• Bulletin of the Korean Chemical Society
• /
• v.28 no.8
• /
• pp.1311-1316
• /
• 2007

To develop photo-sensitizers for dye-sensitized solar cells (DSCs) used in harvesting sunlight and transferring solar energy into electricity, we synthesize novel Ru(II) polypyridyl dyes and describe their characterization. We also investigate the photo-electrochemical properties of DSCs using these sensitizers. New dyes contain chromophore unit of dafo (4,5-diazafluoren-9-one) or phen-dione (1,10-phenanthroline-5,6-dione) instead of the nonchromophoric donor unit of thiocyanato ligand in cis-[RuII(dcbpy)2(NCS)2] (dcbpy = 4,4'-dicarboxy- 2,2'-bipyridine) coded as N3 dye. For example, the photovoltaic data of DSCs using [RuII(dcbpy)2(dafo)](CN)2 as a sensitizer show 6.85 mA/cm2, 0.70 V, 0.58 and 2.82% in short-circuit current (Jsc ), open-circuit voltage (Voc), fill factor (FF) and power conversion efficiency (Eff), which can be compared with those of 7.90 mA/ cm2, 0.70 V, 0.53 and 3.03% for N3 dye. With the same chelating ligand directly bonded to the Ru metal in the complex, the CN ligand increases the Jsc value by double, compared to the SCN ligand. The extra binding ability in these new dyes makes them more resistant against ligand loss and photo-induced isomerization within octahedral geometry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.32 no.2
• /
• pp.110-115
• /
• 2019

$Pb(Sb_{0.5}Nb_{0.5})_x(Zr_{0.51}Ti_{0.49})_{1-x}O_3$ (abbreviation: PSN-PZT) ceramics were synthesized, using conventional bulk ceramic processing technology, with various PSN doping contents. The maximum density of PSN-PZT was 97% of the theoretical density in the samples sintered at $1,250^{\circ}C$. The maximum values of the piezoelectric properties achieved using the conventional processes were: $k_p$ of 0.625, $d_{33}$ of 531 pC/N, and $g_{33}$ of $33mV{\cdot}m/N$. Finally, we fabricated a piezo-speaker with the optimized PSN-PZT ceramics. The SPL of the speaker was measured at a distance of 1 m, with a driving voltage of $40V_{rms}$ in the frequency range of ~300 Hz to 9 kHz. The measured $SPL_{max}$ was at a very high level (95 dB), which was superior in quality in comparison with those of other commercial products.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.338-338
• /
• 2013

Monolithic three-dimensional integrated circuits (3D-ICs) 구현 시 bonding 과정에서 발생되는 aluminum (Al) 이나 copper (Cu) 등의 interconnect metal의 확산, 열적 스트레스, 결함의 발생, 도펀트 재분포와 같은 문제들을 피하기 위해서는 저온 공정이 필수적이다. 지금까지는 polymer 기반의 bonding이나 Cu/Cu와 같은 metal 기반의 bonding 등과 같은 저온 bonding 방법이 연구되어 왔다. 그러나 이와 같은 bonding 공정들은 공정 시 void와 같은 문제가 발생하거나 공정을 위한 특수한 장비가 필수적이다. 반면, 두 물질의 합금을 이용해 녹는점을 낮추는 eutectic bonding 공정은 저온에서 공정이 가능할 뿐만 아니라 void의 발생 없이 강한 bonding 강도를 얻을 수 있다. Aluminum-germanium (Al-Ge) 및 aluminum-indium (Al-In) 등의 조합이 eutectic bonding에 이용되어 각각 $424^{\circ}C$ 및 $454^{\circ}C$의 저온 공정을 성취하였으나 여전히 $400^{\circ}C$이상의 eutectic 온도로 인해 3D-ICs의 구현 시에는 적용이 불가능하다. 이러한 metal 조합들에 비해 indium (In)과 tin (Sn)은 각각 $156^{\circ}C$ 및 $232^{\circ}C$로 굉장히 낮은 녹는점을 가지고 있기 때문에 In-Sn 조합은 약 $120^{\circ}C$ 정도의 상당히 낮은eutectic 온도를 갖는다. 따라서 본 연구팀은 In-Sn 조합을 이용하여 $200^{\circ}C$ 이하에서monolithic 3D-IC 구현 시 사용될 eutectic bonding 공정을 개발하였다. 100 nm SiO2가 증착된 Si wafer 위에 50 nm Ti 및 410 nm In을 증착하고, 다른Si wafer 위에 50 nm Ti 및 500 nm Sn을 증착하였다. Ti는 adhesion 향상 및 diffusion barrier 역할을 위해 증착되었다. In과 Sn의 두께는 binary phase diagram을 통해 In-Sn의 eutectic 온도인 $120^{\circ}C$ 지점의 조성 비율인 48 at% Sn과 52 at% In에 해당되는 410 nm (In) 그리고 500 nm (Sn)로 결정되었다. Bonding은 Tbon-100 장비를 이용하여 $140^{\circ}C$, $170^{\circ}C$ 그리고 $200^{\circ}C$에서 2,000 N의 압력으로 진행되었으며 각각의 샘플들은 scanning electron microscope (SEM)을 통해 확인된 후, 접합 강도 테스트를 진행하였다. 추가로 bonding 층의 In 및 Sn 분포를 확인하기 위하여 Si wafer 위에 Ti/In/Sn/Ti를 차례로 증착시킨 뒤 bonding 조건과 같은 온도에서 열처리하고secondary ion mass spectrometry (SIMS) profile 분석을 시행하였다. 결론적으로 본 연구를 통하여 충분히 높은 접합 강도를 갖는 In-Sn eutectic bonding 공정을 $140^{\circ}C$의 낮은 공정온도에서 성공적으로 개발하였다.

• Journal of Korean Society on Water Environment
• /
• v.18 no.4
• /
• pp.387-394
• /
• 2002

The efficiency variation of UF(tubular)/RO(spiral wound) process using acrylic wastewater treated by photo-catalyst pretreatment and coagulant-filter-neutralization pretreatment processes were discussed wit the variation of appled pressure and temperature. Ultrafiltration tubular module using acrylic wastewater treated by photo-catalyst pretreatment and coagulant-filter-neutralization pretreatment processes was shown that COD and T-N were not highly affected with the variation of appled pressure and temperature. It was shown that removal efficiency of COD and T-N was low. Removal efficiency of TDS and turbidity with ultrafiltration tubular module was better with the acrylic wastewater by photo-catalyst pretreatment than acrylic wastewater by coagulant-filter-neutralization pretreatment. T-N and TDS were shown high removal efficiency in reverse osmosis membrane process.

• Composites Research
• /
• v.28 no.4
• /
• pp.155-161
• /
• 2015

A composite structure was fabricated with embedded impact detection capabilities for applications in Structural Health Monitoring (SHM). By embedding sensor functionality in the composite, the structure can successfully perform impact localization in real time. Smart resin, composed of $Pb(Ni_{1/3}Nb_{2/3})O_3-Pb(Zr,\;Ti)O_2$ (PNN-PZT) powder and epoxy resin with 1:30 wt%, was used instead of conventional epoxy resin in order to activate the sensor function in the composite structure. The embedded impact sensor in the composite was fabricated using Hand Lay-up and Vacuum Assisted Resin Transfer Molding(VARTM) methods to inject the smart resin into the glass-fiber fabric. The electrodes were fabricated using silver paste on both the upper and bottom sides of the specimen, then poling treatment was conducted to activate the sensor function using a high voltage amplifier at 4 kV/mm for 30 min at room temperature. The composite's piezoelectric sensitivity was measured to be 35.13 mV/N by comparing the impact force signals from an impact hammer with the corresponding output voltage from the sensor. Because impact sensor functionality was successfully embedded in the composite structure, various applications of this technique in the SHM industry are anticipated. In particular, impact localization on large-scale composite structures with complex geometries is feasible using this composite embedded impact sensor.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2003.05a
• /
• pp.55-55
• /
• 2003

최근 높은 해상도의 평판 디스플레이 장치 특히 차세대 TFT-LCD를 개발하기 위해서는 건식식각공정의 개발이 필수 불가결하며 이는 플라즈마 공정장치의 대면적화가 가능해야 한다. 따라서 산업계는 이러한 제조 조건에 알맞는 대면적 플라즈마 반응기 개발을 추구하고 있다. 이를 위해서는 건식식각공정의 개발이 필수 불가결하며 이를 위해선 플라즈마 공정장 치의 대면적화가 가능해야 한다. 이러한 대면적 공정을 위해서는 낮은 공정압력, 고밀도, 높은 플라즈마 균일도가 요구된다. 또한 이러한 대면적 고밀도 플라즈마에의 적용을 위하여 새로운 유도결합형 플라즈마 소오스의 개발이 진행되고 있으며, 안정적인 300mm웨이퍼 공정을 위하여 여러 형태의 안테나가 연구되어지고 있다. 그러나 차세대 TFT-LCD에 적용 가 능하게끔 기존의 ICP 소오스를 직접적으로 대면적화 하는데 있어서는 안테나의 인덕턴스의 값이 키지며, 유전물질의 두께 증가 및 그에 따른 재료비의 상슴에 의해 그 한계점을 나타 내었다. 본 연구에서는 차세대 TFT-LCD 및 POP 대면적 공정에 적용 가능한 고밀도 플라즈마를 발생시키기 위해서 내장형 유도결합형 선형 안테나를 사용하였다. 내장형 유도결합형 선형 안테나가 가지고 있는 고유의 정전기적 결합효과를 최소화시키기 위해 직사각형모양의 플라즈마 챔버(830mm*1,020mm)에서 영구자석을 사용하였다. 영구자석을 사용하여 외부자 장을 인가하였을 때가, 그럴지 않은 때보다 RF 안테나에 걸리는 코일의 전압을 낮춰주었으며, 영구자석의 배열에 따라 코일의 인덕턴스의 값이 크게 변함을 알 수 있었다. 그리고, 최적화된 자장의 배열은 플라즈마의 이온밀도를 증가시켰으며, 플라즈마 균일도 또한 10% 이 내로 유지됨을 알 수 있었다. 따른 식각 메커니즘에 대하여 알아보고자 하였다. $CF_4/Cl_2$ gas chemistry 에 첨 가 가스로 $N_2$와 Ar을 첨 가할 경 우 텅 스텐 박막과 하부 layer 간의 etch selectivity 증가는 관찰되지 않았으며, 반면에 첨가 가스로 $O_2$를 사용할 경우, $O_2$의 첨가량이 증가함에 따라 etch s selectivity 는 계속적으로 증가렴을 관찰할 수 있었다. 이는 $O_2$ 첨가에 따라 형성되는 WOF4 에 의한 텅스텐의 etch rates 의 감소에 비하여, $Si0_2$ 등의 형성에 의한 poly-Si etch rates 이 더욱 크게 감소하였기 때문으로 사료된다. W 과 poly-Si 의 식각 특성을 이해하기 위하여 X -ray photoelectron spectroscopy (XPS)를 사용하였으며, 식각 전후의 etch depth 를 측정하기 위하여 stylus p pmfilometeT 를 이용하였다.X> 피막이 열처리 전후에 보아는 기계적 특성의 변화 양상은 열역학적으로 안정한 Wurzite-AlN의 석출에 따른 것으로 AlN 석출상의 크기에 의존하며, 또한 이러한 영향은 $(Ti_{1-x}AI_{x})N$ 피막에 존재하는 AI의 함량이 높고, 초기에 증착된 막의 업자 크기가 작을 수록 클 것으로 여겨진다. 그리고 환경의 의미의 차이에 따라 경관의 미학적 평가가 달라진 것으로 나타났다.corner$적 의도에 의한 경관구성의 일면을 확인할수 있지만 엄밀히 생각하여 보면 이러한 예의 경우도 최락의 총체적인 외형은 마찬가지로

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2002.05a
• /
• pp.155-160
• /
• 2002

Metal matrix composites had generated a lot of interest in recent times because of significant in specific properties. It was also highlighted as the materials of frontier industry because strength, heat-resistant, corrosion-resistant, wear-resistant were superiored. In this study the strength properties of $Al_{18}B_4O_{33}/AC4CH$ were represented mixing the binder of $Al_2O_3$ and $TiO_2$. It was also fabricated by squeeze casting. $Al_{18}B_4O_{33}/AC4CH$ was fabricated at the melt temperature of $760^{\circ}C$ the perform temperature of $700^{\circ}C$ and mold temperature of $200^{\circ}C$ under the pressure of 83.4MPa and observed SEM. Fatigue crack growth rate tests on compact tension specimen(half-size) of thickness 12.5mm were conducted by using sinusoidal waveform. Compact tension specimens(half-size) were used and fatigue crack growth rate da/dN and stress intensity factor range ${\Delta}K$ were analyzed concerning to the R value of 0.1 and 0.05. In order to find out the value of ${\Delta}K$, load amplitude constant method was applied by the standard fatigue testing method describes in ASTM E647-95a. As the results of this study, Fatigue crack growth rate increased with in creasing the load ratio, Consequently, At equivalent stress intensity factors, the fatigue crack growth rates in MMC were faster than those of AC4CH alloy. then the fatigue life and the fatigue crack growth rate was investigated using scanning election microscopy(SEM)

• Journal of the Korean Ceramic Society
• /
• v.48 no.5
• /
• pp.467-470
• /
• 2011

Pb(Zr,Ti)$O_3$ (PZT) based ceramics with superior piezoelectric properties have been extensively used in various domestic and industrial appliances. However, PZT ceramics causing environmental contamination and health problems need to be eventually replaced by any of Pb-free materials. $(Na_{0.53}K_{0.47})(Nb_{1-x}Ta_x)O_3$ (NKNT), one of Pb-free piezoelectric ceramics, has long been known but its properties are not fully understood and developed. In this study, dielectric and piezoelectric properties of Pb-free NKNT ceramics were studied with Ta substitution for B-site at x = 0~0.6. It was found that polymorphic phase transition (PPT) between orthorhombic and tetragonal phases was notably influenced by Ta substitution. The highest piezoelectric coefficient ($d_{33}$) of 284 pC/N was occurred at x = 0.45.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.11
• /
• pp.902-905
• /
• 2012

This study is explore the photoelectric conversion change of dye-sensitized solar cells with surface treatment of the conductive substrate. gases of FTO surface treatment were $N_2$, and $O_2$. Treatment conditions of surface were gas flux from 25 sccm to 50 sccm and RF power were from 25 W to 50 W. Treatment time and pressure were fixed 5 min and 100 mtoor. The best sheet resistance and surface roughness were obtained by $O_2$ 50 sccm and 50 W and that result were 7.643 ${\Omega}/cm^2$ and 17.113 nm, respectively. The best efficiency result was obtained by $O_2$ 50 sccm and 50 W and that result of Voc, Jsc, FF and efficiency were 7.03 V, 14.88 $mA/cm^2$, 63.75% and 6.67%, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.177-180
• /
• 2002

Thickness dependence of crystallographic orientation of diol based sol-gel derived PZT(52/48) films on dielectric and piezoelectric properties was investigated The thickness of each layer by one time spinning was about 0.2 $\mu\textrm{m}$, and crack-free films was successfully deposited on 4 inches Pt/Ti/SiO$_2$/Si substrates by 0.5 mol solutions in the range from 0.2 $\mu\textrm{m}$ to 3.8 $\mu\textrm{m}$. Excellent P-E hysteresis curves were achieved without pores or any defects between interlayers. As the thickness increased , the (111) preferred orientation disappeared from 1$\mu\textrm{m}$ to 3 $\mu\textrm{m}$ region, and the orientation of films became random above 3 $\mu\textrm{m}$. Dielectric constants and longitudinal piezoelectric coefficient d$\_$33/, measured by pneumatic method were saturated around the value of about 1400 and 300 pC/N respectively above the thickness of 0.8 7m. A micromachined piezoelectric cantilever have been fabricated using 0.8 $\mu\textrm{m}$ thickness PZT (52/48) films. PZT films were prepared on Si/SiN$\_$x/SiO$_2$/Ta/Pt substrate and fabricated unimorph cantilever consist of a 0.8 fm thick PZT layer on a SiNx elastic supporting layer, which becomes vibration when ac voltage is applied to the piezoelectric layer. The dielectric constant (at 100 kHz) and remanent polarization of PZT films were 1050 and 25 ${\mu}$C/$\textrm{cm}^2$, respectively. Electromechanical characteristics of the micromachined PZT cantilever in air with 200-600 $\mu\textrm{m}$ lengths are discussed in this presentation.