• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.299-299
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• 2013

Indium Tin Oxide (ITO) has widely been used as a transparent conductive oxide (TCE) for photovoltaic devices. Lately, flexibility of ITO becomes an issue as demand of flexible device increases. Several scientists have tried to substitute ITO to different materials such as conductive polymer, graphene, CNT, and metal nanowire because of ITO brittleness. Among the substitute materials, PEDOT:PSS has mostly paid attention because PEDOT:PSS has excellent flexibility and good conductivity. The conductivity of PEDOT:PSS increases up to 1000 S/cm with additives such as DMSO, EG, sorbitol, and so on. In our research group, we introduce a conductive polymer PEDOT:PSS as a buffer layer to improve not only flexibility but also conductivity. As PEDOT:PSS layer forms beneath ITO thin film (20 nm), sheet resistance decreases from $230{\Omega}$/${\Box}$ to $85{\Omega}$/${\Box}$ and crack initiation decreases from 4.5 mm to 3.5 mm as well. We have fabricated organic photovoltaic device and power conversion efficiencies using conventional ITO electrode and ITO/PEDOT:PSS hybrid electrode. The photovoltaic property such as power conversion efficiency for ITO/PEDOT:PSS hybrid electrode is comparable to the value obtained using conventional ITO electrode on glass substrate.

• Journal of the Korean Vacuum Society
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• v.14 no.4
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• pp.238-244
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• 2005

IZO thin films are prepared on a corning 7059 glass substrate in a mixed gases of Ar +$O_2$ by rf-magnetron sputtering, using a powder target with a composition ratio of $In_{2}O_{3}$ : ZnO=90 : 10 $wt.\%$. Their electrical sheet resistance are strongly dependent on the oxygen concentration introduced during the deposition, a minimum resistivity of $3.7\times10^{-4}\Omega\cdot$ cm and an average transmittance over $85\%$ in the visible range are obtained in a film deposited in pure Ar gas which is close to near the stoichiometry. During the heat treatment from room temperature up tp $600^{\circ}C$ in various environments, the electrical resistance changes are explained by cyrstallizations or oxidizations of In metal and InO contained in the IZO film. The electrical properties due to oxygen adsorption and phase transitions occurring at temperatures over $40000^{\circ}C$ during heat treatment in air are also investigated.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.456-456
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• 2010

CMOS 소자가 서브마이크론($0.1\;{\mu}m$) 이하로 스케일다운 되면서 단채널 효과(short channel effect), 게이트 산화막(gate oxide)의 누설전류(leakage current)의 증가와 높은 직렬저항(series resistance) 등의 문제가 발생한다. CMOS 소자의 구동전류(drive current)를 높이고, 단채널 효과를 줄이기 위한 가장 효율적인 방법은 소스 및 드레인의 얕은 접합(shallow junction) 형성과 직렬 저항을 줄이는 것이다. 플라즈마 도핑 방법은 플라즈마 밀도 컨트롤, 주입 바이어스 전압 조절 등을 통해 저 에너지 이온주입법보다 기판 손상 및 표면 결함의 생성을 억제하면서 고농도로 얕은 접합을 형성할 수 있다. 그리고 얕은 접합을 형성하기 위해 주입된 불순물의 활성화와 확산을 위해 후속 열처리 공정은 높은 온도에서 짧은 시간 열처리하여 불순물 물질의 활성화를 높여주면서 열처리로 인한 접합 깊이를 얕게 해야 한다. 그러나 접합의 깊이가 줄어듦에 따라서 소스 및 드레인의 표면 저항(sheet resistance)과 접촉저항(contact resistance)이 급격하게 증가하는 문제점이 있다. 이러한 표면저항과 접촉저항을 줄이기 위한 방안으로 실리사이드 박막(silicide thin film)을 형성하는 방법이 사용되고 있다. 본 논문에서는 (100) p-type 웨이퍼 He(90 %) 가스로 희석된 $PH_3$(10 %) 가스를 사용하여 플라즈마 도핑을 실시하였다. 10 mTorr의 압력에서 200 W RF 파워를 인가하여 플라즈마를 생성하였고 도핑은 바이어스 전압 -1 kV에서 60 초 동안 실시하였다. 얕은 접합을 형성하기 위한 불순물의 활성화는 ArF(193 nm) excimer laser를 통해 $460\;mJ/cm^2$의 에니지로 열처리를 실시하였다. 그리고 낮은 접촉비저항과 표면저항을 얻기 위해 metal sputter를 통해 TiN/Ti를 $800/400\;{\AA}$ 증착하고 metal RTP를 사용하여 실리사이드 형성 온도를 $650{\sim}800^{\circ}C$까지 60 초 동안 열처리를 실시하여 $TiSi_2$ 박막을 형성하였다. 그리고 $TiSi_2$의 두께를 측정하기 위해 TEM(Transmission Electron Microscopy)을 측정하였다. 화학적 결합상태를 분석하기 위해 XPS(X-ray photoelectronic)와 XRD(X-ray diffraction)를 측정하였다. 접촉비저항, 접촉저항과 표면저항을 분석하기 위해 TLM(Transfer Length Method) 패턴을 제작하여 I-V 특성을 측정하였다. TEM 측정결과 $TiSi_2$의 두께는 약 $580{\AA}$ 정도이고 morphology는 안정적이고 실리사이드 집괴 현상은 발견되지 않았다. XPS와 XRD 분석결과 실리사이드 형성 온도가 $700^{\circ}C$에서 C54 형태의 $TiSi_2$ 박막이 형성되었고 가장 낮은 접촉비저항과 접촉저항 값을 가진다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.10
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• pp.1179-1185
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• 2011

Cold and hot-rolled carbon steel sheets are commonly used in railroad cars or commercial vehicles such as the automobile. The sheets used in these applications are mainly fabricated by spot welding, which is a type of electric resistance welding. However, the fatigue strength of a spot-welded joint is lower than that of the base metal because of high stress concentration at the nugget edge of the spot-welded part. In particular, the fatigue strength of the joint is influenced by not only geometrical and mechanical factors but also the welding conditions for the spot-welded joint. Therefore, there is a need for establishing a reasonable criterion for a long-life design for spot-welded structures. In this thesis, ${\Delta}P-N_f$ relation curves have been used to determine a long-life fatigue-design criterion for thin-sheet structures. However, as these curves vary under the influence of welding conditions, mechanical conditions, geometrical factors, etc. It is very difficult to systematically determine a fatigue-design criterion on the basis of these curves. Therefore, in order to eliminate such problems, the welding residual stresses generated during welding and the stress distributions around the weld generated by external forces were numerically and experimentally analyzed on the basis of the results, reassessed fatigue strength of gas welded joints.