• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1998년도 하계학술대회 논문집 D
• /
• pp.1428-1431
• /
• 1998

The polypropylene has been known to have higher melting temperature than polyethylene, and good mechanical properties. This paper introduces the experement result of dielectric breakdown properties to a polypropylene with a crystal structure. According to the experement, breakdown voltage is incresed when a thickness of thin film thinned. Spherulites of PP film prepared by annealing is larger than that of PE.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
• /
• pp.301-306
• /
• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method, and this process was found to be a very accurate method for SOI thickness control. During electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential(OCP) point, the passivation potential(PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM, respectively.

• 전자공학회논문지CI
• /
• 제38권3호
• /
• pp.55-60
• /
• 2001

본 논문에서는 퍼지 논리를 사용하여 지문 영상에 적용할 수 있는 효과적이 세선화 알고리즘을 제시한다. 제시하는 알고리즘은 잡영이 많이 포함된 영상이나 서로 다른 크기를 가진 영상도 효과적으로 향상시킬 수 있다. 문헌에 나타나는 대부분의 지문 영상 필터들은 특정 크기, 혹은 특정배율의 지문 영상을 대상으로 설계되었으나 본 논문이 제시하는 알고리즘은 영상 크기 변화에 따른 마스크의 크기와 계수 값의 재설계가 필요 없다.

• 천문학회지
• /
• 제29권spc1호
• /
• pp.381-383
• /
• 1996

A new CCD camera equipped with a large format chip is now under construction for the Kiso 105-cm Schmidt telescope. We use SITe TK2048E, of which pixel size is 24 ${\mu}m$ and chip size is 48 mm square. TK2048E is thinned back-illuminated so that it has high sensitivity in U-band. The chip is cooled by a refrigerator instead of liquid nitrogen. MESSIA III is used as CCD control system.

• 대한기계학회논문집A
• /
• 제29권4호
• /
• pp.606-613
• /
• 2005

Effects of circumferentially local wall thinning on the fracture behavior of pipes were investigated by monotonic four-point bending. Local wall thinning was machined on the pipes in order to simulate erosion/corrosion metal loss. The configurations of the eroded area included an eroded ratio of d/t= 0.2, 0.5, 0.6, and 0.8, and an eroded length of ${\ell}\;=10mm,$ 25mm, and 120mm. Fracture type could be classified into ovalization, local buckling, and crack initiation depending on the eroded length and eroded ratio. Three-dimensional elasto-plastic analyses were also carried out using the finite element method, which is able to accurately simulate fracture behaviors excepting failure due to cracking. It was possible to predict the crack initiation point by estimating true fracture ductility under multi-axial stress conditions at the center of the thinned area.

• Journal of Advanced Marine Engineering and Technology
• /
• 제29권6호
• /
• pp.637-644
• /
• 2005

This paper describes the numerical simulation of the interaction between longitudinal vortices ("common flow up") and a 3-D turbulent boundary layer over a flat plate To analyze the common flow up Produced from vortex generators. the flow field behind the vortex generators Is modeled by the information that is available from studies on a half-delta winglet. Also. the Reynolds-averaged Navier-Stokes equation for three-dimensional turbulent flows. together with a two-layer turbulence model to resolve the near-wall flow, is solved by the method of AF-ADI. The computational results predict that the boundary layer is thinned in the regions where the secondary flow is directed toward the wall and thickened where it is directed away from the wall Also. the numerical results. such as Reynolds stresses. turbulent kinetic energy and skin friction characteristics generated from the vortex generators . are reasonably close to the experimental data.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 추계학술대회논문집A
• /
• pp.61-66
• /
• 2001

Fracture behaviors of pipes with local wall thinning is very important for the integrity of nuclear power plant. In pipes of energy plants, sometimes, the local wall thinning may result from severe drosion-corrosion damage. However, effect of local wall thinning on strength and fracture behaviors of piping system were not well studied. In this paper, the monotonic bending tests were performed of full-scale carbon steel pipes with local wall thinning. A monotonic bending load was applied to straight pipe specimens by four-point loading at ambient temperature without internal pressure. From the tests, fracture behaviors and fracture strength of locally thinned pipe were manifested systematically. The observed failure modes were divided into four types; ovalization, ovalization+cracking, local buckling and local buckling+cracking. Also, maximum load was successfully evaluated.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 춘계학술대회 논문집
• /
• pp.921-926
• /
• 1997

SOI(Silicon On lnsulator) technology is many advantages in the gabrication of MOS(Metal-Oxide Semiconductor) and CMOS(Complementary MOS) structures. These include high speed, lower dynamic power consumption,greater packing density, increased radiation tolearence et al. In smiple form of bonded SOL wafer manufacturing, creation of a bonded SOI structure involves oxidizing at least one of the mirror polished silicon surfaces, cleaning the oxidized surface and the surface of the layer to which it will be bonded,bringing the two cleanded surfaces together in close physical proximity, allowing the subsequent room temperature bonding to proceed to completion, and than following this room temperature joining with some form of heat treatment step,and device wafer is thinned to the target thickness. This paper has been performed to investigate the possibility of the bonded SOI wafer manufacturing Especially, we focused on the bonding quality and thinning method. Finally,we achieved the bonded SOI wafer that Si layer thickness is below 3 .mu. m and average roughness is below 5.angs.

• 한국정밀공학회지
• /
• 제28권2호
• /
• pp.245-250
• /
• 2011

A high-resolution shadow mask, a nanostencil, is widely used for high resolution lithography. This high-resolution shadowmask is often fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. In this study, FIB milling on 500-nm-thin SiN membrane was tested and characterized. 500 nm thick and $2{\times}2$ mm large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 60 nm could be made into the membrane. The nanostencil could be used for nanoscale patterning by local deposition through the apertures.

• 대한전자공학회논문지SP
• /
• 제40권6호
• /
• pp.1-9
• /
• 2003

본 논문에서는 지문 영상의 컨벡스 (convex) 구조를 이용하여 특징점을 추출하는 방법을 제안하였다. 지문영상에서 융선은 일정한 방향성을 가지며 융선의 단면은 주기성이 있는 사인파로 간주할 수 있다. 사인파 신호에서 국부 최대 위치를 검출함으로써 대략적인 한 화소 단위의 융선 추출이 가능하며 사인파 신호의 볼록한 컨벡스는 융선 영역에 해당한다. 이러한 지문의 특징을 이용하여 특징점을 효과적으로 찾는 방법을 제안한다. 이 과정에서 파라미터를 없애고 계산량을 줄임으로써 다양한 환경의 시스템에 적용 가능함을 보였다.