• Title/Summary/Keyword: Thin film deposition

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Electrical characteristics of SiC thin film charge trap memory with barrier engineered tunnel layer

  • Han, Dong-Seok;Lee, Dong-Uk;Lee, Hyo-Jun;Kim, Eun-Kyu;You, Hee-Wook;Cho, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.255-255
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    • 2010
  • Recently, nonvolatile memories (NVM) of various types have been researched to improve the electrical performance such as program/erase voltages, speed and retention times. Also, the charge trap memory is a strong candidate to realize the ultra dense 20-nm scale NVM. Furthermore, the high charge efficiency and the thermal stability of SiC nanocrystals NVM with single $SiO_2$ tunnel barrier have been reported. [1-2] In this study, the SiC charge trap NVM was fabricated and electrical properties were characterized. The 100-nm thick Poly-Si layer was deposited to confined source/drain region by using low-pressure chemical vapor deposition (LP-CVD). After etching and lithography process for fabricate the gate region, the $Si_3N_4/SiO_2/Si_3N_4$ (NON) and $SiO_2/Si_3N_4/SiO_2$ (ONO) barrier engineered tunnel layer were deposited by using LP-CVD. The equivalent oxide thickness of NON and ONO tunnel layer are 5.2 nm and 5.6 nm, respectively. By using ultra-high vacuum magnetron sputtering with base pressure 3x10-10 Torr, the 2-nm SiC and 20-nm $SiO_2$ were successively deposited on ONO and NON tunnel layers. Finally, after deposited 200-nm thick Al layer, the source, drain and gate areas were defined by using reactive-ion etching and photolithography. The lengths of squire gate are $2\;{\mu}m$, $5\;{\mu}m$ and $10\;{\mu}m$. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer, E4980A LCR capacitor meter and an Agilent 81104A pulse pattern generator system. The electrical characteristics such as the memory effect, program/erase speeds, operation voltages, and retention time of SiC charge trap memory device with barrier engineered tunnel layer will be discussed.

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Preparation and C-V characteristics of $Y_2O_3-StabilzedZrO_2$ Thin Films by PE MO CVD (플라즈마 화학 증착법에 의한 $Y_2O_3-StabilzedZrO_2$박막의 제조와 Capacitance-Voltage특성)

  • Choe, Hu-Rak;Yun, Sun-Gil
    • Korean Journal of Materials Research
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    • v.4 no.5
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    • pp.510-515
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    • 1994
  • Yttria-stabilized zirconia(YSZ) films were prepared onto p-type (100) silicon wafer by a plasma-enhanced metallorganic chemical vapor deposition(PE MO CVD) processing involving the application of vapor mixture of tri(2.2.6.6-tetramethyl-3, 5-heptanate) yttrium$[Y(DPM)_3]$, zirconiumtriflouracethyla cetonate$(Zr(tfacac)_4$ and oxygen gas. The x-ray diffraction(XRD) and fourier transform infrared spectra(FT1R) results showed that the deposited YSZ films had a single cubic phase. $Y_2O_3$ content of YSZ film was analyzed by PIXE(partic1e induced x-ray emission). The experimental results by PIXE revealed that 12.lmol%, 20.4mol% and 31.6mol% $Y_2O_3$ could be obtained as the $Y(DPM)_3$ bubbling temperature varied at $160^{\circ}C, 165^{\circ}C$ and $170^{\circ}C$ respectively. The increase of $Y(DPM)_3$ bubbling temperature caused shifting flat band voltage to have a negative value.

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Effect of Plasma Treatment Times on the Adhesion of Cu/Ni Thin Film to Polyimide (폴리이미드와 Cu/Ni층과의 계면결합력에 미치는 플라즈마 처리 시간 효과)

  • Woo, Tae-Gyu;Park, Il-Song;Jung, Kwang-Hee;Jeon, Woo-Yong;Seol, Kyeong-Won
    • Korean Journal of Metals and Materials
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    • v.49 no.8
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    • pp.657-663
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    • 2011
  • This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

Large Area Deposition of Biomimetic Polydopamine-Graphene Oxide Hybrids using Langmuir-Schaefer Technique (랭뮤어-쉐퍼 기법 이용 생체모사 폴리도파민-산화그래핀 복합체 대면적 적층 기법 연구)

  • Kim, Tae-Ho;Song, Seok Hyun;Jo, Kyung-Il;Koo, Jaseung
    • Journal of Adhesion and Interface
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    • v.20 no.3
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    • pp.110-115
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    • 2019
  • Graphene oxide has been gathering interests as a way to exfoliate graphene. Since the oxidation group of graphene oxide can hydrogen bond with various functional groups, tremendous efforts have been actively conducted to apply various applications. However, graphene oxide alone cannot substantially possess the mechanical properties required for the practical application. Therefore, in this study, polydopamine, which is a bio-mimetic mussel protein-inspired material, was combined with graphene oxide to form a large-area composite membrane at the liquid-gas interface. In addition, the morphology of the polydopamine-graphene oxide composite thin film was also controlled to obtain a composite membrane having a nano-wrinkle structure. It can be expected to be used in the next generation seawater desalination membranes or carbon composites because it can form mechanically superior and sophisticated nanostructures.

The Effect of Plasma Gas Composition on the Nanostructures and Optical Properties of TiO2 Films Prepared by Helicon-PECVD

  • Li, D.;Dai, S.;Goullet, A.;Granier, A.
    • Nano
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    • v.13 no.10
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    • pp.1850124.1-1850124.12
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    • 2018
  • $TiO_2$ films were deposited from oxygen/titanium tetraisopropoxide (TTIP) plasmas at low temperature by Helicon-PECVD at floating potential ($V_f$) or substrate self-bias of -50 V. The influence of titanium precursor partial pressure on the morphology, nanostructure and optical properties was investigated. Low titanium partial pressure ([TTIP] < 0.013 Pa) was applied by controlling the TTIP flow rate which is introduced by its own vapor pressure, whereas higher titanium partial pressure was formed through increasing the flow rate by using a carrier gas (CG). Then the precursor partial pressures [TTIP+CG] = 0:027 Pa and 0.093 Pa were obtained. At $V_f$, all the films exhibit a columnar structure, but the degree of inhomogeneity is decreased with the precursor partial pressure. Phase transformation from anatase ([TTIP] < 0.013 Pa) to amorphous ([TTIP+CG] = 0:093 Pa) has been evidenced since the $O^+_2$ ion to neutral flux ratio in the plasma was decreased and more carbon contained in the film. However, in the case of -50 V, the related growth rate for different precursor partial pressures is slightly (~15%) decreased. The columnar morphology at [TTIP] < 0.013 Pa has been changed into a granular structure, but still homogeneous columns are observed for [TTIP+CG] = 0:027 Pa and 0.093 Pa. Rutile phase has been generated at [TTIP] < 0:013 Pa. Ellipsometry measurements were performed on the films deposited at -50 V; results show that the precursor addition from low to high levels leads to a decrease in refractive index.

Characteristics by deposition and heat treatment of Cr and Al thin film on stainless steel (금속 기판위에 Cr과 Al 증착 및 열처리 융합 기술에 의한 표면 형상 변화)

  • Kim, Kyoung-Bo;Lee, Jongpil;Kim, Moojin
    • Journal of Convergence for Information Technology
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    • v.11 no.3
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    • pp.167-173
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    • 2021
  • There is an increasing interest in manufacturing various electronic devices on a bendable substrate. In this paper, we observed a surface morphology by annealing for 20 minutes at temperatures of 150 ℃, 350 ℃, and 550 ℃, respectively, with samples coated by chromium and aluminum. Data on surfaces are investigated using high-resolution SEM and AFM that can measure roughness up to nm. There is no difference from the sample without heat treatment up to 350 ℃, but the change of crystal grains can be observed at 550 ℃. In the future, for application to the flexible optoelectronic field, additional characteristics such as electrical conductivity and reflectivity will be analyzed and optical devices will be manufactured. In conclusion, we will explore the possibility of applying metal materials to flexible electronic devices.

Influence of Oxygen Annealing on Temperature Dependent Electrical Characteristics of Ga2O3/4H-SiC Heterojunction Diodes (산소 후열처리가 Ga2O3/4H-SiC 이종접합 다이오드의 온도에 따른 전기적 특성에 미치는 영향 분석)

  • Chung, Seung Hwan;Lee, Hyung Jin;Lee, Hee Jae;Byun, Dong Wook;Koo, Sang Mo
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.4
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    • pp.138-143
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    • 2022
  • We analyzed the influence of post-annealing on Ga2O3/n-type 4H-SiC heterojunction diode. Gallium oxide (Ga2O3) thin films were deposited by radio frequency (RF) sputtering. Post-deposition annealing at 950℃ in an Oxygen atmosphere was performed. The material properties of Ga2O3 and the electrical properties of the diodes were investigated. Atomic Force Microscopy (AFM), X-Ray Diffraction and Scanning Electron Microscope (SEM) images show a significant increase in the roughness and crystallinity of the O2-annealed films. After Oxygen annealing X-ray Photoelectron Spectroscopy (XPS) shows that the atomic ratio of oxygen increases which is related to a decrease in oxygen vacancy within the Ga2O3 film. The O2-annealed diodes exhibited higher on-current and lower leakage current. Moreover, the ideality factor, barrier height, and thermal activation energy were derived from the current-voltage curve by increasing the temperature from 298 - 434K.

Frictional Anisotropy of CVD Bi-Layer Graphene Correlated with Surface Corrugated Structures

  • Park, Seonha;Choi, Mingi;Kim, Seokjun;Kim, Songkil
    • Tribology and Lubricants
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    • v.38 no.6
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    • pp.235-240
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    • 2022
  • Atomically-thin 2D nanomaterials can be easily deformed and have surface corrugations which can influence the frictional characteristics of the 2D nanomaterials. Chemical vapor deposition (CVD) graphene can be grown in a wafer scale, which is suitable as a large-area surface coating film. The CVD growth involves cooling process to room temperature, and the thermal expansion coefficients mismatch between graphene and the metallic substrate induces a compressive strain in graphene, resulting in the surface corrugations such as wrinkles and atomic ripples. Such corrugations can induce the friction anisotropy of graphene, and therefore, accurate imaging of the surface corrugation is significant for better understanding about the friction anisotropy of CVD graphene. In this work, the combinatorial analysis using friction force microscopy (FFM) and transverse shear microscopy (TSM) was implemented to unveil the friction anisotropy of CVD bi-layer graphene. The periodic friction anisotropy of the wrinkles was measured following a sinusoidal curve depending on the angles between the wrinkles and the scanning tip, and the two domains were observed to have the different friction signals due to the different directions of the atomic ripples, which was confirmed by the high-resolution FFM and TSM imaging. In addition, we revealed that the atomic ripples can be easily suppressed by ironing the surface during AFM scans with an appropriate normal force. This work demonstrates that the friction anisotropy of CVD bilayer graphene is well-correlated with the corrugated structures and the local friction anisotropy induced by the atomic ripples can be controllably removed by simple AFM scans.

Tuning for Temperature Coefficient of Resistance Through Continuous Compositional Spread Sputtering Method (연속 조성 확산 증착 방법을 통한 저항 온도 계수의 튜닝)

  • Ji-Hun Park;Jeong-Woo Sun;Woo-Jin Choi;Sang-Joon Jin;Jin-Hwan Kim;Dong-Ho Jeon;Saeng-Soo Yun;Jae-Il Chun;Jin-Ju Lim;Wook Jo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.3
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    • pp.323-327
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    • 2024
  • The low-temperature coefficient of resistance (TCR) is a crucial factor in the development of space-grade resistors for temperature stability. Consequently, extensive research is underway to achieve zero TCR. In this study, resistors were deposited by co-sputtering nickel-chromium-based composite compositions, metals showing positive TCR, with SiO2, introducing negative TCR components. It was observed that achieving zero TCR is feasible by adjusting the proportion of negative TCR components in the deposited thin film resistors within certain compositions. Additionally, the correlation between TCR and deposition conditions, such as sputtering power, Ar pressure, and surface roughness, was investigated. We anticipate that these findings will contribute to the study of resistors with very low TCR, thereby enhancing the reliability of space-level resistors operating under high temperatures.

Comparison of Characteristics of Electrodeposited Lithium Electrodes Under Various Electroplating Conditions (다양한 전착조건에서 제작된 리튬 전극의 특성 연구)

  • Lim, Rana;Lee, Minhee;Kim, Jeom-Soo
    • Journal of the Korean Electrochemical Society
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    • v.22 no.3
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    • pp.128-137
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    • 2019
  • A lithium is the lightest metal on the earth. It has some attractive characteristics as a negative electrode material such as a low reduction potential (-3.04 V vs. SHE) and a high theoretical capacity ($3,860mAh\;g^{-1}$). Therefore, it has been studied as a next generation anode material for high energy lithium batteries. The thin lithium electrode is required to maximize the efficiency and energy density of the battery, but the physical roll-press method has a limitation in manufacturing thin lithium. In this study, thin lithium electrode was fabricated by electrodeposition under various conditions such as compositions of electrolytes and the current density. Deposited lithium showed strong relationship between process condition and its characteristics. The concentration of electrolyte affects to the shape of deposited lithium particle. As the concentration increases, the shape of particle changes from a sharp edged long one to a rounded lump. The former shape is favorable for suppressing dendrite formation and the elec-trode shows good stripping efficiency of 92.68% (3M LiFSI in DME, $0.4mA\;cm^{-2}$). The shape of deposited particle also affected by the applied current density. When the amount of current applied gets larger the shape changes to the sharp edged long one like the case of the low concentration electrolyte. The combination of salts and solvents, 1.5M LiFSI + 1.5M LiTFSI in DME : DOL [1 : 1 vol%] (Du-Co), was applied to the electrolyte for the lithium deposition. The lithium electrode obtained from this electrolyte composition shows the best stripping efficiency (97.26%) and the stable reversibility. This is presumed to be due to the stability of the surface film induced by the Li-F component and the DOL effect of providing film flexibility.