• Design & Manufacturing
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• v.2 no.1
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• pp.33-38
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• 2008

As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra precision aspherical surface lens increases higher. Precision turning with single-diamond tools has a long history of development for fabrication of optical quality surfaces since the advent of aerostatic rotary spindles and precise linear motion guide ways. To enhance the precision and productivity of ultra precision aspherical surface micro lens, the following specification of ultra precision grinding system is required: the highest rotational speed of the grinder is 100,000rpm and its turning accuracy is $0.1{\mu}m$, positioning accuracy is $0.1{\mu}m$. The development process of the grinding system for the ultra precision aspherical surface micro lens for optoelectronics industry is introduced. In the work reported in this paper, an intelligent grinding system for ultra precision aspherical surface machining was designed by considering the factors affecting the surface roughness and profiles accuracy. An aerostatic form was adopted to build the spindle of the workpiece and the spindle of grinder and ultra precision LM guide way was adopted in this system. And this paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. It results was that a form accuracy of $0.6{\mu}m$ P-V and a surface roughness of $0.006{\mu}m$ Rmax.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.2
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• pp.44-49
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• 2008

This paper describes the problem of ultraprecision positioning with a ball screw mechanism in the microdynamic range, along with its solution. We compared the characteristics of two ball screw mechanisms with different table masses. The experimental results showed that the vibration resulting from the low stiffness of the ball screw degraded the positioning performance in the microdynamic range for the heavyweight mechanism. The proposed nominal characteristic trajectory following (NCTF) controller was designed for ultra precision positioning of the ball screw mechanism. The basic NCTF control system achieved ultra precision positioning performance with the lightweight mechanism, but not with the heavyweight mechanism. A conditional notch filter was added to the NCTF controller to overcome this problem. Despite the differences in payload and friction, both mechanisms then showed similar positioning performance, demonstrating the high robustness and effectiveness of the improved NCTF controller with the conditional notch filter. The experimental results demonstrated that the improved NCTF control system with the conditional notch filter achieved ultra precision positioning with a positioning accuracy of better than 10 nm, independent of the reference step input height.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.437-441
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• 1995

In this paper, the ultra precision positioning system for servo motor and piezo actuator using dual servo loop control has been developed. For positioning system having long distance with ultra precision, the combination of global stage and micro stage is required. Servo moter and ball screw are used as a master stage and piezo acuator as a fine stage. By using this system, an positional precision witin .+-. 30nm has been achieved at dual servo loop control. When using micro stage, an positional precision within .+-. 10nm has been achieved. This result can be applied to develop semiconductor equipment such as wafer stepper.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.154-163
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• 1999

In this paper, an ultra precision positioning system has been developed using dual servo loop control. For positioning system having long distance with ultra precision , the combination of global stage and micro stage was required. A servo motor based ball screw is used as a global stage and the piezo actuator as a micro stage. For the improvement of positional precision, the digital Chebyshev filter is implemented in the developed to dual servo system. Therefore, the positional repeatability has been achieved within ${\pm}$ 10 mm, and this technique can be applied to develop precision semiconductor equipments such as lithography steppers and probers.

• Journal of the Optical Society of Korea
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• v.20 no.1
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• pp.174-179
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• 2016

In this paper, a novel full-aperture reflective null measuring method is proposed to detect the transmission wavefront of a conformal dome surface. An aspheric compensator is designed and placed behind the dome to reflect the aspheric testing wave back to the same path. To ensure the feasibility of this method, tolerance analysis is conducted, and guidance to assembly is given accordingly. The accuracy of this method is verified to be λ/30 (λ =3.39 μm) by Monte Carlo algorithm. In addition, the influence of different error factors, including the thickness error and decenter error of the dome, on the testing wavefront is analyzed. Simulation and experiment indicate that this method is practical and simple, and can measure the conformal domes precisely and comprehensively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.213-214
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.235-236
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.1-2
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.211-212
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• 2011

• Design & Manufacturing
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• v.14 no.3
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• pp.63-70
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• 2020

As the consumer market in the VR(virtual reality) and the head-up display industry grows, the demand for 5-axis machines and grooving machines using on a ultra-precision machining increasing. In this paper, ultra-precision diamond tools satisfying the cutting edge width of 500 nm were developed through the process research of a focused ion beam. The material used in the experiment was a single-crystal diamond tool (SCD), and the equipment for machining the SCD used a focused ion beam. In order to reduce the influence of the Gaussian beam emitted from the focused ion beam, the lift-off process technology used in the semiconductor process was used. 2.9 ㎛ of Pt was coated on the surface of the diamond tool. The sub-micron tool with a cutting edge of 492.19 nm was manufactured through focused ion beam machining technology. Toshiba ULG-100C(H3) equipment was used to process fine-pattern using the manufactured ultra-precision diamond tool. The ultra-precision machining experiment was conducted according to the machining direction, and fine burrs were generated in the pattern in the forward direction. However, no burr occurred during reverse machining. The width of the processed pattern was 480 nm and the price of the pitch was confirmed to be 1 ㎛ As a result of machining.