• Title/Summary/Keyword: Thin wire

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Effect of Structure Change in Second-Generation Superconducting Wire Stabilization Layer on Resistivity Characteristics (2세대 초전도 선 안정화 층 구조변화가 비저항 특성에 미치는 영향)

  • Ban, Sang-Jae;Du, Ho-Ik;Jeong, Hyun-Gi;Doo, Seung-Gyu;Yang, Sung-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.2
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    • pp.172-177
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    • 2022
  • The quench voltage of the second-generation superconducting wire is affected by the resistivity characteristics of the stabilization layer. The specific resistance of the stabilization layer can be changed by the deposition process using RF magnetron sputtering. In this paper, a thin film made of a homogeneous material (Ag) and a dissimilar material (Cu) was deposited on the stabilization layer of the second-generation superconducting wire through RF magnetron sputtering. We found that the specific resistance was reduced by increasing the thickness of the stabilization layer. The reduction in the resistivity of the stabilization layer led to a decrease in the quench voltage of the second-generation superconducting wire. We suggest that various characteristic changes of the second-generation superconducting wire can be expected through the successful change in the resistivity of the stabilization layer of the proposed deposition process.

Eutectic Temperature Effect on Au Thin Film for the Formation of Si Nanostructures by Hot Wire Chemical Vapor Deposition

  • Ji, Hyung Yong;Parida, Bhaskar;Park, Seungil;Kim, MyeongJun;Peck, Jong Hyeon;Kim, Keunjoo
    • Current Photovoltaic Research
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    • v.1 no.1
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    • pp.63-68
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    • 2013
  • We investigated the effects of Au eutectic reaction on Si thin film growth by hot wire chemical vapor deposition. Small SiC and Si nano-particles fabricated through a wet etching process were coated and biased at 50 V on micro-textured Si p-n junction solar cells. Au thin film of 10 nm and a Si thin film of 100 nm were then deposited by an electron beam evaporator and hot wire chemical vapor deposition, respectively. The Si and SiC nano-particles and the Au thin film were structurally embedded in Si thin films. However, the Au thin film grew and eventually protruded from the Si thin film in the form of Au silicide nano-balls. This is attributed to the low eutectic bonding temperature ($363^{\circ}C$) of Au with Si, and the process was performed with a substrate that was pre-heated at a temperature of $450^{\circ}C$ during HWCVD. The nano-balls and structures showed various formations depending on the deposited metals and Si surface. Furthermore, the samples of Au nano-balls showed low reflectance due to surface plasmon and quantum confinement effects in a spectra range of short wavelength spectra range.

Experimental Study on Characteristics of Dry Wire Electrical Discharge Machining (EDM) Process (건성 와이어방전가공 프로세스 특성에 관한 실험적 연구)

  • Lee, Sang-Won;Kim, Hong-Seok
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.1
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    • pp.11-17
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    • 2010
  • This study investigates the non-traditional manufacturing process of dry wire electrical discharge machining (EDM) in which liquid dielectric is replaced by a gaseous medium. Wire EDM experiments of thin workpieces were conducted both in wet and dry EDM conditions to examine the effects of spark cycle (T), spark on-time ($T_{on}$), thickness of work pieces, and work material on machining performance. The material removal rate (MRR) in the dry wire EDM case was much lower than that in the wet wire EDM case. In addition, the thickness of workpiece and work-material were found to be critical factors influencing the MRR for dry EDM process. The relative ratios of spark, arc and short circuit were also calculated and compared to examine the effectiveness of processes of dry and wet wire EDM.

Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating

  • Soojae Park;Eunmin Cho;Myoungsik Baek;Eulgi Min;Kyujung Choi
    • Journal of the Microelectronics and Packaging Society
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    • v.31 no.2
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    • pp.1-8
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    • 2024
  • Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al2O3 passivation.

Transient Heat Transfer from a Suddenly Heated Verical Thin Wire (수직열선 근처의 과도 열전달 에 관한 실험적 연구)

  • 최만수;유정열;노승탁
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.7 no.4
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    • pp.461-468
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    • 1983
  • The series of experiments have been performed to study the transient heat transfer in air from a suddenly heated vertical thin wire. A platinum wire has been used as a resistance thermometer as well as a heating element to eliminate the disturbances in the measurements. The measured temperature as a function of time is compared with the calculated transient temperature with the aid of a pure conduction equation. The overshoot phenomena in terms of the Nusselt numbers have been detected and it is reasonable to define the delay time at which the onset of convection heat transfer occurs. The measured data are compared with the existing steady-state data and the agreements are reasonable within the comparable ranges.

Wire-tension Control System using Photo-interrupter Sensor and Micro-electrode Fabrication (광단속센서를 이용한 와이어장력 제어장치 및 마이크로전극 제조)

  • Kang, Myung Chang;Lee, Chang Hoon;Kim, Nam-Kyung
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.3
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    • pp.28-35
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    • 2013
  • Micro electrical discharge machining (EDM) as a non-contact machining process is very effective for micromachining with a thin electrode because of its low machining reaction force. The micro-electrode machining device has the advantage of maintaining high precision through the whole processes and uses a feeding wire in the thin electrode tool manufacturing process. This study describes the design and evaluation of a micro-electrode machining device using optical photo-interrupter. The electrode was fabricated by reverse electrical discharge machining. The performance of designed system was evaluated to measure tension force according to feed speed of wire. This system for micro electrode fabrication proves the feasibility in the micro-EDM process of the micro holes and parts for industrial applications.

A Study on Laser Micro Joining of Small Diameter Gold Wires to Nickel Thin Films (미소 직경 골드 와이어와 니켈 박막의 레이저 마이크로 접합에 관한 연구)

  • Park, K.W.;Na, S.J.
    • Laser Solutions
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    • v.10 no.2
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    • pp.25-28
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    • 2007
  • Rapidity and flexibility are very important in the electronic components industry. The laser process provides the industry with more rapidity and flexibility. For this reason, the laser process is considered as an acceptable method in terms of rapidity and flexibility. In this study, a wide range of experiments have been carried out on the gold wire-to-nickel thin film joining using the continuous wave fiber laser. In particular, changes in the shape of joint depending on the changes of a target point have been observed.

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A Study of the Behavior of Droplet Impacting on a Horizontal Wire (수평 와이어와 충돌하는 액적 거동에 관한 연구)

  • Kang, W.J.;Kim, J.Y.;Park, J.H.;Kang, B.S.
    • Journal of ILASS-Korea
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    • v.25 no.3
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    • pp.103-110
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    • 2020
  • In this study, the behavior of water droplet impacting on a thin horizontal wire was visualized by time-delay photography. The impact behavior modes, critical capture speed and trapped mass were analyzed by changing the droplet size, velocity, wire diameter and eccentricity ratio. As the Weber number increased, the hanging, merging, and splitting modes appeared sequentially for the case of central impact, and the hanging and non-splitting modes appeared for the case of off-center impact. The boundary We number of each mode was affected by the diameter ratio. The critical capture speed was affected much by the degree of eccentricity. For all diameter ratios, it was higher for the case of central impact than for off-center impact. The trapped mass was larger for the case of central impact than for off-center impact and it increased with the smaller We number and the larger diameter ratio.

Development of the Structure for Enhancing Capillary Force of the Thin Flat Heat Pipe Based on Extrusion Fabrication (압출형 박판 히트파이프의 모세관력 향상을 위한 구조 개발)

  • Moon, Seok Hwan;Park, Yoon Woo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.11
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    • pp.755-759
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    • 2016
  • The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

NO Gas Sensing Characteristics of Wire-Like Layered Composites Between Zinc Oxide and Carbon Nanotube (산화아연과 탄소나노튜브의 선형 층상 복합체의 일산화질소 가스 감지특성)

  • Kim, Ok-Kil;Kim, Hyo-Jin;Kim, Do-Jin
    • Korean Journal of Materials Research
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    • v.22 no.5
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    • pp.237-242
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    • 2012
  • We report on the NO gas sensing properties of Al-doped zinc oxide-carbon nanotube (ZnO-CNT) wire-like layered composites fabricated by coaxially coating Al-doped ZnO thin films on randomly oriented single-walled carbon nanotubes. We were able to wrap thin ZnO layers around the CNTs using the pulsed laser deposition method, forming wire-like nanostructures of ZnO-CNT. Microstructural observations revealed an ultrathin wire-like structure with a diameter of several tens of nm. Gas sensors based on ZnO-CNT wire-like layered composites were found to exhibit a novel sensing capability that originated from the genuine characteristics of the composites. Specifically, it was observed by measured gas sensing characteristics that the gas sensors based on ZnO-CNT layered composites showed a very high sensitivity of above 1,500% for NO gas in dry air at an optimal operating temperature of $200^{\circ}C$; the sensors also showed a low NO gas detection limit at a sub-ppm level in dry air. The enhanced gas sensing properties of the ZnO-CNT wire-like layered composites are ascribed to a catalytic effect of Al elements on the surface reaction and an increase in the effective surface reaction area of the active ZnO layer due to the coating of CNT templates with a higher surface-to-volume ratio structure. These results suggest that ZnO-CNT composites made of ultrathin Al-doped ZnO layers uniformly coated around carbon nanotubes can be promising materials for use in practical high-performance NO gas sensors.