• Journal of the Korean GEO-environmental Society
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• v.18 no.11
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• pp.19-26
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• 2017

When narrowly excavated in the urban area, the wall of backfill space is not only symmetrical but also asymmetrical. In this case, the horizontal stress induced by backfilling depends mostly on the wall asymmetry and the wall friction angle. Therefore, in this study, the model test in the laboratory was conducted to investigate horizontal earth pressure with depth considering various boundary conditions such as base width, wall friction, relative density of backfill, and wall angle. As the wall is smoother and wall angle is lower from the bottom, the results showed higher the horizontal stresses due to the increase of vertical stresses.

• Geotechnical Engineering
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• v.14 no.5
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• pp.89-110
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• 1998

Variations of backfill load on the metal-polyethylene composite( MPC ) pipes buried in various trenches backfill afterward were investigated in this paper. The backfill loads obtained by the finite element method( FBM ) were compared with those calculated by the well-known MarstonBpangler(M-5) theory. The reliability of the finite element analysis used in this study was examined by an inaitu best for the buried pipe. The backfill lords and deflections on the real-size pipe buried on-site were measured while increasing the backfill height. In addition, further investigations were made for the variations of the backfill loads as a function of several important parameters such as the backfill soil type, bach. height$(\leq4.0m)$, diameter of the pipe$(B.$1.0m)$, and trench width($\leq 3.0 B_c$). It is confirmed that the M-S theory predicts reasonably well the backfill loafs of the MPC of the M-S backfill coils be 0.13 and 0.15 for the SC and SM coils in the D unman soil model, respectively. The load ratio, Wu-s/WwgM for a narrow trench varies negligibly with the back(111 height but fiends to increase for a wide trench. The ratio increases with increasing diameter of the pipe for a narrow trench while decreasing for a wide trench. It is also found that the ratio generally decreases as the degree of compaction increases and BM soil exhibits larger load ratio than that of SC soil.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.153-158
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• 2002

The effects of leveler on the copper trench filling were investigated during damascene plating process. To investigate the trench filling effect with the addition of a leveler, a cross-section images of the electroplated trenches with the width of$0.37{\mu}m,\;and\;0.18{\mu}m$ were observed by field emission scanning electron microscope (FE-SEM). Polyethylene glycol(PEG), 3-mercapto-1-propanesulfonic acid and Janus Green B were used as a carrier, an accelerator and a leveler. $0.37{\mu}m$ trenches were superfilled without voids, but there was voids formation in $0.18{\mu}m$ trenches when the leveler was not added into the electrolyte. On the other hand $0.18{\mu}m$ trenches were superfilled without voids with the addition of the leveler due to the reduction growth rate of copper at protrusions and edges, which yield smooth final deposit surface. The leverer effect becomes more significant as the width of trenches becomes smaller when trenches are filed.

• Journal of the Korean Geotechnical Society
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• v.29 no.6
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• pp.5-17
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• 2013

Slug tests can be adopted to estimate hydraulic conductivity of the slurry trench wall backfill for its abilities to reflect the in-situ performance of the construction. A comprehensive three-dimensional numerical model is developed to simulate the slug test in a slurry trench wall considering the presence of bentonite cake on the interface boundaries between the wall and the surrounding soil formation. Influential factors such as wall width (i.e., proximity of wall boundary), well deviation, vertical position of well intake section, compressibility of wall backfill, etc. are taken into account in the model. A series of simulation results are examined to evaluate the bentonite cake effect in analyzing practical slug test results in the slurry trench wall. The results show that the modified line-fitting method can be used without any correction factor for the slug test in the slurry trench wall with the presence of bentonite cake. A case study is reanalyzed with the assumption of existing bentonite cake. The results are compared with the previously reported results by the approaches assuming no bentonite cake (constant-head boundary) or upper-bound solution (no-flux boundary). The case study demonstrates the bentonite cake effect and the validity of the modified line-fitting method in the estimation of the hydraulic conductivity of the slurry wall backfill.

• Journal of the Korean earth science society
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• v.43 no.1
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• pp.151-164
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• 2022

According to the records of historical and instrumental earthquakes, the southeastern part of the Korean Peninsula is considered the highest seismic activity area. Owing to recent reports of numerous Quaternary faults along the Yangsan and Ulsan fault zones, paleoseismological studies are being actively conducted in these areas. The study area is located in the central part of the Ulsan fault zone, where the largest number of active faults have been reported. Based on lineament and geomorphic analysis using LiDAR images and aerial photographs, fault-related landforms showing topographic relief were observed and a trench survey was conducted. The trench length 20 m, width 5 m, depth 5 m is located approximately 300 m away to the northeast from the previously reported Malbang fault. From the trench section, we interpreted the geometric and kinematic characteristics of the fault based on the deformed features of the Quaternary sedimentary layers. The attitude of the reverse fault, N26°W/33°NE, is similar to those of the reported faults distributed along the Ulsan fault zone. Although a single apparent displacement of approximately 40 cm has been observed, the true displacement could not be calculated due to the absence of the slickenline on the fault plane. Based on the geochronological results of the cryogenic structure proposed in a previous study, the most recent faulting event has been estimated as being earlier than the late Wurm glaciation. We interpreted the thrust fault system of the study area as an imbrication structure based on the previous studies and the fault geometry obtained in this additional trench. Although several previous investigations including many trench surveys have been conducted, they found limited success in obtaining the information on fault parameters, which could be due to complex characteristics of the reverse fault system. Additional paleoseismic studies will contribute to solving the mentioned problems and the comprehensive fault evolution.

• Geotechnical Engineering
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• v.1 no.2
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• pp.7-16
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• 1985

The behaviour of buried rigid pipe under embankment is analysed by a linear finite element program to study the influence of variation of the geometry of soil-conduit pipe system and elastic modulus of soil on the pipe response. The geometry of the system considered includes the thickness of pipe, the height of embankment, and the width arid the depth of trench. The normal contact pressure distribution around the pipe and the vertical load on the pipe are modelled by a multiple linear regression. And the vertical load on the pipe computed by Marston-Spangles Theory Is generally larger than that by finite element analysis. The settiement ratio in Marston-Spangler Theory is found to be variable for various for various of all factors mentioned above.

• Journal of architectural history
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• v.17 no.2
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• pp.47-66
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• 2008

This research was to analyze the border signal-fire which is the main facility of military protective duty for safety of sea side in chosun dynasty. The results of this research were described separately as follows. 1. Five types of site plan of signal-fire were observed, which is circle, half-circle, oval, round-rectangular. The majorities were circle type in eastern area. 2. Plan configuration of signal-fire stand which is separated with circle, rectangular type roughly was constructed with circle type generally. The height of signal-fire stand was about $2{\sim}3m$. The diameter of signal-fire stand was $8{\sim}10m$. Building base that protect ground moisture and infilteration of rainfall was found in 9 border singal-fire, the height of it was about $0.3m{\sim}2.5m$. 3. Trench was mainly circle type and average width was $3{\sim}4m$. However the depth was almost observed as 1m, originally, it was estimated it has more depth. 4. The height of protective wall remained until present was about 1m, the depth was about average 2.5m. 5. The storage of border signal-fire has rectangular dimension, several types of $1.8{\times}1.2m{\sim}5.7{\times}4.4m$, square(間) of $1{\times}1{\sim}2{\times}1$. The building material was stone and located below or near the signal-fire stand.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.5
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• pp.1-7
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• 2002

Deep sub-micron bulk CMOS circuits require gate electrode materials such as metal silicide and titanium silicide for gate oxides. Many authors have conducted research to improve the quality of the sub-micron gate oxide. However, few have reported on the electrical quality and reliability of an ultra-thin gate. In this paper, we will recommend a novel shallow trench isolation structure and a two-step TiS $i_2$ formation process to improve the corner metal oxide semiconductor field-effect transistor (MOSFET) for sub-0.1${\mu}{\textrm}{m}$ VLSI devices. Differently from using normal LOCOS technology, deep sub-micron CMOS devices using the novel shallow trench isolation (STI) technology have unique "inverse narrow-channel effects" when the channel width of the device is scaled down. The titanium silicide process has problems because fluorine contamination caused by the gate sidewall etching inhibits the silicide reaction and accelerates agglomeration. To resolve these Problems, we developed a novel two-step deposited silicide process. The key point of this process is the deposition and subsequent removal of titanium before the titanium silicide process. It was found by using focused ion beam transmission electron microscopy that the STI structure improved the narrow channel effect and reduced the junction leakage current and threshold voltage at the edge of the channel. In terms of transistor characteristics, we also obtained a low gate voltage variation and a low trap density, saturation current, some more to be large transconductance at the channel for sub-0.1${\mu}{\textrm}{m}$ VLSI devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.10
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• pp.546-550
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• 2004

Two fabrication approaches are proposed to planarize the sacrificial layer over hollow structures. One is the photoresist filling method that makes use of photolithography, thermal curing and plasma ashing. The other is the lamination method that is applying pressure and temperature to the organic film over the hollow structures. The fabrication results are compared with those of CMP process. Trenches and cavities with various dimensions have been made for the porposed process. Upon measuring the planarization levels, they are dependent on planarization methods and the geometrical size of hollow structures. The photoresist filling method is so strongly dependent on the width and depth of trenches that we have problems to use it for large dimensional trenches. To the contrary, the flatness of sacrificial layer over the trenches was found to be almost independent of trench dimensions for the lamination method. A CMP process shows the most excellent results, but the fabrication is complicated and the access to it is not so easy. It is important to choose the proper planarization method by considering the required flatness levels, materials to be planarized, and connection between the planarization step and the previous or the following process of it.