• Title/Summary/Keyword: Thin Film Thickness

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Establishment of Preparation Conditions for High-Tc Superconducting Y-Ba-Cu-O Thin Film by Chemical Vapor Deposition (화학증착법에 의한 고온 초전도 Y-Ba-Cu-O 박막의 제조 조건 확립에 관한 연구)

  • Park, Joung-Shik;Cho, Ik-Joon;Kim, Chun-Yeong;Lee, Hee-Gyoun;Won, Dong-Yeon;Shin, Hyung-Shik
    • Applied Chemistry for Engineering
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    • v.3 no.3
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    • pp.412-421
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    • 1992
  • The superconducting thin films have shown a growing possibility for practical application in microelectronic fields in recent years. In this study, the high Tc superconducting Y-Ba-Cu-O thin films were prepared on various substrates by chemical vapor deposition method using organic metal chelates of $Y(thd)_3$, $Ba(thd)_2$, and $Cu(thd)_2$ as source materials. The deposition reactions were carried out on single crystalline MgO(100), YSZ(100), $SrTiO_3(100)$, and polycrystalline $SrTiO_3$ substrates. Deposition thickness of thin films was linearly increased with the increase of deposition time. It turned out that the Y-Ba-Cu-O thin films on MgO(100), YSZ(100), and $SrTiO_3(100)$ single crystal substrates showed superconductivities above liquid nitrogen temperature($T_{c,onset}=87{\sim}89K$, $T_{c,zero}=85{\sim}86K$), but the one on polycrystalline $SrTiO_3$ substrate did not.

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The Influences of Residual Stress on the Frequency of Ultrasonic Transducers with Composite Membrane Structure

  • Lee Seungmock;Kim Jong-Min;Shin Young-Eui
    • Journal of Mechanical Science and Technology
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    • v.20 no.1
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    • pp.76-84
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    • 2006
  • Arrayed ultrasonic sensors based on the piezoelectric thin film (lead-zirconate-titanate: Pb($Zr_{0.52}Ti_{0.48})O_{3}$) having composite membrane structure are fabricated. Different thermal and elastic characteristics of each layer generate the residual stress during the high temperature deposition processes, accomplished diaphragm is consequently bowing. We present the membrane deflection effects originated from the residual stress on the resonant frequencies of the sensor chips. The resonant frequencies ($f_r$) measured of each sensor structures are located in the range of $87.6{\sim}111\;kHz$, these are larger $30{\sim}40\;kHz$ than the resultant frequencies of FEM. The primary factors of $f_r$ deviations from the ideal FEM results are the membrane deflections, and the influence of stiffness variations are not so large on that. Membrane deflections have the effect of total thickness increase which sensitively change the $f_r$ to the positive direction. Stress generations of the membrane are also numerically predicted for considering the effect of stiffness variations on the $f_r$.

A Study on the Pipe Inner Coating by Plasma Processing (원자력 발전용 냉각수 파이프 내부 보호막 코팅기술의 개발에 관한 기초연구)

  • Sung, Y.M.;Park, H.K.;Kim, G.S.;Shin, J.H.;Cho, J.S.;Park, C.H.
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1290-1292
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    • 1995
  • A cylindrical-post magnetron sputtering system was designed for pipe inner coating. The discharge condition was depended on the gas pressure, magnetic field and pipe diameter. At given discharge current, discharge voltage increased a little with pipe diameter. The electron temperature and floating potential increased with magnetic field. The impact ion energy on the pipe increased with bias voltage. The TiN thin-film of $2{\mu}m$ thickness was formed by cylindrical-post magnetron sputtering system under the conditions of the pressure of 5mTorr, the applied voltage of 700V, the discharge current of 500mA, the magnetic field of 300G, and the bias voltage of -100V.

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A study on back surface of local back contact passivation according to research thin film thickness variation (Local back contact 구조 후면 passivation막의 두께에 따른 특성 연구)

  • Song, Kyuwan;Jang, Juyeun;Yi, Junsin
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.55.2-55.2
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    • 2010
  • 최근 태양전지에 대한 연구가 본격적으로 진행 중인 가운데 Local back contact 태양전지에 대한 연구가 새로운 이슈로 떠오르고 있다. LBC 구조의 태양전지는 후면 passivation에 대한 최적화 공정이 가장 중요하다. 후면 passivation으로 사용되는 물질로는 $SiO_2$, SiNx, $Al_2O_3$ 등의 산화막이 대표적이다. 본 연구에서는 LBC 구조 태양전지의 후면 passivation 박막으로 사용되는 $SiO_2$ 산화막의 공정가변에 따른 박막의 특성을 비교 분석하였다. $SiO_2$ 성장은 RTP를 사용하였다. 성장 온도 $850^{\circ}C$의 온도에서 진행하였으며, 4L/min의 $O_2$분위기에서 진행하였다. 공정 시간 5분 일 때 12.5nm, 15분 일 때 21.7nm의 두께의 박막을 성장 시킬 수 있었다. Carrier lifetime 확인 결과 박막의 두께가 얇을수록 lifetime이 향상함을 확인 할 수 있었고, C-V 측정을 통한 charge 비교를 통해 두께가 얇은 박막 일수록 더 적은 positive charge를 갖고있는 것을 확인 할 수 있었으며 이를 통해 passivation 효과가 우수함을 확인 할 수 있었다.

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3차원 LTCC 기판을 이용한 압전 압력 센서의 제작 및 연구 특성

  • Heo, Won-Yeong;Hwang, Hyeon-Seok;U, Hyeong-Gwan;Lee, Tae-Yong;Lee, Gyeong-Cheon;Sim, Deung;Song, Jun-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.118-118
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    • 2009
  • Low temperature co-fired ceramic (LTCC) is one of promising materials for MEMS structures because it has very good electrical and mechanical properties as well as possibility of making various three dimensional (3D) structures. In this work, piezoelectric pressure sensors based on hybrid LTCC technology were presented. The LTCC diaphragms with thickness of 400 um were fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The piezoelectric sensing layer consists of $Pb(ZrTi)O_3$ (PZT) thin film deposited by RF magnetron sputtering method on between top and bottom Au electrodes. The results showed that the fabrication method is very suitable for pressure sensor applications. The PZT films deposited on LTCC diaphragms were successfully grown and were analyzed by using X-ray diffraction method (XRD) and field emission scanning electron microscope (FESEM).

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Hysteresis-free organic field-effect transistors with ahigh dielectric strength cross-linked polyacrylate copolymer gate insulator

  • Xu, Wentao;Lim, Sang-Hoon;Rhee, Shi-Woo
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.11a
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    • pp.48.1-48.1
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    • 2009
  • Performance of organic field-effect transistors (OFETs) with various temperature-cured polyacrylate(PA) copolymer as a gate insulator was studied. The PA thin film, which was cured at an optimized temperature, showed high dielectric strength (>7 MV/cm), low leakage current density ($5{\times}10^{-9}\;A/cm^2$ at 1 MV/cm) and enabled negligible hysteresis in MIS capacitor and OFET. A field-effect mobility of ${\sim}0.6\;cm^2/V\;s$, on/off current ratio (Ion/Ioff) of ${\sim}10^5$ and inverse subthreshold slope (SS) as low as 1.22 V/decwere achieved. The high dielectric strength made it possible to scale down the thickness of dielectric, and low-voltage operation of -5 V was successfully realized. The chemical changes were monitored by FT-IR. The morphology and microstructure of the pentacene layer grown on PA dielectrics were also investigated and correlated with OFET device performance.

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Interfacial properties of ZrO$_2$ on silicon

  • Lin, Y.S.;Puthenkovilakam, R.;Chang, J.P.
    • Electrical & Electronic Materials
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    • v.16 no.9
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    • pp.65.1-65
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    • 2003
  • The interface of zirconium oxide thin films on silicon is analyzed in detail for their potential applications in the microelectronics. The formation of an interfacial layer of ZrSi$\sub$x/O$\sub$y. with graded Zr concentration is observed by the x-ray photoelectron spectroscopy and secondary ion mass spectrometry analysis. The as-deposited ZrO$_2$/ZrSi$\sub$x/O$\sub$y//Si sample is thermally stable up to 880$^{\circ}C$, but is less stable compared to the ZrO$_2$/SiO$_2$/Si samples. Post-deposition annealing in oxygen or ammonia improved the thermal stability of as-deposited ZrO$_2$/ZrSi$\sub$x/O$\sub$y/Si to 925$^{\circ}C$, likely due to the oxidation/nitridation of the interface. The as-deposited film had an equivalent oxide thickness of∼13 nm with a dielectric constant of ∼21 and a leakage current of 3.2${\times}$10e-3 A/$\textrm{cm}^2$ at 1.5V. Upon oxygen or ammonia annealing, the formation of SiO$\sub$x/ and SiH$\sub$x/N$\sub$y/O$\sub$z/ at the interface reduced the overall dielectric constants.

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Polarization property of dichromated gelatin hologram and it's application to holographic polarization separation element (Dichromated Gelatin 홀로그램의 편광 특성과 편광분리 소자 응용)

  • 이영락;임용석;곽종훈;최옥식;박진원;이윤우
    • Korean Journal of Optics and Photonics
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    • v.8 no.4
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    • pp.260-266
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    • 1997
  • Holographic optical elements for polarization separation (HPS) are fabricated in a dichromated gelatin(DCG) thin film of 7${\mu}{\textrm}{m}$ thickness. The polarization properties of HPS is characterized by measuring diffraction efficiency with several physical parameters like exposure time, incident angle and read-out polarization angles. The experimental data are compared with theoretical results based on Kogelnik's coupled wave theory, which shows good agreement. It is also found that the HPS element has a very high extinction ratio of polarization over 500:1 for S and P polarizations, respectively, with He-Ne laser wavelength. We also propose an optical switch optical interconnects by using HPS elements.

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Influence of PVP Content and Drying Condition on Microstructure of SrZrO3 Thin Films (SrZrO3 박막 미세조직에 미치는 PVP 결합제 첨가량 및 건조조건 영향)

  • 이세종;이득용;예경환;송요승
    • Journal of the Korean Ceramic Society
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    • v.40 no.5
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    • pp.501-505
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    • 2003
  • SrZrO$_3$ resistive oxides on Ag tapes were prepared by the sol-gel and dip coating method to investigate the effect of PVP content and drying condition on microstructure of the films. Although the film thickness increased with the addition of PVP, the amount of PVP and heat treatment were not effective to reduction of formation of microcracks at the films. However, lower drying temperature and longer drying time were beneficial to control the microcracks of the SrZrO$_3$ films, indicating that the microcracking of the films was governed primarily by the drying condition.

High Performance Wilkinson Power Divider Using Integrated Passive Technology on SI-GaAs Substrate

  • Wang, Cong;Qian, Cheng;Li, De-Zhong;Huang, Wen-Cheng;Kim, Nam-Young
    • Journal of electromagnetic engineering and science
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    • v.8 no.3
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    • pp.129-133
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    • 2008
  • An integrated passive device(IPD) technology by semi-insulating(SI)-GaAs-based fabrication has been developed to meet the ever increasing needs of size and cost reduction in wireless applications. This technology includes reliable NiCr thin film resistor, thick plated Cu/Au metal process to reduce resistive loss, high breakdown voltage metal-insulator-metal(MIM) capacitor due to a thinner dielectric thickness, lowest parasitic effect by multi air-bridged metal layers, air-bridges for inductor underpass and capacitor pick-up, and low chip cost by only 6 process layers. This paper presents the Wilkinson power divider with excellent performance for digital cellular system(DCS). The insertion loss of this power divider is - 0.43 dB and the port isolation greater than - 22 dB over the entire band. Return loss in input and output ports are - 23.4 dB and - 25.4 dB, respectively. The Wilkinson power divider based on SI-GaAs substrates is designed within die size of $1.42\;mm^2$.