• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.171-172
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• 2009

TSV(through via silicon)를 이용한 Via의 Cu 충전에서 Seed 층의 역할은 전류의 흐름을 가능하게 하는 중요한 역할을 하고 있다. Via에 각각 Ti/Au, Ti/Cu를 증착한 후 Ti/Cu가 Ti/Au를 대체 할 수 있는지를 알아보기 위해 먼저 실리콘 웨이퍼에 via를 형성하고, 형성된 via에 기능성 박막층으로 절연층(SiO2) 및 시드층을 형성하였다. 전해도금을 이용하여 Cu를 충전한 결과 Ti/Au 및 Ti/Cu를 증착한 두 시편 모두 via와 seed층 접합면에 박리 등의 결함이 없었고, via 내부 또한 void나 seam 등이 관찰되지 않고 우수하게 충전된 것을 확인할 수 있었다.

• Korean Journal of Materials Research
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• v.16 no.12
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• pp.754-760
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• 2006

Mercaptoundecanoic acid (MUA) has been used to enhance the dispersity of Au nanoparticles in organic solvent and the affinity between the Au nanoparticles surface and titanium dioxide shell in the synthesis of $Au/TiO_2$ core-shell composite nanoparticles. The dispersity of the MUA-coated Au nanoparticles in ethanol aqueous solution with different concentration of $H_2O$ was investigated by UV-Vis. absorption spectrum and the coating amount of MUA was varied from 0.02 mM to 1.0 mM. The MUA-coated Au nanoparticles were highly dispersed in pure $H_2O$ in the wide range of the coating amount of MUA. On the contrary, the MUAcoated Au nanoparticles showed an enhanced stability in the ethanol/$H_2O$=8/2 mixed solution only when the coating amount of MUA was 0.05 mM, and in the ethanol/$H_2O$=7/3 mixed solution when the coating amount of MUA was in the range from 0.02 mM to 0.17 mM. From this systematic study, it can be inferred that the stability and the dispersibility of Au nanoparticles in organic solvents are highly sensitive towards the amount of MUA coating.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1361-1363
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• 2005

In this paper, we report on the performance stability of solution processible OTFT devices with Au/Ti and ITO source-drain (S/D) electrodes. It appears that the contact resistance of the S/D electrode strongly affects the stability of OTFT devices. Interestingly, the devices with the Au/Ti electrode showed lower mobility than those with the ITO (S/D) devices. The field effect mobilities of the devices with the Au/Ti and ITO electrodes were 0.06, and $0.44cm^2/Vs$, respectively. However, the mobility of the device with the Au/Ti electrode was increased up to $0.26cm^2/Vs$ after 2 weeks, while the mobility of the device with ITO electrode was slightly decreased down to $0.41cm^2/Vs$. The experimental data show us that ITO could be used as the S/D electrode for low-cost OTFT devices.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.187-187
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• 2011

지르코니아 ($ZrO_2$) 표면에 금속 (Au)으로 표면 코팅한 후 Ti-6Al-4V와 진공 브레이징 접합을 행하였다. 표면에 코팅한 Au 층의 영향을 비교 분석하기 위하여 Au를 코팅하지 않은 지르코니아도 모재로 사용하였다. 접합소재로는 Ag-Cu-Ti계 active filler를 사용하였다. $ZrO_2$/Ti-6Al-4V 브레이징 결과, active filler는 양측 모재 표면에 wetting 되었으며, Ti-6Al-4V 내부로 filler 확산으로 인하여 두 모재의 direct joint가 관찰되었다. 접합 계면 사이에 접합부 결함은 관찰되지 않았다.

• Journal of the Korean Vacuum Society
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• v.12 no.4
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• pp.218-227
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• 2003

Pd/Si/Ti/Pt and Pd/Si/Pd/Ti/Au ohmic contacts to n-type InCaAs were investigated for applications to AlGaAs/GaAs HBT emitter ohmic contacts. In the Pd/Si/Ti/Pt ohmic contact, as-deposited contact showed non-ohmic behavior, and high specific contact resistivity of $5\times10^{-3}\Omega\textrm{cm}^2$ was achieved by rapid thermal annealing at $375^{\circ}C$/10 sec. However, the specific contact resistivity decreased remarkably to $2\times10^{-6}\Omega\textrm{cm}^2$ by annealing at $425^{\circ}C$/10sec. In the Pd/Si/Pd/Ti/Au ohmic contact, minimum specific contact resistivity of $3.9\times10^{-7}\Omega\textrm{cm}^2$ was achieved by annealing at $400^{\circ}C$/20sec. In both ohmic contacts, low contact resistivity and non-spiking planar interface between ohmic materials and InGaAs were maintained. Therefore, these thermally stable ohmic contact systems are promising candidates for compound semiconductor devices. RF performance of the AlGaAs/GaAs HBT was also examined by employing the Pd/Si/Ti/Pt and Pd/Si/Pd/Ti/Au systems as emitter ohmic contacts. Cutoff frequencies were 63.9 ㎓ and 74.4 ㎓, respectively, and maximum oscillation frequencies were 50.1 ㎓ and 52.5 ㎓, respectively. It shows very successful high frequency operations.

• Proceedings of the Optical Society of Korea Conference
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• 2008.02a
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• pp.175-176
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• 2008

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.10
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• pp.943-949
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• 2008

We report on the development of transition edge sensors for x-ray detection. The sensor technology was based on the fabrication of a superconducting film on a thin membrane. A bilayer of a superconductor, Ti, and a noble metal, Au, was e-beam evaporated on a micromachined SiNx. Another Au layer was evaporated on the two side edges of the bilayer in order not to be affected by structural imperfections at the boundaries. With the method described in the present report, the superconducting transition temperature of the device was consistently achieved to near 80 mK with a sharp transition. The energy spectrum ueasured with the device provided 37 eV FWHM for 5.9 x-rays. We also discuss the design and fabrication considerations as well as the performance of the device in detail.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1998.09a
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• pp.103-111
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• 1998

Au fine particle dispersed TiO2 film was prepared on silica glass substrate by sol-gel dip and firing process. The films were fabricated from the system of titanium tetraisoproxie-EtOh-HCl_H2O-hydrogen tetrachloroaurate(III) tetrahydrate. The conditions for the formation of the clear solution and dissolving high concentration of Au compound were examined. And a photoreduction process was adopted to control the size of gold metal particles. Phase evolution of matrix TiO2 and variation of Au particle with UV irradiation were investigated by XRDA, SEM, TEM and UV-visible spectrophotometer. And the effect of CPCl(Cetylpyridinium chloride monohydrate) as a dispersion agent was evaluated.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.268-270
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• 2004

This paper reports a novel masking method with various mask materials for wet etching of glass. Various mask materials such as Cr/Au, Ti/Au, Polyimide and thick SU-8 photoresist were investigated for borosilicate glass (Borofloat33) etching in concentrated hydrofluoric acid (48% HF). Polyimide and thick SU-8 photoresist are not suitable as masking material due to its poor adhesion to glass surfaces. Titanium has good adhesion is suitable as the first layer to make multi-protective layers. The best protection was obtained with a combination of Ti/Au, polyimide and Ti/Au as masking material with etch depth of $350{\mu}m$ achieved.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.339-344
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• 2011

The Ohmic contact of Ti/Au metals on n-type ZnO thin film deposited on c-plane sapphire substrates by pulsed laser deposition was investigated by TLM (transfer length method) patterns. The Ti/Au metal films with thickness of 35 nm and 90 nm were deposited by electron-beam evaporator and thermal evaporator, respectively. By using the photo-lithography method, the $100{\times}100{\mu}m^2$ TLM patterns with $6{\sim}61{\mu}m$ gaps were formed. To improve the electrical properties as well as to decrease an interface states and stress between metal and semiconductor, the post-annelaing process was done in oxygen ambient by rapid thermal annealing system at temperature of $100{\sim}500^{\circ}C$ for 1 min. In this study, it appeared that the minimum specific contact resistivity shows about $1.1{\times}10^{-4}{\Omega}{\cdot}cm^2$ in $300^{\circ}C$ annealed sample, which may be originated from formation of oxygen vacancies of ZnO during an oxidation of Ti metal at the interface of Ohmic contacts.