• Title/Summary/Keyword: UV Curable Resin

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A study on releasing high aspect ratio micro features formed with a UV curable resin (UV경화수지의 고형상비 미세패턴 이형에 관한 연구)

  • Kwon, Ki-Hwan;Yoo, Yeong-Eun;Kim, Chang-Wan;Park, Young-Woo;Je, Tae-Jin;Choi, Doo-Sun
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1833-1836
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    • 2008
  • Recently as the micro surface features become higher and diverse in their shapes, the releasing of the molded features becomes more crucial for manufacturing of the micro patterned products. The higher aspect ratio of the features or more complex shape of the features results in larger releasing force, elongation or cohesive failure of the features during the releasing. Another issue would be the uniformity of the released surface features after molding, especially for applications with large area surface. The micro patterned optical film, one of typical applications for micro surface features, consists of two layers, the thermoplastic base film and the micro formed UV resin layer. Therefore two interfaces are typically involved during the forming of this micro featured film; one is between the base film and the UV resin and another is between the resin and the pattern master. To improve the releasing of the molded surface features, the adhesive characteristic was investigated at these two interfaces. A PET film was used as a base film and two UV curable resins with different surface energy were prepared for different adhesiveness. Also the two different pattern masters were employed; one is made from brass-copper alloy and fabricated with PMMA. The adhesiveness at each interface was measured for some combinations of these base film, UV resins and the masters and the effect of this adhesiveness on the releasing was investigated.

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UV Nanoimprint Lithography using an Elementwise Patterned Stamp and Pressurized Air (Elementwise Patterned Stamp와 부가압력을 이용한 UV 나노임프린트 리소그래피)

  • Sohn H.;Jeong J.H.;Sim Y.S.;Kim K.D.;Lee E.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.672-675
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    • 2005
  • To imprint 70-nm wide line-patterns, we used a newly developed ultraviolet nanoimprint lithography (UV-NIL) process in which an elementwise patterned stamp (EPS), a large-area stamp, and pressurized air are used to imprint a wafer in a single step. For a single-step UV-NIL of a 4' wafer, we fabricated two identical $5'\times5'\times0.09'(W{\times}L{\times}H)$ quartz EPSs, except that one is with nanopatterns and the other without nanopatterns. Both of them consist of 16 small-area stamps, called elements, each of which is $10\;mm\;\times\;10\;mm$. UV-curable low-viscosity resin droplets were dispensed directly on each element of the EPSs. The volume and viscosity of each droplet are 3.7 nl and 7 cps. Droplets were dispensed in such a way that no air entrapment between elements and wafer occurs. When the droplets were fully pressed between ESP and wafer, some incompletely filled elements were observed because of the topology mismatch between EPS and wafer. To complete those incomplete fillings, pressurized air of 2 bar was applied to the bottom of the wafer for 2 min. Experimental results have shown that nanopatterns of the EPS were successfully transferred to the resin layer on the wafer.

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Fabrication and Characterization of UV-curable Conductive Transparent Film with Polyaniline Nanofibers (폴리아닐린 나노섬유를 이용한 광경화형 전도성 투명필름의 제조 및 특성)

  • Kim, Sung-Hyun;Song, Ki-Gook
    • Polymer(Korea)
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    • v.36 no.4
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    • pp.531-535
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    • 2012
  • Conductive polyaniline (PANI) nanofibers in UV-curable resin were used for a transparent conductive film. The emeraldine-salt PANI (ES-PANI) nanofibers were prepared by chemical oxidation polymerization of aniline, which could be changed into emeraldine-base PANI by dedoping. EB-PANI nanofibers as a precursor for conductive fillers were thereby transformed into re-dpoed PANI (rES-PANI) by dodecylbenzenesulfonic acid in the UV-curable resin solution. rES-PANI nanofibers have high conductivity and long-term stability in the solution without a defect of nanostructure. The resulting conductive resin solution was proved to be highly stable where no precipitation of rES-PANI fillers was observed over a period of 3 months. The transparent film was spin-casted on a poly(methyl methacrylate) sheet of thickness ca. $5{\mu}m$. A surface resistance of $6.5{\times}10^8{\Omega}/sq$ and transmittance at 550 nm of 91.1% were obtained for the film prepared with a concentration of 1.4 wt% rES-PANI nanofibers in the solution. This transformation process of rES-PANI from ES-PANI by dedoping-redoping can be an alternative method for the preparation of an antistatic protection film with controllable surface resistance and optical transparencies with the PANI concentration in UV-curable solution.

A Study on the dynamic viscoelasticity of UV curing polymer and alkyd resin composite materials (UV경화성 수지와 Alkyd수지 복합재료의 경화거동과 동적 점탄성에 관한 연구)

  • 정원식;최정병;김용욱
    • Journal of the Korean Graphic Arts Communication Society
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    • v.16 no.3
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    • pp.29-41
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    • 1998
  • The ultraviolet(UV)-curable materials wildly have been used as a ink and coating materials. A according to measure UV polymerization phase separation of acryl groups 2,3,4-functional monomer, a few experiments were performed gel fraction, dynamic viscosity of alkyd resin blend system. Dependence of photoiniator concentration and various monomer, alkyd resin content investigated structural changes of films cured by UV irradiation. Curing rate measured UV irradiation under $25^{\circ}C$, cell gap 7cm and film thickness 100${\mu}{\textrm}{m}$. In results, it was through that the viscoelastic properties of films cured with increasing the ratios of monomer/alkydresin contents are network polymer in properties such as viscoelasticity.

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Synthesis and Adhesion Properties of UV Curable Acrylic PSAs for Semiconductor Manufacturing Process (반도체 제조 공정용 UV 경화형 아크릴 점착제의 합성과 점착 특성)

  • Lee, Seon Ho;Lee, Sang Keon;Hwang, Taek Sung
    • Applied Chemistry for Engineering
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    • v.24 no.2
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    • pp.148-154
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    • 2013
  • UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

Nanoimprinting Pattern Formation Using Photo-Curable Acrylate Composites (광경화성 아크릴레이트 복합체를 이용한 나노 임프린트 패턴 형성)

  • Kim, Sung-Hyun;Park, Sun-Hee;Moon, Sung-Nam;Lee, Woo-Il;Song, Ki-Gook
    • Polymer(Korea)
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    • v.36 no.4
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    • pp.536-541
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    • 2012
  • The effects of silica content were studied on UV curing characteristics and defect formations in imprinted patterns of hundreads nanometer size for the photo-curable imprinting composites with silica particles. An increase in elasticity and a decrease in shrinkage were observed with an increase in silica content in the imprinting resin which was UV cured at room temperature. However, the patterned nano-pillars were stuck together with neighboring nano-pillars if the amount of silica is more than 7 wt%. This can be ascribed to the increased viscosity of imperfectly cured resin due to the obstruction of the photo-reaction by silica particles. Addition of silica to the imprinting resin is useful in enhancing the strength of the cured resin although it is difficult to get good imprinted patterns for the resin with more than 7 wt% of silica due to the reduction of photo-reaction conversion.

A Study on Structures and Properties of Liquid Crystal-UV Curable Resin Composite Materials (액정-UV경화 이크릴레이트 수지 복합재료의 구조와 물성에 관한 연구)

  • 김종원
    • Journal of the Korean Graphic Arts Communication Society
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    • v.18 no.1
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    • pp.59-69
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    • 2000
  • The characteristics of liquid crystal polymer composite(LCPC) films are possessed of large-area and flexible display, polarizer free, high contrast, wide angle of visual filed and high responsiveness. It is well known that the LCPC films consisting of a continuous LC phase embeded in a three-dimentional network of polymer matrix are formed by photopolymerization-induced phase separation. In this study, we have investigated the point that both liquid crystals and polymer having different properties have to coexiste as composed films. The purpose of this study has been the development of new application with liquid crystals and UV-curable monomers. In the results abtained on the miscibility of nematic liquid crystal and UV-curable resins, difunctional monomer HX-620 turned out to shows the best. From the results abtained on structures, electro-optical properties and dynamic visocoelasticity for LCPC films, the best mixing ratio of monomer to LC mixture were 3/7(photoinitiator; 4wt%) by weight, and this ratio has been provided the most thermal stability for LCPC films. In the results abtained on structure and discoloration properties of LCPC films, it has been demonstrated that consiste of a 8:2 mixture of chiral nematic liquid crystal and HX-620 has the greatest domain and it was the best discoloration.

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Induced phase separation configuration and property of UV curable resin and Alkyd resin blend material (UV경화수지와 알키드수지 복합재료의 상분리 구조와 물성)

  • ;;;;大評泰文
    • Journal of the Korean Graphic Arts Communication Society
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    • v.18 no.2
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    • pp.13-27
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    • 2000
  • The UV curing industry is one of the most wide application fields in the coating and printing inks industry. Applications extend to general coating for paper, board, wood tapes, compact discs and holograms, ink, photoresists for imaging processes and adhesives for welding and sealing in circuit boards. The UV-curing resins have advantages of quick set, space saving, clean environment and efficient use of energy. The purpose of this study has been to control of morphology structures consist of UV-curing resins and alkyd resins. Therefore, we are investigated with regard to rheology properties on the exposure to UV-curing, structures and mechanical properties for curing films.

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