• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.124-128
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• 1997

An attempt was made to understand the dissolution and reprecipitation behavior of the constituent phases such as TiC, TiN, and Ti(CN) in TiC-TiN-Ni system. During the liquid-phase sintering the TiC phase was found to dissolve preferentially in Ni binder. The solid-solution phase, Ti(CN), formed around the TiN phase, resulting in a core/rim structure. This result was reproduced when large TiC particles were used with fine TiN particles. The path for the microstructural change in TiC-TiN-Ni system was largely controlled by the difference in the interfacial energy of each phase with the liquid binder phase. The results were discussed with thermodynamic principles.

• International Journal of Korean Welding Society
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• v.2 no.1
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• pp.25-28
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• 2002

In the coarse grain HAZ adjacent to the fusion line, most of the TiN particles in conventional Ti added steel are dissolved and austenite grain growth is easily occurred during welding process. To avoid this difficulty, thermal stability of TiN particle is improved by increasing the nitrogen content in steel. In this study, the effect of hlgh nitrogen TiN particle on preventing austenite grain growth in HAZ was investigated. Increased thermal stability of TiN particle is helpful for preventing the austenite grain growth by pinning effect. High nitrogen TiN particle in simulated HAZ were not dissolved even at high temperature such as 1400'E and prevented the austenite grain growth in simulated HAZ. Owing to small austenite grain size in HAZ the width of coarse grain HAZ in high nitrogen TiN steel was decreased to 1/10 of conventional TiN steel. Even high heat input welding, the microstructure of coarse grain HAZ consisted of fine polygonal ferrite and pearlite and toughness of coarse grain HAZ was significantly improved.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.217-221
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• 2002

In the coarse grain HAZ adjacent to the fusion line, most of the TiN particles in conventional Ti added steel are dissolved and austenite grain growth is easily occupied during welding process. To avoid this difficulty, thermal stability of TiN particle is improved by increasing the nitrogen content in steel. In this study, the effect of high nitrogen TiN particle on preventing austenite grain growth in HAZ was investigated. Increased thermal stability of TiN particle is helpful for preventing the austenite grain growth by pinning effect. High nitrogen TiN particle in simulated HAZ were not dissolved even at high temperature such as 1400 C and prevented the austenite grain growth in simulated HAZ. Owing to small austenite grain size in HAZ the width of coarse grain HAZ in high nitrogen TiN steel was decreased to 1/10 of conventional TiN steel. Even high heat input welding, the microstructure of coarse grain HAZ consisted of fine polygonal ferrite and pearlite and toughness of coarse grain HAZ was significantly improved.

• Journal of Powder Materials
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• v.16 no.2
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• pp.98-103
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• 2009

The ultrafine titanium carbonitride particles ($TiC_{0.7}N_{0.3}$) below 100nm in mean size were successfully synthesized by Mg-thermal reduction process. The nanostructured sub-stoichiometric titanium carbide ($TiC_{0.7}$) particles were produced by the magnesium reduction at 1123K of gaseous $TiC_{l4}+xC_2Cl_4$ and the heat treatments in vacuum were performed for five hours to remove residual magnesium and magnesium chloride mixed with $TiC_{0.7}$. And final $TiC_{0.7}N_{0.3}$ phase was obtained by nitrification under normal $N_2$ gas at 1373K for 2 hrs. The purity of produced $TiC_{0.7}N_{0.3}$ particles was above 99.3% and the oxygen contents below 0.2 wt%. We investigated in particular the effects of the temperatures in vacuum treatment on the particle refinement of final product.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.22 no.2
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• pp.52-69
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• 1996

Nano-Sized TiO$_2$ particles with diameter between 2 and 5 nm are synthesized in Water/Triton X-100/n-Hexane microemulsion. Particles show the amorphous structure and partially hydroxide form. The optical absorbance of particles appears at 250nm and band edge at 340nm. Gold metal is deposited on the surface of TiO$_2$ particles by reduction reaction of Au(III) ion with sodium hypophosphite. The size of gold-deposited particles is 20nm, and the optical absorbance appears at 270nm and at 550nm. So particles show the red color. The dense precipitation is formed by aggregation in the TiO$_2$ nano-sized particles of about 5nm size. But the bulky precipitation is formed by agglomeration phenomena in the gold-deposited particles of 20nm size. And also gold-deposited particles is easily dispersed by being re-dispersed in PEG/Water solution. This study has compared those things measuring the SPF characteristics of the cosmetics made of the synthesized particles. If the particle size is controlled appropriately, then the SPF value will be higher, or more colorless cosmetics will be made.

• Journal of Powder Materials
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• v.17 no.2
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• pp.142-147
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• 2010

The ultrafine titanium carbonitride ($TiC_xN_y$) particles below 100 nm in mean size, including various carbon and nitrogen contents (x=0.55~0.9, y=0.1~0.5), were successfully synthesized by new Mg-thermal reduction process. Nanostructured sub-stoichiometric titanium carbide ($TiC_x$) particles were initially produced by the magnesium reduction of gaseous $TiCl_4+x/2C_2Cl_4$ at $890^{\circ}C$ and post heat treatments in vacuum were performed for 2 hrs to remove residual magnesium and magnesium chloride mixed with $TiC_x$. Finally, well C/N-controled $TiC_xN_y$ phases were successfully produced by nitrification heat treatment under normal $N_2$ gas atmosphere at $1150^{\circ}C$ for 2 hrs. The values of purity, mean particle size and oxygen content of produced particles were about 99.3%, 100 nm and 0.2 wt.%, respectively.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.577-582
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• 1999

In order to make the electroconductive $Si_3N_4$-TiN composities, the Si-Ti(N) compacts were nitrided at $1450^{\circ}C$ for 20hours, and then they were post-sintered by a gas-pressure-sintering technique at 1TEX>$1950^{\circ}C$ for 3.5 hours. As starting powders, commercial si powder of about $10\mu\textrm{m}$, two types of Ti powders of 100 and 325 mesh, and fine-sized TiN of $2.5\mu\textrm{m}$ powders were used. In the $Si_3N_4$-TiN sintered bodies used Ti powders, the relative density and fracture strength and electrical conductivity are low due to the existence of large amounts of coarse pores. However, in the $Si_3N_4$-TiN composite used TiN powder, the fracture toughness, fracture strength and electrical resistivity were $5.0MPa{\cdot}m^{1/2}$, 624MPa and $1400{\omega}cm$, respectively. The dispersion of TiN particles in the composite inhibited the growth of $Si_3N_4$ in the shape of rod and made strong strain field contrasts at the $Si_3N_4$-TiNinterfaces. It was recognized that microstructural control is required to improve the electrical conductivity and mechanical properties of $Si_3N_4$-TiN composites by dispersing TiN particles homogeneously.

• Journal of the Korean Applied Science and Technology
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• v.29 no.3
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• pp.377-392
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• 2012

It has been known that small solid particles act as a stabilizer in pickering emulsion system. In this study, we successfully prepared stable pickering emulsion in n-hexylalcohol and water system with $TiO_2$ whose surface was treated by alkylsilane. The optimum condition to prepare pickering emulsion stabilized by $TiO_2$ particles was determined by amount of $TiO_2$ particles and ratio of water and oil phase. The type of pickering emulsion was dependent on wettability of particles for water and n-hexylalcohol. When the amount of $TiO_2$ particles increased up to 5.00 wt%, the stability of pickering emulsion was showed to be improved. The most stable pickering emulsion was prepared in the case of W/O type which has the ratio of oil and water phase (3 : 7). We tried to prepare porous $SiO_2-TiO_2$ composite pigments using a pickering emulsion as template at the optimal condition. Porous pigments were synthesized with Ludox HS-30 as an inorganic material by sol-gel process. The characteristics and shape of porous pigments were measured by optical microscope, SEM, BET, XRD and EDS.

• Journal of Welding and Joining
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• v.25 no.1
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• pp.57-62
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• 2007

In the coarse grained HAZ of conventional TiN steel, most TiN particles are dissolved and austenite grain growth easily occurrs during high heat input welding. To avoid this difficulty, thermal stability of TiN particles is improved by increasing nitrogen content in EH36-TM steel. Increased thermal stability of TiN particle is helpful for preventing austenite grain growth by the pinning effect. In this study, the mechanical properties and microstructures of high heat input welded Tandem EGW joint in EH36-TM steel with high nitrogen content were investigated. The austenite grain size in simulated HAZ of the steel at $1400^{\circ}C$ was much smaller than that of conventional TiN steel. Even for high heat input welding, the microstructure of coarse grained HAZ consisted of fine ferrite and pearlite and the mechanical properties of the joint were sufficient to meet all the requirements specified in classification rule.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.267-275
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• 1995

Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.