• Journal of Information Display
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• v.6 no.4
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• pp.45-48
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• 2005

By applying a critical field treatment instead of the conventional surface treatments such as soft rubber roller, ion beam irradiation, adhesive taping, and laser irradiation, electron emission properties of screen-printed carbon nanotubes (CNTs) were enhanced and investigated based on the emission current-voltage characteristics through scanning electron microscopy. After nanotube emitters were activated at the applied electric-field of 2.5 V/um, the electron emission current density with good uniform emission sites reached the value of 2.13 mA/$cm^2$ , which is 400 times higher than that of the untreated sample, and the turn-on voltage decreased markedly from 700 to 460 V. In addition, enhancement of the alignment of CNTs to the vertical direction was observed.

• Journal of Surface Science and Engineering
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• v.29 no.5
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• pp.430-436
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• 1996

We have grown superconducting thin films on various substrates using a pulsed laser deposition (PLD) method. $YBa_2Cu_3O_7-\delta$ (YBCO) superconducting thin films with the superconducting transition temperature ($T_{c. offset}$) of 87K were grown on Si substrates using yittria-stabilized zirconia (YSZ) and $CeO_2$ double buffer layers. We have developed a large area pulsed laser deposition system. The system was designed to deposit up to 6 different materials on a large area substrate up to 7.5cm in diameter without breaking a vacuum. The preliminary runs of the deposition of YBCO superconducting thin films on $SrTiO_3$ substrate using this system showed a very uniform thickness profile over the entire substrate holder area. $T_{c}$ of the deposited YBCO thin film, however, was scattered depending on the position and the highest value was 85K.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.713-717
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• 2004

In this study, the etched trench properties including cross-sectional profile, surface roughness, and crystalline defects were investigated depending on the various silicon etching and additive gases, For the case of HBr$He-O_2SiF_4$ trench etching gas mixtures, the excellent trench profile and minimum defects in the silicon trench were achieved. Due to the residual oxide film grown by the additive oxygen gas, which acts as a protective layer during trench etching, the undercut and defects generation in the trench were suppressed. To improve the electrical characteristics of trench gate, the hydrogen annealing process after trench etching was also adopted. Through the hydrogen annealing, the trench corners might be rounded by the silicon atomic migration at the trench corners having high potential. The rounded trench corner can afford to reduce the gate electric field and grow a uniform gate oxide. As a result, dielectric strength and TDDB characteristics of the hydrogen annealed trench gate oxide were remarkably increased compared to the non-hydrogen annealed one.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.390-396
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• 2003

As the design rule of device continued to shrink, the contact resistance in small contact size became important. Although the conventional TiN/Ti structure as a ohmic layer has been widely used, we propose a new TiN/Co film structure. We characterized a contact resistance by using a chain pattern and a KELVIN pattern, and a leakage current determined by current-voltage measurements. Moreover, the microstructure of TiN/ Ti/ silicide/n$\^$+/ contact was investigated by a cross-sectional transmission electron microscope (TEM). The contact resistance by the Co ohmic layer showed the decrease of 26 % compared to that of a Ti ohmic layer in the chain resistance, and 50 ％ in KELYIN resistance, respectively. A Co ohmic layer shows enough ohmic behaviors comparable to the Ti ohmic layer, while higher leakage currents in wide area pattern than Ti ohmic layer. We confirmed that an uniform silicide thickness and a good interface roughness were able to be achieved in a CoSi$_2$ Process formed on a n$\^$+/ silicon junction from TEM images.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.8
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• pp.491-496
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• 2014

The resistive switching characteristics of resistive random access memory (ReRAM) based on amorphous $Ge_{0.5}Se_{0.5}$ thin films have been demonstrated by using Ti/Ag nanocrystals/$Ge_{0.5}Se_{0.5}$/Pt structure. Ag nanocrystals (Ag NCs) were spread on the amorphous $Ge_{0.5}Se_{0.5}$ thin film and they played the role of metal ions source. As a result, comparing the conventional Ag/$Ge_{0.5}Se_{0.5}$/Pt structure, this Ti/Ag NCs/$Ge_{0.5}Se_{0.5}$/Pt ReRAM device exhibits the highly uniform bipolar resistive switching (BRS) characteristics, such as the operating voltages, and the resistance values. At the same time, a stable DC endurance(> 100 cycles), and the excellent data retention (> $10^4$ sec) properties were found from the Ti/Ag NCs/$Ge_{0.5}Se_{0.5}$/Pt structured ReRAM device.

• Journal of Surface Science and Engineering
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• v.49 no.3
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• pp.265-273
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• 2016

The effects of surface modification by nitric acid on the pre-treatment of electroless copper plating were investigated. Copper was electroless-plated on the nitric acid treated graphite activated by a two-step pre-treatment process (sensitization + activation). The chemical state and relative quantities of the various surface species were determined by X-ray photoelectron spectroscopy (XPS) after nitric acid modification or pre-treatment. The acid treatment increased the surface roughness of the graphite due to deep and fine pores and introduced the oxygen-containing functional groups (-COOH and O-C=O) on the surface of graphite. In the pre-treatment step, the high roughness and many functional groups on the nitric acid treated graphite promoted the adsorption of Sn and Pd ions, leading to the uniform adsorption of catalyst ($Pd^0$) for Cu deposition. In the early stage of electroless plating, a lot of tiny copper particles were formed on the whole surface of acid treated graphite and then homogeneous copper film with low variation in thickness was formed after 30 min.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.396-396
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• 2007

Highly ordered pore structures as a template for formation of seeds have been prepared by the self-organization process of aluminum oxidation. The a-Si films were deposited on the anodic alumina films and crystallized by laser irradiation. It was found that un-melted part of fine poly-Si grain formed by explosive crystallization (EX) lead super lateral growth(SLG) and occluded with neighbor grains. The crystallized grains along the distribution of seeds were obtained. This results show a great potential for use in novel crystallization for decently uniform polycrystalline Si thin film transistors (poly-Si TFTs).

• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• Journal of Surface Science and Engineering
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• v.54 no.4
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• pp.200-208
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• 2021

This paper investigated generation behavior of micro-arcs and growth behavior of PEO films on the AA7050 disc specimen in 0.1 M NaAlO₂ solution under the application of 1200 Hz anodic pulse current. Morphologies, thickness and surface roughness of PEO films were examined at the edge part and central part separately. Micro-arcs were generated first at the edge part and then moved towards the central part with PEO treatment time, indicating lateral growth of PEO films. The lateral growth resulted in uniform PEO thickness of about 5 ㎛ and surface roughness of about 0.5 ㎛. Moving of the arcs from the edge towards the central part appeared only one time and large size arcs were generated at the edge before completing the central part with small size micro-arcs. This suggests that vertical growth starts before completing the lateral growth. Large size arcs generated at the edge resulted in the formation of relatively large size pores within the PEO films on the AA7050 disc specimen.

• Corrosion Science and Technology
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• v.20 no.6
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• pp.347-360
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• 2021

Currently, the demand for eco-friendly energy sources is high, which has prompted research on polymer electrolyte membrane fuel cells. Both aluminum alloys and nickel alloys, which are commonly considered as materials of bipolar plates in fuel cells, oxide layers formed on the metal surface have excellent corrosion resistance. In this research, the electrochemical characteristics of 6061-T6 aluminum alloy and Inconel 600 were investigated with chloride concentrations in an acid environment that simulated the cathode condition of the PEMFC. After potentiodynamic polarization experiments, Tafel analysis and surface analysis were performed. Inconel 600 presented remarkably good corrosion resistance under all test conditions. The corrosion current density of 6061-T6 aluminum alloy was significantly higher than that of Inconel 600 under all test conditions. Also, 6061-T6 aluminum alloy and Inconel 600 presented uniform corrosion and intergranular corrosion, respectively. The Ni, Cr, and Fe, which are the main chemical compositions of Inconel 600, are higher than Al in the electromotive force series. And a double oxide film of NiO-Cr₂O₃, which is more stable than Al₂O₃, is formed. Thus, the corrosion resistance of Inconel 600 is better.