• 한국세라믹학회지
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• 제49권6호
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• pp.505-510
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• 2012

A study of the recovery of tin and nickel from steel ball scraps for barrel plating was carried out through a physical treatment, a leaching treatment, hydrogen reduction and an electrolysis experiment. The recovery of the iron component was over 95% by the physical treatment. We obtained tin oxide in the form of metastannic acid ($SnO_2{\cdot}xH_2O$) with impurities of less than 5% from the leaching treatment. We also recovered the high-purity metallurgical tin at a rate that exceeded 99.9% by the electrolysis of crude tin obtained from the hydrogen reduction of metastannic acid.

• 공업화학
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• 제17권2호
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• pp.150-157
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• 2006

최근 들어 크롬대체 도금공정의 필요성이 대두되고 있는 가운데, 크롬도금과 색차가 적고 기계적 특성이 우수하며 환경 친화적인 주석 계 합금도금의 사용이 확대되고 있다. 따라서 본 연구에서는 Sn-Co 합금도금공정을 바탕으로 광택제, 착화제로서 glycine 사용에 대한 연구를 수행하고자 하였다. Sn-Co 합금도금과 glycine 첨가에 따른 물리적 특성 및 표면 광택측정을 위해 Hull-cell 분석 및 도금표면분석을 수행하였다. Hull-cell 분석결과 glycine의 첨가량이 증가함에 따라 광택특성은 우수한 것으로 관찰되었으며, 표면광택성이 가장 우수한 도금조건으로는 $50^{\circ}C$, pH = 8의 조건에서 전전류 공급량 1 A로 1 min간 도금한 경우 음극전류밀도 $1A/dm^2$인 영역을 추천할 수 있었다. 동일조건의 pilot 실험을 $10{\mu}m$ 두께로 Ni하지 도금 후 Sn-Co 합금도금액 기본조성인 0.03 M $SnCl_{2}{\cdot}2H_{2}O$, 0.05 M $CoSO_{4}{\cdot}7H_{2}O$, 0.7 M $K_{4}P_{2}O_{7}$의 혼합 용액에서 수행하 였다. $0.2{\sim}0.6 {\mu}m$의 도금두께를 갖는 Sn-Co 합금도금 표면의 기계적 특성과 도금표면의 성분분석 결과 glycine의 첨가량이 15 g/L일 때 우수한 밀착성, 내식성, 내마모성을 보였다. 따라서 Sn-Co 합금도금공정에 glycine을 첨가한 용액을 크롬도금공정의 최적 도금용액으로 추천할 수 있었다.

• 자원리싸이클링
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• 제25권4호
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• pp.42-48
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• 2016

주석도금폐액으로부터 고순도 주석 금속을 회수하는 연구를 실시하였다. 먼저 주석도금폐액을 Iminodiacetic 관능기를 가진 이온교환수지(Lewatit TP 207)를 사용하여 1차적으로 유기물 및 Fe, Zn, Na 등의 불순물을 제거하였고, 2차적으로 Ethylhexyl-phosphate의 관능기를 가진 이온교환수지(Lewatit VPOC 1026)를 사용하여 잔류하고 있는 불순물들을 모두 제거하여 고순도의 주석용액으로 회수하였다. 회수된 주석용액으로부터 고순도 금속주석으로 회수하기 위하여 사이클론식 전해방법을 사용하였으며, 전해채취 결과 약 99.98% 순도의 주석을 회수할 수 있었다.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.17-21
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• 2008

Sn-Cu계 솔더 범프에서 무전해도금법을 이용한 범프 형성에 대한 연구를 하였다. $20{\mu}m$ via에 전기도금법으로 구리를 채운 웨이퍼 위에 ball형태의 범프를 형성하기 위하여 구리와 주석을 도금하여 약 $10{\mu}m$높이의 범프를 형성하였다. 구리 범프 형성 시 via위에 선택적으로 도금하기 위하여 활성화 처리 후 산세처리를 실시하고 무전해 도금액에 안정제를 첨가하였다. 무전해도금법을 이용하여 주석 범프 형성 시 도금층이 구리 범프에 비해 표면의 균일도가 벌어지는 것으로 관찰되었지만 reflow공정을 실시한 후 ball 형태의 균일한 Sn-Cu 범프를 형성하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1337-1342
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• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2001년도 추계학술발표회 초록집
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• pp.3-3
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• 2001

Two companies plating baths were selected for plating on phenol and epoxy resin boards as well as on flexible p polyimide boards. After plating, deposited i&IIk&.ness al1d physical properties, as well as solder wettabilities by aging with $150^{\circ}C$ heating and 100% humidity were compared. After plating and aged with two different tin baths, deposited thickness and physical properties were not so great differences, but solder wettabilities were superior used polymer catalyst than the other. Furthermore depend upon the compactness and fineness of metallic sturctures of the base copper, the amounts of the plated copper were big differel1lces. These differences seems to be inherited from the kind and amount of additives. as well as current densities, which are influences upon structures of Copper layers. Generally the tin thickness are hetween 0.5 to $1.0\mu\textrm{m}$ and thicker the solder wettabilities are the better, and also me compact structures of deposits showed gooo soidierabiiities. In this study, with our own deveiotaedl plating equipment could get more than $0.5\mu\textrm{m}$ of till thickness and piating speed was $0.1\mu\textrm{m}$ per minutes.

• 자원리싸이클링
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• 제24권3호
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• pp.51-58
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• 2015

주석도금폐액으로부터 이온교환수지를 사용하여 주석 회수에 대한 연구를 실시하였다. 3종류의 이온교환수지를 사용하여 기초 실험한 결과 tertiary 기능기를 가진 이온교환수지(Lewatit TP 272)는 주석을 흡착하지 못하였고, iminodiacetic기능기를 가진 이온교환수지(Lewatit TP 207)는 주석의 흡착율은 높으나, 회수된 주석용액 내 불순물 함량이 높았다. Ethylhexyl-phosphate의 기능기를 가진 이온교환수지(Lewatit VP OC1026)를 사용한 경우, 주석의 흡착율이 iminodiacetic기능기를 가진 이온교환수지 보다 낮았으나 pH 조절에 따라 회수된 주석용액 내 불순물의 제거가 가능하였다. 또한 이온교환수지에 흡착된 유기물의 경우는 수세를 통해 제거를 함으로써 고순도 주석용액으로 회수가 가능하였다.

• Restorative Dentistry and Endodontics
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• 제19권2호
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• pp.473-484
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• 1994

To investigate the effect of resin cement, which had been known to increase the adhesive capacity of the cast gold inlay, on the gingival marginal fit and whether the tin-planting of the beveled area affects the marginal fit, Class II cast gold inlays were made on the 25 sound molars. Control group(ZPC goup) was cemented with the ZPC by conventional method. Experimental groups were cemented with the resin cement(Super-hond & $Panavia_{EX}$) and subdivided further by the existence or nonexistence of the tin-plating of the beveled area(ST & PT groups: with plating, SNT & PNT groups: without plating). So, each group was consisted of 5 teeth and the gingival margin of each specimen was mesiodistally sectioned by 3 times and the marginal and internal gap were evaluated by the Stereo Microscope (${\times}180$) and the Scanning Electron Micrascope(${\times}5,000$) was used for examining the adhesive relationship of the resin cement to the cavity wall and to the cast gold surface. The results were as follows : 1. Marginal gap was less than internal gap in all groups. 2. ZPC and SNT(bevel without tin-plating) groups showed the least gap and gap in PNT(bevel without tin-plating) group, ST(bevel with tin-plating) group, PT(bevel with tin-plating) group showed the greater value in order in evaluation of the both internal gap and marginal gap. 3. With the exception of the relationships between ZPC and SNT groups, ST and PNT groups, relationships between any other groups showed the statistical significance in the internal gap(p<0.05). 4. In the marginal gap, all relationships between groups showed the statistical significance (p<0.05) except the relationships between ZPC and SNT groups, ST and PNT groups, ZPC and PNT groups. 5. ZPC group showed more soluble phenamena than the resin groups(ST, SNT, PT, PNT). 6. Resin cement showed the void spaces in spite of good penetration into the micro-irregularities on both the tooth surface and the cast surface. The void was shown more in PT and PNT groups than in the ST and SNT groups. 7. After the treatment of heat and desiccation for SEM specimen, resin cements were detached more easily from the tooth surface than from the cast surface.

• 자원리싸이클링
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• 제20권4호
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• pp.46-51
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• 2011

바렐도금에 사용되는 더미볼 스크랩에 함유되어 있는 주석 (Sn)을 회수하기 위하여 물리적 전처리, 침출 및 회수실험을 행하였다. 물리적 전처리를 통하여 철 성분의 회수율은 95% 이상 달성하였으며 또한, 후속 습식 공정에서 주석/니켈 분말에서 질산침출 조건에서 주석 성분의 회수율은 95% 이상의 결과를 얻었다.

• 구강회복응용과학지
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• 제22권2호
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• pp.125-136
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• 2006

Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.