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Development of the Structure for Enhancing Capillary Force of the Thin Flat Heat Pipe Based on Extrusion Fabrication

압출형 박판 히트파이프의 모세관력 향상을 위한 구조 개발

  • 문석환 (한국전자통신연구원 3D신소자연구실) ;
  • 박윤우 (충북대학교 기계공학부)
  • Received : 2016.01.29
  • Accepted : 2016.09.18
  • Published : 2016.11.01

Abstract

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

전자 통신 분야에서 히트파이프를 활용한 방열기술은 점차 늘어나고 있다. 특히 전자 패키지 응용에서는 원형 단면 히트파이프에 비해 평판 형상의 얇은 히트파이프가 보다 더 적용하기에 용이하다. 압출 공정에 기반한 평판 히트파이프는 내벽에 사각 단면 그루브들로 이루어진 단순한 모세관 윅 구조를 갖는다. 그루브 윅이 내벽에 다수 개 설치가 된다고 하더라도 상대적으로 높은 모세관력을 달성하기는 어렵다. 본 연구에서는 그루브 윅의 모세관력 향상을 위해 와이어 다발을 적용한 평판 히트파이프의 제작 및 성능평가 실험을 수행하였다. 실험을 통해 와이어 다발을 윅으로 갖는 평판 히트파이프의 열저항 및 열전달률이 그루브 윅 평판 히트파이프에 비해 각각 3.4배와 3.8배 가량 우수한 것으로 나타났다. 본 연구를 통해 와이어 다발을 통한 모세관력 향상 효과를 실험적으로 확인하였으며, 향후 상용화를 위한 연구를 진행할 계획이다.

Keywords

References

  1. Xie, H., Aghazadeh, M. and Toth, J., 1995, "The Use of Heat Pipes in the Cooling of Portables with High Power Packages," Proc. of the 45th Electronic Components & Technology Conference, pp. 906-913.
  2. Moon, S. H., Hwang, G., Chun, C. H. and Kim, Y. T., 2002, "Manufacturing and Thermal Performance of the Flat Plate Micro Heat Pipe," IMAPS ATW.
  3. Faghri, A., 1988, "Performance Characteristics of a Concentric Annular Heat Pipe Part II Vapor Flow Analysis," ASME Proc. of the 1988 National Heat Transfer Conference, Vol. 96, pp. 389-396.
  4. Wang, Y. X. and Peterson, G. P., 2002, "Optimization of Micro Heat Pipe Radiators in a Radiation Environment," J. of Thermophysics and Heat Transfer, Vol. 16, No. 4, pp. 537-546. https://doi.org/10.2514/2.6729
  5. Park, S. Y. and Boo, J. H., 2005, "An Experimental Study on the Thermal Performance of a Flat-Ship Hear Pipe with Inner Grooves and Screen Mesh Cover," Trans. Korean Soc. Mech. Eng. B, Vol. 29, No. 7, pp. 805-813. https://doi.org/10.3795/KSME-B.2005.29.7.805
  6. Ding, C., Soni, G.., Bozorgiet, P., Piorek, B., Meinhart, C. D. and MacDonald, N. C., 2008, "A Titanium-based Flat Heat Pipe," 2008 IMECE, IMECE2008-68967.
  7. Mansouri, J., Sassi, M. B. H., Maalej, S. and Zaghdoudi, M. C., 2010, "Theoretical and Experimental Study on the Thermal Performance of Flat Miniature Heat Pipes including Rectangular Axial Grooves," ThETA3, Article number 5766379, pp. 51-61
  8. Wang, C., Liu, Z., Zhang, G. and Zhang, M., 2013, "Experimental Investigations of Flat Plate Heat Pipes with Interlaced Narrow Grooves or Channels as Capillary Structure," Experimental Thermal and Fluid Science, Vol. 48, pp. 222-229. https://doi.org/10.1016/j.expthermflusci.2013.03.004
  9. Yang, Y. X., Wang, X. D., Luo, Y. and Zou, L. L., 2014, "Heat Transfer Characteristic of Flat Trapezoid Grooved Micro Heat Pipes," Key Engineering Materials, Vol. 609, pp. 1526-1531.
  10. Ghajar, M. and Darabi, J., 2014, "Evaporative Heat Transfer Analysis of a Micro Loop Heat Pipe with Rectangular Grooves," Int. J. of Thermal Sciences, Vol. 79, pp. 51-59. https://doi.org/10.1016/j.ijthermalsci.2013.12.014
  11. Moon, S. H., Hwang, G. and Lim, H. T., 2011, "Development of a Flat-Plate Heat Pipe for Electronic Packaging," ETRI Journal, Vol. 33, No. 4, pp. 645-647. https://doi.org/10.4218/etrij.11.0210.0322
  12. Holman, J. P., 2001, "Experimental methods for Engineers," McGraw Hill Com., New York.