• 제목/요약/키워드: Ti thickness

검색결과 1,121건 처리시간 0.029초

티타늄 및 구리증착이 알루미나 곡강도에 미치는 영향 (The Effect of Titanium and Copper Coatings on the Modulus of Rupture of Alumina)

  • 황하룡;이임렬
    • 한국표면공학회지
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    • 제27권1호
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    • pp.29-35
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    • 1994
  • The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

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EB-PVD법에 의한 Ti/TiN film 코팅된 스테인리스강 소결체의 표면특성 (The Surface Characteristics of Ti/TiN Film Coated Sintered Stainless Steels by EB-PVD Method)

  • 최한철
    • 한국표면공학회지
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    • 제34권3호
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    • pp.195-205
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    • 2001
  • The surface characteristics of Ti/TiN films coated on sintered stainless steels (SSS) by electron beam physical vapour deposition (EB-PVD) were investigated. Stainless steel compacts containing 2, 4, and 10wt%Cu were prepared by the electroless Cu-plating method, which results in increased homogenization in the alloying powder. The specimens were coated with Ti and TiN with a 1.0$\mu\textrm{m}$ thickness respectively by EB-PVD. The microstructures were investigated using scanning electron microscopy (SEM). The corrosion behaviors were investigated using a potentiosat in 0.1 M $H_2$$SO_4$, and 0.1M HCl solutions and the corrosion surface was observed using SEM and XPS. The Ti coated specimens showed rough surface compared to Ti/TiN coated specimens. Ti and Ti/TiN coated SSS revealed a higher corrosion and pitting potential from anodic polarization curves than that of Ti and Ti/TiN uncoated SSS. In addition, Ti/TiN coated SSS containing 10wt% Cu exhibited good resistance to pitting corrosion due to the formation of a dense film on the surface and the decrease in interconnected porosity by electroless coated Cu.

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ZnO/Ti/ZnO 박막의 결정성 및 전기광학적 완성도 개선 연구 (Enhancements of Crystallization and Opto-Electrical performance of ZnO/Ti/ZnO Thin Films)

  • 장진규;김유성;이연학;최진영;이인식;김대욱;차병철;공영민;김대일
    • 한국표면공학회지
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    • 제56권2호
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    • pp.147-151
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    • 2023
  • Transparent ZnO (100 nm thick) and ZnO/Ti/ZnO (ZTZ) films were prepared with radio frequency (RF) and direct current (DC) magnetron sputtering on the glass substrate at room temperature. During the ZTZ film deposition, the thickness of the Ti interlayer was varied, such as 6, 9, 12, and 15 nm, while the thickness of ZnO films was kept at 50 nm to investigate the effect of the Ti interlayer on the crystallization and opto-electrical performance of the films. From the XRD pattern, it is concluded that the 9 nm thick Ti interlayer showed some characteristic peaks of Ti (200) and (220), and the grain size of the ZnO (002) enlarged from 13.32 to 15.28 nm as Ti interlayer thickness increased. In an opto-electrical performance observation, ZnO single-layer films show a figure of merit of 1.4×10-11 Ω-1, while ZTZ films with a 9 nm-thick Ti interlayer show a higher figure of merit of 2.0×10-5 Ω-1.

Atomic Layer Deposition for Energy Devices and Environmental Catalysts

  • Kim, Young Dok
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.77.2-77.2
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    • 2013
  • In this talk, I will briefly review recent results of my group related to application of atomic layer deposition (ALD) for fabricating environmental catalysts and organic solar cells. ALD was used for preparing thin films of TiO2 and NiO on mesporous silica with a mean pore size of 15 nm. Upon depositing TiO2 thin films of TiO2 using ALD, the mesoporous structure of the silica substrate was preserved to some extent. We show that efficiency for removing toluene by adsorption and catalytic oxidation is dependent of mean thickness of TiO2 deposited on silica, i.e., fine tuning of the thickness of thin film using ALD can be beneficial for preparing high-performing adsorbents and oxidation catalysts of volatile organic compound. NiO/silica system prepared by ALD was used for catalysts of chemical conversion of CO2. Here, NiO nanoparticles are well dispersed on silica and confiend in the pore, showing high catalytic activity and stability at 800oC for CO2 reforming of methane reaction. We also used ALD for surface modulation of buffer layers of organic solar cell. TiO2 and ZnO thin films were deposited on wet-chemically prepared ZnO ripple structures, and thin films with mean thickness of ~2 nm showed highest power conversion efficiency of organic solar cell. Moreover, performance of ALD-prepared organic solar cells were shown to be more stable than those without ALD. Thin films of oxides deposited on ZnO ripple buffer layer could heal defect sites of ZnO, which can act as recombination center of electrons and holes.

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$BaTiO_3/SrTiO_3$ 이종층 후막의 유전특성 (The Dielectric Properties of $BaTiO_3/SrTiO_3$ Heterolayered Thick Films)

  • 남성필;이상철;이성갑;이영희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2004년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.58-60
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    • 2004
  • The $BaTiO_3/SrTiO_3$ heterolayered thick films were fabricated on alumina substrate by screening printing method. The obtained films were sintered at $1400^{\circ}C$ with bottom electrode of Pt for 2 hours. The structural and electrical properties of $BaTiO_3/SrTiO_3$ heterolayered thick films were compared with pure $BaTiO_3$ and $SrTiO_3$ films. The (Ba,Sr)$TiO_3$ phase was appeared at the $BaTiO_3/SrTiO_3$ heterolayered thick films. The thickness of $BaTiO_3/SrTiO_3$ heterolayered thick film, obtained by one printing, was about $50{\mu}m$. The dielectric constant and dielectric loss of the $BaTiO_3/SrTiO_3$ heterolayered thick films were about 1964, 5.5% at 1KHz, respectively.

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RF 마그네트론 스퍼터링법에 의해 증착된 $Ba_{0.65}Sr_{0.35}TiO_3$ 박막의 전기적 특성 분석 (Characterization of Electrical Properties of $Ba_{0.65}Sr_{0.35}TiO_3$Thin Films Deposited by RF Magnetron Sputtering)

  • 양기덕;조호진;조해석;김형준
    • 한국세라믹학회지
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    • 제32권4호
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    • pp.441-447
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    • 1995
  • Ba0.65Sr0.35TiO3 (BST) thin films were deposited on Pt/SiO2/Si(100) substrate by rf magnetron sputtering. The substrate temperature changed from 35$0^{\circ}C$ to 55$0^{\circ}C$ and crystalline BST thin films were deposited above 45$0^{\circ}C$. Most of the films had (111) preferred orientation regardless of deposition temperature, but the films changed to (100) preferred orientation as gas pressure increased. The dielectric constant increased with increasing substrate temperature and film thickness, and ranged from 100 to 600 at room temperature. The leakage current increased as substrate temperature increased or as film thickness decreased.

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상부전극 두께가 우선방위를 갖는 $Pb(Zr, Ti)O_3$ 박막의 강유전체 특성에 미치는 영향 (Effects of Top Electrode Thickness on Ferroelectric Properties of Preferentially Oriented $Pb(Zr, Ti)O_3$Thin Films)

  • 고가연;이은구;이종국;박진성;김선재
    • 한국세라믹학회지
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    • 제36권10호
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    • pp.1035-1039
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    • 1999
  • Ferroelectric properties and reliability characteristics of(111) and (100) preferentially oriented tetragonal Pb(Zr0.2Ti0.8)O3 (PZT) thin film capacitors have been investigated as a function of the top electrode thickness. The (111) preferentially oriented film exhibits 180$^{\circ}$domain switching process with better squareness of hysterisis loop and abrupt change of small singal capacitance-voltage comparing to the (100) preferentially oriented film having 90$^{\circ}$ domain switching process. The domain swithcing process of tetragonal phase PZT is different from that of rhobohedral phase. The film with thinner top electrode shows less initial switching polarization due to less compressive stress but it exhibits better endurance characteristics due to enhancing partial switching region.

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이종접합 SrBi$_2Ta_2O_9$/Pb(Zr,Ti)O$_3$박막 케패시터의 강유전 특성 (Ferroelectric Properties of Hetero-Junction SrBi$_2Ta_2O_9$/Pb(Zr,Ti)O$_3$)

  • 이광배;김종탁
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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    • pp.217-221
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    • 1997
  • We have investigated the ferroelectric properties of multi-layered SrBi$_2$Ta$_2$$O_{9}$Pb(Zr,Ti)O$_3$, SBT/PZT, thin film capacitors. Specimens were prepared onto Pt-coated Si wafer by sol-gel method. Ferroelectric properties of these finns could be obtained only for thin SBT layers below 50nm in thickness. The values of dielectric constant and remnant polarization depend mainly on the thickness of SBT layer, which arises from the paraelectric interface layer between SBT and PZT due to the thermal diffusion of Pb. The value of remnant poarization of PZT/SBT is greater than that of SBT, and the plarization fatigue behaviors of PZT/SBT/Pt capacitors are somewhat improved as compared with those of PZT/Pt.t.

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$BaTiO_3$ 세라믹스의 절연파괴거동에 미치는 결정립 크기와 시편두께의 영향 (Grain Size and Thickness Effects of Electrical Breakdown Behavior of $BaTiO_3$ Ceramics)

  • 조경호;남효덕;박철우;이희영
    • 한국세라믹학회지
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    • 제33권11호
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    • pp.1217-1222
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    • 1996
  • Undoped barium titanate ceramic samples with high density were produced by using both high purity hydro-thermally synthesized and oxalate-derived powders. Sintering temperature was varied in the temperature range 128$0^{\circ}C$-140$0^{\circ}C$ to control the average grain sizes of the samples. Electrical breakdown test was performed at two different temperature with 3$0^{\circ}C$(below Tc) and 15$0^{\circ}C$ (above Tc) for samples immersed in silicon oil bath using 60kV dc power supply. From the experimental results at below and above Curie temperature the grain size and thickness dependence of electrical breakdown strength for BaTiO3 ceramics was presented and breakdown behavior was also studied.

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포토리소그래피 공정으로 제작된 터치스크린패널용 금속메시 (Thin Metal Meshes for Touch Screen Panel Prepared by Photolithography)

  • 김서한;송풍근
    • 한국표면공학회지
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    • 제49권6호
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    • pp.575-579
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    • 2016
  • The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.