• Title/Summary/Keyword: Thin film deposition

Search Result 2,988, Processing Time 0.038 seconds

Properties of Electrical Destruction of Polyimide Thin Film Fabricated by The Methode of Electrophoretic Deposi pion (전기영동법을 이용한 폴리이미드 박막의 절연파괴특성)

  • 박귀만;김종석;박강식;김석기;정광희
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 1994.05a
    • /
    • pp.103-107
    • /
    • 1994
  • An experimental study was carried out to investigate the fabrication process and electrical breakdown of electrodeposted polyimide film from nonaqueous emulsion onto metal electrode surface. The thickness of imide film control led by the deposition voltage and time are proportional to the voltage or time. From the results, yeilds is proportional to the total elctrical charge flow through the electrode. When electrophoretic deposition voltage is 30 [V] deposition time is 30 sec, 40 sec, 50 sec, then the thickness of the films are 2.13 $\mu\textrm{m}$, 2.69 $\mu\textrm{m}$, 3.16 $\mu\textrm{m}$, 3.94 $\mu\textrm{m}$, respectively Electrical breakdown voltage of polyimide thin film shows very high. As film thicknes increase, the breakdown voltage are increased, but are net directly proprotional to thickness of the film.

  • PDF

Characterization of Chemical Vapor Condensation Reactor for Parylene-N Thin Film Deposition

  • Lee, Jong-Seung;Yeo, Seok-Ki;Park, Chin-Ho
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2003.07a
    • /
    • pp.897-900
    • /
    • 2003
  • Chemical vapor condensation (CVC) reactor was investigated for the deposition of Parylene-N thin films as the passivation layer for organic light emitting diodes (OLEDs). Several gas inlet manifold designs were tested to improve the deposition rate and its uniformity, and it was found that proper inlet design is crucial to get the desired film properties. Process characterization was also performed with the modified inlets to optimize the process variables.

  • PDF

Optimization of CdS buffer layers for $Cu_2ZnSnSe_4$ thin-film applications ($Cu_2ZnSnSe_4$ 태양전지의 적용을 위한 최적화 된 CdS 버퍼층 연구)

  • Kim, Gee-Yeong;Jeong, Ah-Reum;Jo, William
    • 한국태양에너지학회:학술대회논문집
    • /
    • 2012.03a
    • /
    • pp.400-403
    • /
    • 2012
  • $Cu_2ZnSnSe_4$(CZTSe) is emerged as a promising material for thin-film solar cells because of non-toxic, inexpensive and earth abundant more than $Cu(In,Ga)Se_2$ materials. For fabricating compound semiconductor thin-film solar cells, CdS is widely used for a buffer layer which fabricated by a chemical bath deposition method (CBD). Through the experiment, we controlled deposition temperature and mol ratio of solution conditions to find the proper grain 크기 and exact composition. The optimum CdS layers were characterized in terms of surface morphology by using a scanning electron microscope (SEM) and atomic force microscope (AFM). The optimized CdS layer process was applied on CZTSe thin-films. The thickness of buffer layer related with device performance of solar cells which controlled by deposition time. Local surface potential of CdS/CZTSe thin-films was investigated by Kelvin probe force microscopy (KPFM). From these results, we can deduce local electric properties with different thickness of buffer layer on CZTSe thin-films. Therefore, we investigated the effect of CdS buffer layer thickness on the CZTSe thin-films for decreasing device losses. From this study, we can suggest buffer layer thickness which contributes to efficiencies and device performance of CZTSe thin-film solar cells.

  • PDF

Laser Energy Density Dependence Characteristics of PLZT Thin Films prepared by a PLD for Memory Device (PLD법에 의한 고집적 DRAM용 PLZT 박막의 레이저 에너지 밀도에 따른 특성)

  • 마석범;장낙원;백동수;최형욱;박창엽
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.13 no.1
    • /
    • pp.60-65
    • /
    • 2000
  • The structural and electrical characteristics of PLZT thin films fabricated onto Pt/Ti/SiO\ulcorner/Si substrates by a pulsed laser deposition were investigated to develop the high dielectric thin films were fabricated with different energy density by pulsed laser deposition. This PLZT thin films of 5000 thickness were crystallized at 600 $^{\circ}C$, 200 mTorr O\ulcorner pressure for 2 J/$\textrm{cm}^2$ laser energy density, the arain structure was transformed from planar to columnar grain. It was clearly noted from the SEM observations that oxygen pressured laser powers affect microstructures of the PLZT thin films. 14/50/50 PLZT this film showed a maximum dielectric constant value of $\varepsilon$\ulcorner=1289.9. P-E hysteresis loop of 14/50/50 PLZT thin film was flim ferro-electric. Leakage current density of 14/50/50 PLZT thin film was 10\ulcorner A/$\textrm{cm}^2$.

  • PDF

Fabrication of Photocatalytic TiO2 thin Film Using Aerosol Deposition Method and its Filtration Characteristics (에어로졸 증착법을 이용한 광촉매 TiO2 박막 제조 및 박막의 여과 특성)

  • Choi, Wonyoul;Lee, Jinwoo;Kim, Shijun;Kim, Jongoh
    • Journal of the Korean GEO-environmental Society
    • /
    • v.11 no.1
    • /
    • pp.5-11
    • /
    • 2010
  • The objective of this study is to evaluate the effect of operational parameters such as rotation speed and vibrating milling time for the fabrication of photocatalytic $TiO_2$ thin film using aerosol deposition methods. $TiO_2$ powders produced in the range of 1,000-3,000 rpm of rotation speed of centrifugal separator are ineffective on the fabrication of $TiO_2$ thin film by aerosol deposition due to the problem of nozzle powder jam. $TiO_2$ powders controlled by vibrating milling had about 420 nm of average diameter after 2 hr of vibrating milling time. The result of XRD analysis indicated that $TiO_2$ powders had a anatase phase. Vibrating milling methods was considered to be an effective pre-treatment process for $TiO_2$ powder control. Consequently $TiO_2$ photocatalytic thin film with dispersion of anatase crystallites controled by vibrating milling was successfully fabricated by aerosol deposition. The permeation flux of $TiO_2$ photocatalytic thin film with the immobilized $TiO_2$ powder was higher than that of suspended $TiO_2$ powder. Therefore, $TiO_2$ photocatalytic thin film promises to be one of the effective methods for enhancing filtration performance for the treatment of organic pollutants.

C-axis Orientation of ZnO Thin Films Prepared by DC Facing Targets Sputtering Method (직류 대향타겟스퍼터링법으로 제작된 ZnO 박막의 c-축 배향성)

  • 금민종;손인환;공석현;성하윤;김경환
    • Journal of Surface Science and Engineering
    • /
    • v.33 no.1
    • /
    • pp.34-37
    • /
    • 2000
  • We prepared ZnO thin film with Facing Targets Sputtering system that can deposit thin film in plasma-free situation and change the deposition condition in wide range. And prepared thin film's c-axis orientation and grain size were analyzed by XRD (x-ray diffractometer). In the results, we suggest that FTS system is very suitable to preparing high quality ZnO thin film with good c-axis orientation.

  • PDF

New Approaches for Overcoming Current Issues of Plasma Sputtering Process During Organic-electronics Device Fabrication: Plasma Damage Free and Room Temperature Process for High Quality Metal Oxide Thin Film

  • Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.100-101
    • /
    • 2012
  • The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

  • PDF

The Mechanism of Gold Deposition by Thermal Evaporation

  • Mark C. Barnes;Kim, Doh-Y.;Nong M. Hwang
    • Proceedings of the Korea Association of Crystal Growth Conference
    • /
    • 2000.06a
    • /
    • pp.127-142
    • /
    • 2000
  • The charged cluster model states that chemical vapor deposition (CVD) begins with gas phase nucleation of charged clusters followed by cluster deposition on a substrate surface to form a thin film. A two-chambered CVD system, separated by a 1-mm orifice, was used to study gold deposition by thermal evaporation in order to determine if the CCM applies in this case. At a filament temperature of 1523 and 1773 K, the presence of nano-meter sized gold clusters was found to be positive and the cluster size and size distribution increased with increasing temperature. Small clusters were found to be amorphous and they combined with clusters already deposited on a substrate surface to form larger amorphous clusters on the surface. This work revealed that gold thin films deposited on a mica surface are the result of the sticking of 4-10 nm clusters. The topography of these films was similar to those reported previously under similar conditions.

  • PDF