• 제목/요약/키워드: Total etching

검색결과 139건 처리시간 0.026초

Polymer MEMS 공정을 이용한 의료용 미세 부품 성형 기술 개발 (Development of micro check valve with polymer MEMS process for medical cerebrospinal fluid (CSF) shunt system)

  • 장준근;박찬영;정석;김중경;박훈재;나경환;조남선;한동철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.1051-1054
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    • 2000
  • We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2*0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5*2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

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Sinfony 간접복합수지와 비귀금속합금간의 전단결합강도와 파절양상 (Shear Bond Strength and Failure Mode between Sinfony Indirect Composite Resin and Non Precious Metal)

  • 민병록;정인성
    • 대한치과기공학회지
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    • 제30권2호
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    • pp.79-86
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    • 2008
  • The purpose of this study was to investigate the effect retention element formed by metal surface treatment method on the bond strength of indirect composite resin and metal. The metal specimens were cast from Ni-Cr alloy($Rexillium^{(R)}$ III). They were divided into 5 groups by applied retention element: $50{\mu}m$ aluminium oxide sandblasting group, $250{\mu}m$ aluminium oxide sandblasting group, 0.2mm retention crystal group, 10% $H_{2}SO_{4}$ solution etching group, $110{\mu}m$ $Rocatec^{TM}$ Plus system group. Total 50 metal specimens were veneered with Sinfony indirect composite resin system. Specimens were tested for shear bond strength on an Instron universal testing machine and fracture mode of fractured specimens were analyzed by SEM and EDS. 1. 0.2 mm retention crystals were most effective in improving the resin-metal shear bond strength (p<0.05). 2. Sandblasting by $250{\mu}m$ aluminium oxide were more effective than sandblasting by $50{\mu}m$ aluminium oxide in improving the resin-metal shear bond strength(p<0.05). 3. Fracture mode of resin-metal fractured surface were cohesive failure mode in 0.2mm retention crystal, mixed failure mode in sandblasted specimens, etched specimens and the specimens sandblasted with $110{\mu}m$ $Rocatec^{TM}$ Plus system.

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고체비적검출기(固體飛跡檢出器)의 특성(特性)과 그 응용(應用) -CR-39에 의한 질소(窒素)이온 검출(檢出)과 선양측정(線量測定)- (Characteristics and Applications of Soild State Nuclear Track Detectors -The Detection and Dosimetry of N-Ions by CR-39-)

  • 강영호;김도성
    • Journal of Radiation Protection and Research
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    • 제9권2호
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    • pp.55-60
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    • 1984
  • Allyl diglycol carbonate(CR-39)에 조사(照射)된 60MeV의 질소이온을 검출하기 위한 최적부식 조건을 부식시간에 대한 비적밀도와 비적직경의 변화를 고려하여 $70^{\circ}C$, 20% NaOH 용액에 대해 부식시간 130분으로 정하였다. 이 조건에서 검출가능한 최대비적밀도는 $1.7{\times}10^7tr/cm^2$였으며 입사(入射)된 질소 이온의 총전하량의 증가에 따라 비적밀도가 선형적으로 증가하였다. 또한 $2{\mu}m$의 금박에 의한 질소 이온의 산란을 점선원(點線源)에 의한 Rutherford 산란으로 고려함으로써 측정된 상대산란확률이 이론치와 일치하여 선량측정이 가능하였으며 $12nC{\sim}100nC$의 입사(入射) 질소이온의 전하에 대해 $54{\sim}41%$의 검출 효율을 얻었다.

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STI를 이용한 서브 0.1$\mu\textrm{m}$VLSI CMOS 소자에서의 초박막게이트산화막의 박막개선에 관한 연구 (A study on Improvement of sub 0.1$\mu\textrm{m}$VLSI CMOS device Ultra Thin Gate Oxide Quality Using Novel STI Structure)

  • 엄금용;오환술
    • 한국전기전자재료학회논문지
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    • 제13권9호
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    • pp.729-734
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    • 2000
  • Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

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발열 위치에 따른 잉곳의 방향성 응고 평가 (Estimation of Directional Solidification Ingot with Heating Position)

  • 전호익;조현섭
    • 한국산학기술학회논문지
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    • 제14권4호
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    • pp.1915-1920
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    • 2013
  • 본 논문은 열 해석 시뮬레이션과 주조로의 구조 변경을 통한 실리콘 잉곳의 방향성 응고에 대한 연구이다. 열 해석 시뮬레이션에 의한 결과, 용융은 유지 시간이 80분일 때 실리콘이 전체적으로 고르게 용융 온도에 도달하였고 냉각은 상부 냉각 온도가 $1,400^{\circ}C$와 60분 냉각 시 가장 좋은 결과 값을 나타내었다. 제작된 웨이퍼가 기존의 상용 웨이퍼보다 결정립계에서의 에칭이 훨씬 적게 이루어졌다. FTIR 측정결과 산소와 탄소 모두 모두 임계값 이하의 불순물로 존재함을 확인하였다. NAA 분석 결과 총 18가지 금속 불순물이 검출 되었지만, 농도 분포는 같은 위치에서 위와 아래의 차이는 크게 나지 않고, 어떤 특정한 위치에서 한쪽으로 집중되거나 어떤 경향성 없이 전체의 샘플의 모든 부분에서 농도가 거의 일정하게 분포를 나타냈다.

평면형 유도결합 플라즈마의 특성 및 선택적 산화막 식각 응용에 관한 연구 (A study on the characteristics of planar type inductively coupled plasma and its applications on the selective oxide etching)

  • 양일동;이호준;황기웅
    • 한국진공학회지
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    • 제6권1호
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    • pp.91-96
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    • 1997
  • 평면형 유도 결합 플라즈마의 전기적 특성을 측정하였고 Langmuir probe를 이용하 여 전자의 밀도와 온도를 측정하였다. 코일과 플라즈마를 포함한 총 부하의 저항 성분은 1 에서 4$\Omega$까지 변하였고 인덕턱스는 $1.5\mu$H와 2$\mu$H사이의 값을 가졌다. $10^{11}/\textrm{cm}^3$ 이상의 고밀 도 플라즈마를 발생시켰으며 전자의 온도는 공정 조건에 따라 3에서 5eV까지 변하였다. 산 화막 식각시 선택도를 개선하기 위한 방법으로 바이어스 전압을 변조하는 방법을 모색하였 다. C4F8플라즈마에서 바이어스 변조 방법을 사용하였을 때 선택도는 크게 향상 되었으나 산화막 식각율이 400$\AA$/min 이하였다. 선택도 향상을 위해 수소를 첨가한 실험에서 $C_4F_8$ 플 라즈마에 60% $H_2$를 첨가하였을 때 선택도 50이상, 산화막 식각율 2000$\AA$/min 이상의 결과 를 얻을 수 있었다.

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$1.31{\mu}m$ and $1.55{\mu}m$ 파장에서 금속 defined Electro-Optic Polymer Waveguide (Metal-defined Electro-Optic Polymer Waveguide Operating at both $1.31{\mu}m$ and $1.55{\mu}m$ Wavelength)

  • Park, G.C.;Lee, J.;Chung, H.C.;Jeong, W.J.;Yang, H.H.;Yoon, J.H.;Park, H.R.;Gu, H.B.;Lee, K.S.
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집
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    • pp.21-23
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    • 2004
  • We report experimental results demonstrating a novel metal defined polymer optical waveguide with a low loss in electro-optic polymers for the first time. The polymer optical waveguides are created using a metal film on the top of upper cladding without any conventional etching process. The fabricated waveguides have an excellent lateral optical mode confinement at both 1.31 ${\square}m$ and 1.55 ${\square}m$ wavelength, resulting in a fiber-to lens optical insertion loss of ~ 7 dB at 1.55 ${\square}m$ and ~4.5 dB at 1.31 ${\square}m$ wavelength in a 3.5cm total length for TM polarizations, respectively. We also present the optical loss dependence of the waveguide as a function of optical wavelengths. These results may be used in the complex design of integrated polymer optical circuits that need simpler and cheaper fabrication process.

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주조체의 설계 변화에 따른 수지접착형 보철물의 접착강도에 관한 연구 (A STUDY ON THE BOND STRENGTH OF RESIN-RETAINED PROTHESIS WITH VARIOUS CAST RETAINER DESIGNS)

  • 주대원;장익태;김광남
    • 대한치과보철학회지
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    • 제30권4호
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    • pp.508-525
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    • 1992
  • The purpose of this study was to evaluate the effect of some resistance form designs on the bond strength of resin-retained prosthesis. Six sub-groups are designed in natural teeth group and resin teeth group . The framework designs in natural teeth group: 1) no groove preparation 2) groove at the center of distal surface 3) groove at the distobuccal line angle 4) 45 degree lateral load with no groove 5) 45 degree lateral load with center groove 6) splint two teeth with no groove. The framework designs in resin teeth group: 1) no groove preparation 2) groove at the center of distal surface 3) groove at the distobuccal line angle 4) metal covered the 1/2 of distal surface 5) metal covered the 1/2 of mesial surface 6) metal extended over the 114 of buccal surface. Specimens were treated electrolytic etching by Oxy-Etch and cemented with Panavia EX. Failure load was measured by Instron. Another 30 specimens were carried out fatigue tests by MTS 810 fatigue testing machine for 5000 cycles at different load level. The following results were obtained from this study. 1. The failure load was significantly increased by resistance forms. 2. The failure load was not increased by increase of total surface area bonded with teeth. The distal surface area played an important role in failure load. 3. In 45 degree lateral load group, the failure load was decreased significantly than that of in vertical load group. 4. Bond failure modes between static test and fatigue test exhibited no differences.

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Effect of microthreads on removal torque and bone-to-implant contact: an experimental study in miniature pigs

  • Kwon, Yee-Seo;Namgoong, Hee;Kim, Jung-Hoon;Cho, In Hee;Kim, Myung Duk;Eom, Tae Gwan;Koo, Ki-Tae
    • Journal of Periodontal and Implant Science
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    • 제43권1호
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    • pp.41-46
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    • 2013
  • Purpose: The objective of this study was to evaluate the effect of microthreads on removal torque and bone-to-implant contact (BIC). Methods: Twelve miniature pigs for each experiment, a total of 24 animals, were used. In the removal torque analysis, each animal received 2 types of implants in each tibia, which were treated with sandblasting and acid etching but with or without microthreads at the marginal portion. The animals were sacrificed after 4, 8, or 12 weeks of healing. Each subgroup consisted of 4 animals, and the tibias were extracted and removal torque was measured. In the BIC analysis, each animal received 3 types of implants. Two types of implants were used for the removal torque test and another type of implant served as the control. The BIC experiment was conducted in the mandible of the animals. The $P_1-M_1$ teeth were extracted, and after a 4-month healing period, 3 each of the 2 types of implants were placed, with one type on each side of the mandible, for a total of 6 implants per animal. The animals were sacrificed after a 2-, 4-, or 8-week healing period. Each subgroup consisted of 4 animals. The mandibles were extracted, specimens were processed, and BIC was analyzed. Results: No significant difference in removal torque value or BIC was found between implants with and without microthreads. The removal torque value increased between 4 and 8 weeks of healing for both types of implants, but there was no significant difference between 8 and 12 weeks. The percentage of BIC increased between 2 and 4 weeks for all types of implants, but there was no significant difference between 4 and 8 weeks. Conclusions: The existence of microthreads was not a significant factor in mechanical and histological stability.

불소화 및 초음파 수세가 폴리(에틸렌 테레프탈레이트) 필름의 표면 특성에 미치는 영향 (Effect of Fluorination and Ultrasonic Washing Treatment on Surface Characteristic of Poly(ethylene terephthalate))

  • 김도영;인세진;이영석
    • 폴리머
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    • 제37권3호
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    • pp.316-322
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    • 2013
  • 본 연구에서는 고분자 소재 중 하나인 폴리(에틸렌 테레프탈레이트)(poly(ethylene terephthalate), PET) 필름의 표면을 친수성으로 개질하기 위하여 기상 불소화 및 초음파 수세를 실시하였다. 표면 처리된 PET 필름의 표면 특성은 접촉각, 표면 자유에너지, 주사전자 현미경(FE-SEM), 원자간력 현미경(AFM), X선 광전자분석법(XPS)을 통하여 분석하였다. 직접 불소화 및 초음파 수세 처리된 PET 필름의 물 접촉각은 $10.8^{\circ}$으로 미처리된 PET에 비하여 85% 감소하였고, 총 표면 자유에너지는 $42.25mNm^{-1}$으로 미처리된 PET에 비하여 650% 증가하였다. 또한 RMS(root mean square) 거칠기는 1.965 nm로 미처리된 PET 필름에 비하여 348% 증가하였으며, 친수성 관능기인 C-OH 결합의 농도는 약 3배 가까이 증가하였다. 이는 직접 불소화 및 초음파 수세 처리된 PET 필름 표면에 형성된 친수성 관능기와 공동화 현상에 의한 화학적 식각 반응에서 기인한 것으로 생각된다. 이 결과로부터, 기상 불소화 및 초음파 수세 처리법은 PET 필름 표면을 친수성으로 쉽게 개질할 수 있는 효과적인 방법으로 기대된다.