• Journal of Welding and Joining
• /
• v.20 no.6
• /
• pp.106-106
• /
• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and Ti₃Ag and titanium oxide, TiO₂were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of 900℃ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about 30㎛, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.1 no.1
• /
• pp.27-32
• /
• 2000

Porous glass ceramics composed of $Ag_2-Li_2O-CaO-TiO_2-P_2O_5$-CaO with 0.05-1.5 mole CuO were prepared by melting and 2 step heat treatment for nucleation at $610^{\circ}C$ and crystallization at $840^{\circ}C$. $\beta$-$Ca_3(PO_4)_2$crystal phase was selectively leached out in 1N-HC1 solution for 3 days, leaving $AgTi_2(PO_4)_3$and $LiTi_2(PO_4)_3$crystal phases. Antibacterial effects and characterizations of the porous glass ceramics were investigated. Staphylococcus aureus and Salmonella typhi bacteroa were used in this study. It was found that the resultant porous glass ceramics show excellent bacteriostatic properties.

• Advances in nano research
• /
• v.1 no.4
• /
• pp.211-218
• /
• 2013

A low-cost, green and reproducible citric acid assisted synthesis of nanocrystalline $Al_{0.5}Ag_{0.5}TiO_3$ (n-AAT) powder is reported. X-ray, FTIR, energy dispersive X-ray, transmission electron microscopy and scanning electron microscopy analyses are performed to ascertain the formation of n-AAT. X-ray diffraction data analysis indicated the formation of monoclinic structure. Spherical shaped particles having the sizes of 3-15 nm are found. The mechanism of nano-transformation for the soft-chemical synthesis of n-AAT has been explained using simple organic chemistry rules and nucleation and growth theory. Dielectric study revealed that AAT ceramic might be a suitable candidate for capacitor applications.

• Journal of the Korean Ceramic Society
• /
• v.22 no.3
• /
• pp.19-24
• /
• 1985

The phtoelectrochemical porperties of $Nb_2O_5$, $Sb_2O_3$ and $V_2O_5$ doped and pure $SrTiO_3$ ceramic electodes were investigated. Shapes of I-V and I-λ characteristics of the pure $SrTiO_3$ ceramic electrode are similar to those of SrTiO3 single crystal electorde ; the anodic current strats at -0.9V (vs. Ag/AgCI) in 1 N-NaOH aqueous solution and the photoresponse appears at a wavelength of about 390nm and the quantum efficiency is about 3.5% at wavelength of 390nm under 0.5V vs. Ag/AgCl. Photocurrents of $Nb_2O_5$, $Sb_2O_3$ and $V_2O_5$ doped electrodes and $V_2O_5$ doped ceramic electrode appears at wavelength of 390nm and 500nm respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.21 no.5
• /
• pp.210-213
• /
• 2011

Glass-ceramics composed of $5Na_2O-36CaO-10TiO_2-xP_2O_5$ could be obtained with $P_2O_5$ content as following procedure: 1) leaching out $Ca_3(PO_4)_2$ crystals between $Ca_3(PO_4)_2$ and $NaTi_2(PO_4)_3$ selectively in 1 N HCl solution for 2 days, and 2) exchanging $Na^+$ ion to $Ag^+$ ion in Ag($NO_3$) solution for 1 day. Scanning electron microscope (SEM) and X-rat diffractometer (XRD) were measured to verify the proper synthesis of glass-ceramics. And anti-bacteria test was accomplished using Staphylococus aureus bacteria. In the results of anti-bacteria test, the bacteria were died perfectly after 3 hours.

• Journal of the Korean Ceramic Society
• /
• v.38 no.11
• /
• pp.1055-1059
• /
• 2001

Porous glass ceramics composed of Li$_2$O.-Ti $O_2$-P$_2$ $O_{5}$ -CaO were prepared by melting and 2 step heat treatment for nucleation at 61$0^{\circ}C$ and crystallization at 78$0^{\circ}C$. subsequently $\beta$-Ca$_3$(P $O_4$)$_2$crystal phase was selectively leached out in 1N-HC1 solution for 3 days, leaving Li $Ti_2$(P $O_4$)$_3$crystal phases. prepared porous glass ceramics were immersed in 1M AgN $O_3$solution for ion exchange. Staphylococcus aureus and salmonella typhi were used in this study. It was found taht the resultant porous glas ceramics show excellent bacteriostatic properties.

• Journal of the Korean Ceramic Society
• /
• v.37 no.4
• /
• pp.381-387
• /
• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• Proceedings of the KAIS Fall Conference
• /
• 2002.05a
• /
• pp.74-76
• /
• 2002

항균성 및 원적외선 방사량이 높은 원적외선 방사 항균 글라스 및 글라스 세라믹스의 양산화를 위한 유리 용융에 있어 대량용융의 가능성을 확인할 수 있었으며, 열처리온도는 5Li₂Oㆍ36CaOㆍ20TiO₂ㆍ27P₂O/sub 5/와 1Ag₂Oㆍ4Li₂Oㆍ36CaOㆍ20TiO₂ㆍ27P₂O/sub 5/ 조성에서 최적핵형성온도가 620℃, 최적결정성장온도가 각각 78℃, 800℃였다. 원가절감을 위산 건식법과 습식법의 결정상분석의 결과 피크의 차이는 거의 없었다. 이온교환의 경우 5.0mol AgNO₃수용액에 담지한 시편에서는 많은 LTP 결정상이 AgTP 결정상으로 변환되기 시작하여 1.0omol 농도의 AgNO₃ 수용액에서는 결정상의 주피크가 AgTP 절정상으로 변이 되었다. 이 결과로 AgNO₃ 수음액 0.5mol 농도 이상의 이온교환시 항균특성에 있어서도 매우 유리하리라 예상되어진다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.195.1-195.1
• /
• 2013

Cu는 금속 박막재료로서 높은 전기전도성을 지니고 있을 뿐만 아니라 Ag, Al, Pt 등 보다 비용이 저렴하여, 높은 전기전도성을 필요로 하는 박막 재료로써 폭넓게 사용되고 있다. 그러나, 낮은 기계적 특성을 지니고 있어서 interconnect와 같은 작은 단면적의 배선재료로 사용될 경우, 높은 전류밀도에 따른 electromigration 현상에 의하여 hillock 또는 void의 형성 등 박막재료의 변형이 생기게 되어서 전자소자의 수명이 단축된다는 단점이 있다. TiN은 금속재료 못지않은 높은 전기 전도성을 지니고 있을 뿐만 아니라, 금속재료에 비하여 높은 기계적 특성과 녹는점을 지니고 있어 다양한 분야로 사용되고 있다. 본 연구에서는 Cu와 TiN composite 박막을 soda-lime glass위에 증착하여 낮은 비저항 뿐만 아니라 Cu와 비교하여 기계적 특성이 향상된 박막을 제작하고자 하였다. Cu와 TiN composite 박막 증착을 위하여 DC reactive magnetron co-sputtering 장비를 사용하였으며, Cu와 Ti 타겟 power, Ar:N2 유량비(Flow rate)을 변화시켜 Cu와 Ti의 조성비 및 TiN의 결정성을 조절하였고, 이를 통하여 박막의 TiN 조성에 따른 낮은 비저항 값과 순수한 Cu 박막과 비교하여 높은 기계적 특성을 지닌 Cu-TiN 박막을 증착하였다. Cu-TiN composite 박막의 구조 및 조성은 SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometer), XPS (X-ray Photoelectron Spectroscopy)장비를 사용하여 분석하였으며, 전기전도도는 4-point probe를 사용하여 측정하였고, Knoop hardness 측정방법을 사용하여 박막의 기계적 특성을 측정하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.168-168
• /
• 2013

도전성 섬유(Conductive textile)는 섬유자체의 고유 특성을 유지하면서 전기적인 도전 특성을 갖는 섬유로서, Cu, Ag, Ni 등의 전기전도성이 높은 금속 박막을 증착하여 제작하고 있다. 그러나, 이러한 금속은 공기 중의 산소와 결합하여 쉽게 산화되는 특성을 지니고 있기 때문에 사용 중에 산화되어 도전 특성이 감소하는 단점이 있다. TiN은 금속 못지않은 높은 전기전도성을 지니고 있을 뿐만 아니라, 금속에 비하여 높은 경도에 따른 우수한 내마모 특성, 내부식성 및 낮은 마찰계수를 지니고 있다. 그러나, TiN은 경도가 높기 때문에 섬유의 고유 특성인 유연성이 저하되는 문제가 있다. 본 연구에서는 면(Cotton), PE (Polyester), PP (Polypropylene) 등의 섬유 위에 TiN 박막을 증착하여, 섬유의 유연성을 유지하며 전기전도성과 내마모 특성이 우수한 도전성 섬유를 제작하고자 하였다. TiN 박막 증착을 위하여 ICP-assisted pulsed-DC reactive magnetron sputtering 장비를 사용하였으며, Ar:N2 유량비(Flow rate), Ti 타겟 power, ICP RF power 등을 변화시켜 Ti와 N의 조성비를 조절하였고, 이를 통하여 섬유의 휨이나 접힘에도 도전 특성이 변하지 않고 내마모 특성이 우수한 TiN 박막을 증착하였다. TiN 박막이 증착된 섬유의 전기전도도는 일정한 압력 하에 전기전도도를 측정할 수 있는 장치를 제작하여 측정하였으며, 표면 조성 분포 및 접합력 측정을 위하여 XPS (X-ray Photoelectron Spectroscopy)와 Peel-tester를 이용하였다.