• Journal of the Korean Ceramic Society
• /
• v.49 no.6
• /
• pp.505-510
• /
• 2012

A study of the recovery of tin and nickel from steel ball scraps for barrel plating was carried out through a physical treatment, a leaching treatment, hydrogen reduction and an electrolysis experiment. The recovery of the iron component was over 95% by the physical treatment. We obtained tin oxide in the form of metastannic acid ($SnO_2{\cdot}xH_2O$) with impurities of less than 5% from the leaching treatment. We also recovered the high-purity metallurgical tin at a rate that exceeded 99.9% by the electrolysis of crude tin obtained from the hydrogen reduction of metastannic acid.

• Applied Chemistry for Engineering
• /
• v.17 no.2
• /
• pp.150-157
• /
• 2006

The alternate plating method was suggested by a tin-cobalt alloy plating process which has excellent mechanical characteristics and also favorable to environment. Tin-cobalt alloy plating has many advantages such as nontoxicity, variable color-tone, and no post-treatment process. In this study, the plating conditions such as temperature, pH, current density, plating time, and amount of additive (glycine) were determined in the tin-cobalt alloy plating process through Hull-cell test and surface analysis. As the result of Hull-cell analysis, brightness became superior as the amount of glycine increased. It was found that the optimum alloy ratio was 0.03 M of $SnCl_{2}{\cdot}2H_{2}O$ and 0.05 M of $CoSO_{4}{\cdot}7H_{2}O$ at $50^{\circ}C$, pH 8.5, and $0.5A/dm^2$. The optimum amount of additive was 15 g/L of glycine and 0.1 g/L of organic acid. Then, the solution including glycine was recommended as an optimum plating solution for a chromium plating process.

• Resources Recycling
• /
• v.25 no.4
• /
• pp.42-48
• /
• 2016

A research for the recovery of the metal with high purity from the waste tin plating solution was carried out. First, tin plating waste solution was tested to remove the organic substances and metallic impurities such as Fe, Zn, Na etc. using ion exchange resin having iminodiacetic functional groups (Lewatit TP 207). Second, the tin solution was purified to obtain the high purity tin solution using ion exchange resin having ethylhexyl-phosphate functional groups (Lewatit VPOC 1026). Finally, 99.98% of the high purity of tin metal can be recovered from the purified solution by cyclone type electrowinning method.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.17-21
• /
• 2008

The electroless plating of copper and tin were investigated for the fabrication of Sn-Cu bump. Copper and tin were electroless plated in series on $20{\mu}m$ diameter copper via to form approximately $10{\mu}m$ height bump. In electroless copper plating, acid cleaning and stabilizer addition promoted the selectivity of bath on the copper via. In electroless tin plating, the coating thickness of tin was less uniform relative to that of electroless copper, however the size of Sn-Cu bump were uniform after reflow process.

• Proceedings of the KSME Conference
• /
• 2008.11a
• /
• pp.1337-1342
• /
• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2001.11a
• /
• pp.3-3
• /
• 2001

Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.

• Resources Recycling
• /
• v.24 no.3
• /
• pp.51-58
• /
• 2015

In order to recover tin from the waste tin plating solution, we used the ion exchange method using three types of ion exchange resins. The ion exchange resin with tertiary functional group(Lewatit TP 272) has not adsorption ratio of tin. The ion exchange resin with iminodiacetic functional group(Lewatit TP 207) has high adsorption ratio of tin, but impurity content in the recovered tin solution was relatively high. Whereas, in case of the ion exchange resin with functional group of ethylhexyl-phosphate(Lewatit VP OC 1026), adsorption ratio of tin was less than that of Lewatit TP 207. However, it was possible to remove impurities in the recovered tin solution by controlling the pH of the solution. High purity tin solution can be recovered by removing the organic materials with water washing process.

• Restorative Dentistry and Endodontics
• /
• v.19 no.2
• /
• pp.473-484
• /
• 1994

To investigate the effect of resin cement, which had been known to increase the adhesive capacity of the cast gold inlay, on the gingival marginal fit and whether the tin-planting of the beveled area affects the marginal fit, Class II cast gold inlays were made on the 25 sound molars. Control group(ZPC goup) was cemented with the ZPC by conventional method. Experimental groups were cemented with the resin cement(Super-hond & $Panavia_{EX}$) and subdivided further by the existence or nonexistence of the tin-plating of the beveled area(ST & PT groups: with plating, SNT & PNT groups: without plating). So, each group was consisted of 5 teeth and the gingival margin of each specimen was mesiodistally sectioned by 3 times and the marginal and internal gap were evaluated by the Stereo Microscope (${\times}180$) and the Scanning Electron Micrascope(${\times}5,000$) was used for examining the adhesive relationship of the resin cement to the cavity wall and to the cast gold surface. The results were as follows : 1. Marginal gap was less than internal gap in all groups. 2. ZPC and SNT(bevel without tin-plating) groups showed the least gap and gap in PNT(bevel without tin-plating) group, ST(bevel with tin-plating) group, PT(bevel with tin-plating) group showed the greater value in order in evaluation of the both internal gap and marginal gap. 3. With the exception of the relationships between ZPC and SNT groups, ST and PNT groups, relationships between any other groups showed the statistical significance in the internal gap(p<0.05). 4. In the marginal gap, all relationships between groups showed the statistical significance (p<0.05) except the relationships between ZPC and SNT groups, ST and PNT groups, ZPC and PNT groups. 5. ZPC group showed more soluble phenamena than the resin groups(ST, SNT, PT, PNT). 6. Resin cement showed the void spaces in spite of good penetration into the micro-irregularities on both the tooth surface and the cast surface. The void was shown more in PT and PNT groups than in the ST and SNT groups. 7. After the treatment of heat and desiccation for SEM specimen, resin cements were detached more easily from the tooth surface than from the cast surface.

• Resources Recycling
• /
• v.20 no.4
• /
• pp.46-51
• /
• 2011

A study on the recovery of tin from the steel ball scraps for barrel plating has been carried out the physical treatment and leaching experiment. The recovery of iron component was over 95% by the physical treatment, and the recovery of tin component was also over 95% by the hydro process.

• Journal of Dental Rehabilitation and Applied Science
• /
• v.22 no.2
• /
• pp.125-136
• /
• 2006

Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.