• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.211-212
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• 2011

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.448-451
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• 2005

An aspheric mirror, which requires less than $\lambda/2\;(\lambda=632.8nm)$ of form error for the $\phi$ 200mm reference curved surface, has been manufactured with an ultra-precision turning machine. We have known through several tests that the deformation patterns of the reflecting surface is related with bolting positions. In this paper the effect of main factors on deformation of a reflector is studied with a FE code. The considered factors are angular velocity, natural frequencies for a mirror, temperature increment during machining. The obtained test results are similar to the deformation shape due to the assumed temperature increment.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.897-900
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• 2002

The collimation mirror will be used for thermal vacuum testing of spacecraft. The reflection mirror system to generate parallel beam inside the thermal vacuum chamber. A 600mm diameter aspheric Collimation mirror was fabricated by ultra-precision single point diamond turning (SPDT). Aluminum alloy for mirror substrates is known to be easily machining, but not polishable due to its ductility. Aspheric large collimation reflector without a conventional polishing process, the surface roughness of 10nmRa, and the from error of $\lambda/2 ~\lambda/4(\lambda$ =632.8 nm) for reference curved surface 600 mm has been required. The purpose of this research is to find the optimum machining conditions for reflector cutting of A16061-T651 and apply the SPDT technique to the manufacturing of ultra precision optical components of metal aspheric reflector.

• 한국정밀공학회지
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• 제15권2호
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• pp.53-60
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• 1998

In this study, it is experimented to find factors effecting surface roughness using the system of experiments. in the mirror surface finishing system. (1) The film feed and oscillation frequency in $40{\mu}m$ abrasive film, grinding speed in $30{\mu}m$, and machining time in $15{\mu}m$15 are the main factors effecting the surface roughness. (2) Applying the optimal finishing condition to $40{\mu}m$, $30{\mu}m$, $15{\mu}m$ abrasive finishing film in sequence, it is possible to obtian about Ra 10 nm surface roughness on SM45C workpiece. (3) Application of the system of experments to the micro abrasive grain film finishing was very effective method in the extraction of main factor and optimal condition.

• 한국정밀공학회지
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• 제28권12호
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• pp.1366-1371
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• 2011

In ultra precision machining, it is necessary to adjust the horizontality and reference position of a workpiece in a noncontact manner. For this, a simple process by measuring impedance between a tool tip and a workpiece which are connected to impedance analyzer is proposed. As the distance between the tool and the workpiece gets closer, the reduction rate of impedance becomes higher over all frequency ranges. By setting threshold value of impedance reduction rate at specific frequencies through preliminary experiments, the distance between the tool and the workpiece can be predicted and it directly enables us to horizontalize the workpiece and to set the tool to the desired reference position.

• 한국분말재료학회지
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• 제20권4호
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• pp.308-312
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• 2013

In this paper, we describe experiment results using a vibration assisted hybrid femtosecond laser (${\lambda}$:795 nm) ultra-precision machining system. The hybrid system we have developed is possible that optical focal point of the femtosecond laser constantly and frequently within the range of PZT(piezoactuator) vibrator working distance. Using the hybrid system, We have experimented on brass and studied about differences of result of hole aspect ratio compare to general experiment setup of femtosecond laser system. Aspect ratio of a micro hole on brass is increased as 54% with 100 Hz vibration frequency and surface roughness of the side wall also improved compare to non-vibration.

• 한국기계가공학회지
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• 제11권1호
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

• 한국기계가공학회지
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• 제20권7호
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• pp.15-24
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• 2021

In this paper, to analyze the types of surface morphology error according to factors that cause machining error, the experiments were conducted in the ultra-precision diamond machine using a diamond tool. The factors causing machining error were classified into the pressure variation of compressed air, external shock, tool errors, machining conditions (rotational speed and feed rate), tool wear, and vibration. The pressure variation of compressed air causes a form accuracy error with waviness. An external shock causes a ring-shaped surface defect. The installed diamond tool for machining often has height error, feed-direction position error, and radius size error. The types of form accuracy error according to the tool's errors were analyzed by CAD simulation. The surface roughness is dependent on the tool radius, rotational speed, and feed rate. It was confirmed that the surface roughness was significantly affected by tool wear and vibration, and the surface roughness of Rz 0.0105 ㎛ was achieved.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.901-904
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• 2002

The cutting thickness of ultra-precision machining is generally very small, only a few micrometer or even down to the order of a flew manometer. In such case, a basic understanding of the mechanism on the micro-machining process is necessary to produce a high quality surface. When machining at very small depths of cut, metal flow near a rounded tool edge become important. In this paper a finite element analysis is presented to calculate the stagnation point on the tool edge or critical depth of cut below which no cutting occurs. From the simulation, the effects of the cutting speed on the critical depths of cut were calculated and discussed. Also the transition of the stagnation point according to the increase of the depths of cut was observed.

• 한국정밀공학회지
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• 제26권2호
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• pp.35-44
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• 2009

Long stroke Fast Tool Servo (LFTS) with maximum stroke of $432{\mu}m$ is designed, manufactured and tested for fabrication of optical free-form surfaces. The large amount of stroke in LFTS has been realized by utilizing the hinge and lever mechanisms which enable the displacement amplification ratio of 4.3. In this mechanism the peculiar shape was devised for maximizing the displacement of end tip in LFTS and special mechanical spring has been mounted to provide the sufficient preload to the piezoelectric actuator. Also, its longitudinal motion of tool tip can be measured by capacitive type displacement sensor and closed-loop controlled to overcome the nonlinear hysteresis. In order to verify the static and dynamic characteristics of designed LFTS, several features including step response, frequency response and cut-off frequency in closed-loop mode were experimentally examined. Also, basic machining result shows that the proposed LFTS is capable of generating the optical free-form surface as an additional axis in diamond turning machine.