• 제목/요약/키워드: Thin plastic substrate

검색결과 110건 처리시간 0.039초

유한요소해석에 의한 코팅면의 브리넬 경도 평가: 제2보 - 모재와 코팅두께의 영향 (Evaluation of Brinell Hardness of Coated Surface by Finite Element Analysis: Part 2 - Influence of Substrate and Coating Thickness)

  • 박태조;강정국
    • Tribology and Lubricants
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    • 제37권4호
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    • pp.144-150
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    • 2021
  • The most cost-effective method of reducing abrasive wear in mechanical parts is increasing their hardness with thin hard coatings. In practice, the composite hardness of the coated substrate is more important than that of the substrate or coating. After full unloading of the load applied to an indenter, its indentation hardness evaluated based on the dent created on the test piece was almost dependent on plastic deformation of the substrate. Following the first part of this study, which proposes a new Brinell hardness test method for a coated surface, the remainder of the study is focused on practical application of the method. Indentation analyses of a rigid sphere and elastic-perfect plastic materials were performed using finite element analysis software. The maximum principal stress and plastic strain distributions as well as the dent shapes according to the substrate yield stress and coating thickness were compared. The substrate yield stress had a significant effect on the dent size, which in turn determines the Brinell hardness. In particular, plastic deformation of the substrate produced dents regardless of the state of the coating layer. The hardness increase by coating behaved differently depending on the substrate yield stress, coating thickness, and indentation load. These results are expected to be useful when evaluating the composite hardness values of various coated friction surfaces.

Comparative Study on Hydrogen Behavior in InGaZnO Thin Film Transistors with a SiO2/SiNx/SiO2 Buffer on Polyimide and Glass Substrates

  • Han, Ki-Lim;Cho, Hyeon-Su;Ok, Kyung-Chul;Oh, Saeroonter;Park, Jin-Seong
    • Electronic Materials Letters
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    • 제14권6호
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    • pp.749-754
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    • 2018
  • Previous studies have reported on the mechanical robustness and chemical stability of flexible amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) on plastic substrates both in flat and curved states. In this study, we investigate how the polyimide (PI) substrate affects hydrogen concentration in the a-IGZO layer, which subsequently influences the device performance and stability under bias-temperature-stress. Hydrogen increases the carrier concentration in the active layer, but it also electrically deactivates intrinsic defects depending on its concentration. The influence of hydrogen varies between the TFTs fabricated on a glass substrate to those on a PI substrate. Hydrogen concentration is 5% lower in devices on a PI substrate after annealing, which increases the hysteresis characteristics from 0.22 to 0.55 V and also the threshold voltage shift under positive bias temperature stress by 2 ${\times}$ compared to the devices on a glass substrate. Hence, the analysis and control of hydrogen flux is crucial to maintaining good device performance and stability of a-IGZO TFTs.

Excimer laser crystallization of sputtered a-Si films on plastic substrates

  • Cho, Hans-S;Jung, Ji-Sim;Kim, Do-Young;Park, Young-Soo;Park, Kyung-Bae;Kwon, Jang-Yeon;Noguchi, Takashi
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.962-965
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    • 2004
  • In this work, thin films of amorphous silicon (a-Si) were formed on plastic substrates by sputtering deposition and crystallized using excimer laser irradiation. As the entire process is conducted at room temperature, and the laser irradiation-induced heating is confined to the thin film, the plastic substrate is not subjected to thermal stresses. The microstructure resulting from the laser irradiation was dependent on the laser irradiation energy density and the composition of the underlying buffer layers. It was found that a layer of AlN deposited as a buffer between the plastic and the a-Si film increased the endurance of the a-Si film under laser irradiation, and resulted in polycrystalline Si grains up to 100nm in diameter.

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이중 절연막 구조를 가전 플라스틱 유기 박막트랜지스터의 전기적 특성 (Electrical Characteristics of Organic Thin Film Transistors with Dual Layer Insulator on Plastic Substrates)

  • 최승진;이인규;박성규;김원근;문대규
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.194-197
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    • 2002
  • Applying dual layer insulator on plastic substrates improved electrical characteristics of organic thin film transistor(TFT). A high-quality silicon dioxide(SiO$_2$) suitable for a insulator was deposited on plastic substrates by e-beam evaporation at 110$^{\circ}C$. The insulator film which was treated by N$_2$ annealing at 150$^{\circ}C$ showed excellent I-V, C-V characteristics. The dual layer insulator structure of polyimide-SiO$_2$ improved the roughness of SiO$_2$ surface and showed very low leakage current. In addition, the flat band voltage has been reduced from -2.5V to about 0.5V.

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Manufacturing of Barix coated plastic barrier films; R2R vs. Batch

  • Kapoor, S.;Moro, L.;Chu, X.;Rutherford, N.;Ramos, T.;Visser, R.J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1722-1725
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    • 2007
  • We will discuss and compare the different ways to manufacture high performance Barix coated barrier films as a substrate for displays: R2R vs Batch. It will be shown that the barrier performance of the Barix coating on plastic can be as good as on glass substrates. More then 1000 hrs of testing at 60C/90RH can be passed without degradation of Ca samples

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Flexible Thin Film Encapsulation and Planarization Effectby Low Temperature Flowable Oxide Process

  • Yong, Sang Heon;Kim, Hoonbea;Chung, Ho Kyoon;Chae, Heeyeop
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.431-431
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    • 2013
  • Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

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Silicon Thin-film Transistors on Flexible Foil Substrates

  • Wagner, Sigurd;Gleskova, Helena
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.263-267
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    • 2002
  • We are standing at the beginning of the industrialization of flexible thin-film transistor backplanes. An important group of candidates is based on silicon thin films made on metal or plastic foils. The main features of amorphous, nanocrystalline and microcrystalline silicon films for TFTs are summarized, and their compatibility with foil substrate materials is discussed.

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Optimization of Amorphous Indium Gallium Zinc Oxide Thin Film for Transparent Thin Film Transistor Applications

  • Shin, Han Jae;Lee, Dong Ic;Yeom, Se-Hyuk;Seo, Chang Tae
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.352.1-352.1
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    • 2014
  • Indium Tin Oxide (ITO) films are the most extensively studied and commonly used as ones of TCO films. The ITO films having a high electric conductivity and high transparency are easily fabricated on glass substrate at a substrate temperature over $250^{\circ}C$. However, glass substrates are somewhat heavy and brittle, whereas plastic substrates are lightweight, unbreakable, and so on. For these reasons, it has been recently suggested to use plastic substrates for flexible display application instead of glass. Many reaearchers have tried to produce high quality thin films at rood temperatures by using several methods. Therefore, amorphous ITO films excluding thermal process exhibit a decrease in electrical conductivity and optical transparency with time and a very poor chemical stability. However the amorphous Indium Gallium Zinc Oxide (IGZO) offers several advantages. For typical instance, unlike either crystalline or amorphous ITO, same and higher than a-IGZO resistivity is found when no reactive oxygen is added to the sputter chamber, this greatly simplifies the deposition. We reported on the characteristics of a-IGZO thin films were fabricated by RF-magnetron sputtering method on the PEN substrate at room temperature using 3inch sputtering targets different rate of Zn. The homogeneous and stable targets were prepared by calcine and sintering process. Furthermore, two types of IGZO TFT design, a- IGZO source/drain material in TFT and the other a- ITO source/drain material, have been fabricated for comparison with each other. The experimental results reveal that the a- IGZO source/drain electrode in IGZO TFT is shown to be superior TFT performances, compared with a- ITO source/drain electrode in IGZO TFT.

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플라스틱 기판에 증착한 ZnO:Al 박막의 특성에 미치는 스퍼터 압력 효과 (Effects of Sputter Pressure on the Properties of Sputtered ZnO:Al Films Deposited on Plastic Substrate)

  • 이재형
    • 한국전기전자재료학회논문지
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    • 제22권3호
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    • pp.277-283
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    • 2009
  • In this paper, aluminum doped zinc oxide (ZnO:Al) thin films on plastic substrate such as poly carbonate (PC), polyethylene terephthalate (PET) were prepared by RF magnetron sputtering method for flexible solar cell applications. Effects of the sputter pressure on the structural, electrical and optical properties were investigated. The crystallinity and the degree of the (002) orientation were deteriorated with increasing the sputter pressure. When the sputter pressure was higher, the conductivity of ZnO:Al films was improved because of the high carrier concentration and the Hall mobility. High quality ZnO:Al films with resistivity as low as $1.9{\times}10^{-3}{\Omega}-cm$ and the optical transmittance over 80 % in the visible region have been obtained on PC substrate at 2 mTorr.

3.5 inch QCIF AMOLED Panel with Ultra Low Temperature Polycrystalline Silicon Thin Film Transistor on Plastic Substrate

  • Kim, Yong-Hae;Chung, Choong-Heui;Moon, Jae-Hyun;Park, Dong-Jin;Lee, Su-Jae;Kim, Gi-Heon;Song, Yoon-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.717-720
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    • 2007
  • We fabricated the 3.5 inch QCIF AMOLED panel with ultra low temperature polycrystalline silicon TFT on the plastic substrate. To reduce the leakage current, we used the triple layered gate metal structure. To reduce the stress from inorganic dielectric layer, we applied the organic interlayer dielectric and the photoactive insulating layer. By using the interlayer dielectric as a capacitor, the mask steps are reduced up to five.

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