 1990s and early 2000s.