• 한국주조공학회지
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• 제27권3호
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• pp.120-125
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• 2007

The microstructure, mechanical properties and melting range of Ni-Cr-Mo based alloys were investigated to develop Be-free Ni-Cr-Mo base dental alloys for Porcelain-Fused-to-Metal Firing(PFM). All as-cast alloys showed dendritic structure. Rockwell hardness of 20Cr7Mo was increased with addition of Si and Ti. On the contrary, it was decreased with addition of Co. The duplex alloying elemental addition such as 3Co + xTi, 2Si + xCo and 2Si + xTi to 20Cr7Mo resulted in much increase of hardness. Rockwell hardness and compressive strength for 20Cr3CoSiTi or 17Cr6CoSiTi alloy that add Si-Ti had similar values compared to the commercial alloys. Melting range for 20Cr3CoSiTi and 17Cr6CoSiTi alloy that add Si-Ti showed similar or lower than commercial alloys. In conclusion, 20Cr3CoSiTi and 17Cr6CoSiTi alloys can be applied for commercial use.

• 한국세라믹학회지
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• 제28권2호
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• pp.101-108
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• 1991

0.2 mo1% La doped BaTiO3 samples were prepared by a wet chemical process (Pechini process) and electrical conductivity were measured from annealing temperatures(800-110$0^{\circ}C$) to room temperature continuously. 2 probe I-V characteristics showed that Pt electrodes were non-ohmic below about 80$0^{\circ}C$ for Ladoped sample. I-V curves showed varistor behavior and breakdown voltages showed PTC-like behavior. AC complex impedance of 0.2 La and 0.05 Mn mo1% doped BaTiO3 samples with three different electrodes (electroless Ni, Pt, Ag electrodes) were measured with temperature variation. Complex impedance plots showed that the samples with electroless Ni electrodes have negligible electrode resistance. Samples with Ag or Pt paste electrodes showed large electrode resistance. PTC effect, which is defined as the ratio of maximum resistance to minimum resistance, was found to be less than 10 for 0.2 mo1% La doped dense sample however greater than 105 with codoping of 0.05 mo1% Mn and 0.2 mol% La.

• 한국세라믹학회지
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• 제36권8호
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• pp.835-842
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• 1999

본 연구에서는 Ag-Cu-Ti 와 Ag-Cu-In-Ti 를 사용하여 브레이징법으로 질화규소 간 접합체를 제작하고 $400^{\circ}C$와 $650^{\circ}C$에서 장시간(2000 h) 열처리 후 파괴 강도의 변화를 살펴보았다. 접합후 강도는 Ag-Cu-Ti 가 높게 나왔지만, 열처리 시간이 증가할수록 Ag-Cu-In-Ti 의 경우가 강도의 감소 정도가 작은 것으로 나타났다. 또한 고온 응용을 위해 개발된 새로운 접학 합금인 Au-Ni-Cr-Mo-Fe 계를 이용하여 질화 규소 간의 접합체를 제작하여 $650^{\circ}C$에서 100시간까지 장시간 열처리 하였다 접합 당시의 강도는 상용 접합 합금보다는 낮은 값을 보였지만, 열처리를 함에 따라 강도의 증가를 보였다 SUS316과의 접합시에는 중간재로 몰리브데늄 또는 구리를 사용하였으며 $400^{\circ}C$에서 1000시간 동안 열처리하였다. 강도는 몰리브데늄을 사용한 경우가 높게 나왔지만, 접합체의 형성이 어렵다는 단점이 있었다. 산화 실험에서는 Ti가 첨가된 접합 합금인 Ag-Cu-Ti 의 경우가 첨가되지 않은 Ag-Cu의 경우보다 산화가 잘 일어나며, 인듐을 첨가한 Ag-Cu-In-Ti 의 경우는 산화 억제의 효과가 나타났다. 전반적으로 In을 포함한 접합 합금이 고온 신뢰도 면에서 우수한 것으로 나타났다.

• 한국재료학회지
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• 제31권7호
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• pp.409-419
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• 2021

The effect of solidification rate on micro-segregation in investment casting of IN738LC superalloy was studied. In Ni-based superalloys, the micro-segregation of solute atoms is formed due to limited diffusion during cast and solidification. The microstructure of cast Ni-based superalloys is largely divided into dendrite core of initial solidification and interdendrite of final solidification. In particular, mosaic shaped eutectic γ/γ' and carbides are formed in the interdendrite of the final solidification region in some cases. The micro-segregation phenomena formed in regions of dendrite core and interdendrite including eutectic γ/γ' and carbides were analyzed using OM, SEM/EDS and micro Vickers hardness. As a result of analysis, the lack of (Cr, W) and the accumulation of Ti were measured in the eutectic γ/γ', and the accumulation of (Cr, Mo) and the lack of Ti were measured in the interdendrite between dendrite and eutectic. Carbides formed in interdendritic region were composed of (Ti, W, Mo, C). The segregation applied to each microstructure is mainly due to the formation of γ' with Ni₃(Al,Ti) composition. The Ni accumulation accompanied by Cr depletion, and the Ti accumulated in the eutectic region as a γ' forming elements. The Mo tends to diffuse out from the dendrite core to the interdendrite, and the W diffuse out from the interdendrite to the dendrite core. Therefore, the accumulation of Mo in the interdendrite and the deficiency of W occur in the eutectic region located in the interdendrite. Heat treatment makes the degree of the micro-segregation decrease due to the diffusion during solid solution. This study could be applied to the heat treatment technology for the micro-segregation control in cast Ni-based superalloys.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2004년도 춘계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.12-12
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• 2004

• 열처리공학회지
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• 제6권4호
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• pp.185-193
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• 1993

The effect and Condition of heat treatment on the tensile strength of welded joint was investigated in 300 grade 18% Ni-Co-Mo-Ti maraging steel sheets welded with electron beam. A good tensile strength of welded joint was obtained by following heat treatment cycle ; At $1100^{\circ}C$ the specimen was high temperature solution treated for 1 hour and then it was repeated solution treated at $900^{\circ}C$, $820^{\circ}C$ for 1 hour respectively to recrystallize the coarsened ${\gamma}$ grain. These heat treatment cycle was completed by an final aging heat treatment at $480^{\circ}C$ for 4 hour. Moreover, dissolution of dendrite, a significant decrease in seregation of Mo, Ti in weld metal were observed and also the coarsened ${\gamma}$ grain formed at $1100^{\circ}C$, $1200^{\circ}C$ changed to fine grain due to the effect of recrystallization.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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• pp.193-198
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• 2007

The NiSi is very promising candidate for the metallization in 60nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process window temperature for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5{\Omega}/{\square}$ and $3{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.

• 한국전기전자재료학회논문지
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• 제18권4호
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• pp.338-343
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• 2005

Pb(Zr,Ti)O₃[PZT] thin films were prepared on a highly (100) oriented LaNiO₃[LNO] and a randomly oriented LNO by sol-gel process. The PZT thin films on a highly (100) oriented LNO show a high (100) crystal orientation (F=100 ％), those on a randomly oriented LNO show a random crystal orientation (F=60 ％). All the PZT layer have a flat and dense microstructure with large columnar grains and their grain size are 25 nm. In the ferroelectric curves at electric field of 40 kV/cm, a highly (100) oriented PZT/LNO samples show coercive field, E/sub c/=10 kV/cm and remanent polarization, P/sub r/=14.5 μC/㎠, while a randomly oriented PZT/LNO sample show E/sub c/=10 kV/cm and P/sub r/=5.4 μC/㎠.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.894-897
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• 2004

Sodum bismuth titanate $(Na_{0.5}Bi_{0.5}TiO_3$ or NBT) thin films coated on the $LaNiO_3$ (LNO) electrode by sol-gel methode and rapid thermal annealing (RTA) technique. The NBT (NBT/LNO/Si) thin films examined by x-ray diffraction (XRD). The orientation of NBT was observed for films coated at $900^{\circ}C$, 5 min and $600^{\circ}C$, 60 min. Filed emission scanning electron microscopy (FE-SEM) showed uniform surface composed of grains. The grain size of NBT thin films increased with increasing annealing temperature.

• 반도체디스플레이기술학회지
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• 제6권3호
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• pp.19-23
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• 2007

The NiSi is very promising candidate for the metallization in 45 nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25\;{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5\;{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process temperature window for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5\;{\Omega}/{\square}$ and $3\;{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.