• Journal of the Korean Electrochemical Society
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• v.3 no.4
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• pp.235-240
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• 2000

Screen-printing and doctor blade method were investigated and proposed as an electrode coating process for high power capacitor. CV measured from the amorphous $MnO_2$ electrode prepared by screen-printing shows closer to ideal capacitor characteristics. Specific capacitances calculated from CVs with potential scan rate of 50mV/s were 5.8, 81.8, and 172.0 F/g for electrode thickness of $140{\mu}m,\;24{\mu}m,\; 3{\mu}m$, respectively. Assumed that utilization of active $MnO_2$ in electrode of screen-printing is $100\%$, those were $3.4\%$ in one of paste method and $47.6\%$ in one of doctor blade method. The screen-printing can be good technique to coat thin film on current collector for high power application.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.4
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• pp.923-928
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• 2010

Anodic aluminum oxide (AAO) nanotemplates for nano electronic device applications have been attracting increasing interest because of ease of fabrication, low cost process, and possible fabrication in large area. The size and density of the nanostructured materials can be controlled by changing the pore diameter and the pole density of AAO nanotemplate. In this paper, nano porous alumina films AAO nanotemplate was fabricated by second anodization method using sputterd Al films. In addition, effects of electrolyte temperature and anodization voltate on the microstructure of porous alumina films were investigated. As the electrolyte temperature was increased from $8^{\circ}C$ to $20^{\circ}C$, the growth rate of nanoporous alumina films was increased from 86.2 nm/min to 179.5 nm/min. The AAO nanotemplate fabricated with optimal condition had the mean pore diameter of 70 nm and the pore depth of $1\;{\mu}m$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.1
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• pp.44-48
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• 2013

Niobium oxide($Nb_2O_5$) films were deposited on p-type Si wafers at room temperature using in-line pulsed-DC magnetron sputtering system with various frequencies. The different duty ratios were obtained by varying the frequency of pulsed DC power from 100 to 300 kHz at the fixed reverse time of $1.5{\mu}s$. From the thickness of the sputtered $NbO_x$ films, it was possible to obtain much higher deposition rate in case of pulsed-DC sputtering than RF sputtering. However, the similar leakage currents and structural characteristics were obtained from the metal-insulator-semiconductor(MIS) structure fabricated with the $NbO_x$ films and the x-ray photoelectron spectroscopy(XPS) results in spite of the different deposition rates. From the experimental results, the $NbO_x$ films sputtered by pulsed-DC sputtering are expected to be used in the fabrication process instead of RF sputtering.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.3
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• pp.168-174
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• 2016

A conductive oxide-based sapphire glass indium tin oxide/metal electrode and the optical coating, through patterning process was studied in excellent optical properties and integrated touch panel has a high strength. Indium tin oxide conductive oxides of the sapphire glass to 0.3 A at DC magnetron sputtering method of 10 min, gas flow Ar 10 Sccm Ar, $O_2$ 1.0 Sccm the formation conditions of the thin film after annealing at $550^{\circ}C$ for 30min was achieved through a 86% transmittance. In addition, the coating 130 nm hollow silica sol-gel was to improve the optical transmittance of the indium tin oxide to 91%. For the measurement by the modeling hollow silica sol by Macleod simulation and calculated the average values of silica part to the presence or absence in analogy to actual. Refractive index value and the actual value of the material on the simulation the transmittance difference is it does not completely match the air region similar to the actual value (transmission) could be confirmed that the measurement is set to a value of between 5 nm and 10 nm.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.1-6
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• 2008

Block copolymers spontaneously assemble into various nanoscale structures such as spheres, cylinders, and lamellar structures according to the relative volumn ratio of each macromolecular block and their overall molecular weights. The self-assembled structures of block copolymer have been extensively investigated for the applications such as nanocomposites, photonic crystals, nanowires, magnetic-storage media, flash memory devices. However, the naturally formed nanostructures of block copolymers contain a high density of defects such that the practical applications for nanoscale devices have been limited. For the practical application of block copolymer nanostructures, a robust process to direct the assembly of block copolymers in thin film geometry is required to be established. To exploit self-assembly of block copolymer for the nanotechnology, it is indispensible to fabricate defect-free self-assembled nanostructure over an arbitrarily large area.

• Corrosion Science and Technology
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• v.2 no.2
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• pp.88-92
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• 2003

The technique for in situ simultaneous measurements of IR-RAS and QCM, which has been developed for investigation of corrosion in gaseous environments, was employed to study the effects of an extremely thin water layer on the corrosion rate. An evaporated copper film on a QCM element was exposed to air containing water vapor and $SO_2$, and time-resolved IR-RAS spectra were measured and mass gains were simultaneously followed with QCM. The tested ranges of relative humidity (RH) and concentration of $SO_2$ were 60% - 90% and 1 - 20 ppm, respectively. On the basis of 2D-IR analysis, the corrosion products were determined to be Chevreul's salt ($CuSO_3Cu_2SO_3{\cdot}2H_2O$) and $CuSO_4{\cdot}5H_2O$. By constructing curves of the relations between band intensities of IR spectra and mass gains of QCM for the corrosion products, the time variations in each product were determined from spectral experiments on copper plates. The thicknesses of physically adsorbed water layers in course of the corrosion process were also determined from water band intensities. The results showed that the thickness of the physically adsorbed water layer increased with increase in RH, and it also increased with increase in accumulation of corrosion products. The latter is probably due to the capillary effect of the corrosion products.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.1
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• pp.37-42
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• 2012

LIFT (laser-induced forward transfer) is an advanced laser processing method used for selectively transferring micron-sized objects. In our study, this process was applied in order to deposit solder balls in microsystem packaging processes for electronics. Locally melted solder paste could be transferred to a rigid substrate using laser pulses. A thin glass plate with a solder cream layer was used as a donor film, and an IR laser pulse (wavelength = 1070 nm) was used to transfer a micron-sized solder ball to the receptor. Mass balance and energy balance were applied to analyze the shape and temperature profiles of the solder paste drops. The transferred solder bumps had measured diameters of 30-40 ${\mu}m$ and thicknesses of 50 ${\mu}m$ in our experiment. The limits and applications of this method are also presented.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.13.1-13.1
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• 2009

Transparent electronics has attracted many interests, for it can open new applications for consumer electronics, transportation, business, and military. Among them, display backplane, thin film transistor (TFT) array would be the most attractive application. Many researchers have been investigating oxide semiconductors for transparent channel material of TFT since the report for transparent amorphous oxide semiconductor (TAOS) TFT by Hosono group and ZnO TFT by Wager group. Especially, oxide TFTs have been intensively investigated during a couple of years since the first demonstration of ZnO-TFT driving AM-OLED. Many papers regarding the fabrication and performance of oxide TFTs, and active matrix display driven by oxide TFTs have been reported. Now lots of people have confidence in the competitiveness of oxide TFTs for the backplane of AM-Display. Especially, high mobility, uniformity, fairly good stability, and low cost process make oxide TFTs applied even to a large size AM-OLED. Last year, Samsung mobile display, former SID, reported 12" AM-OLED driven by IZGO-TFT and it seems that the remained issue for the mass production is the bias temperature stability. Here, we will introduce the application of oxide TFT and important issue for oxide TFT to be used for the direct printing.

• Membrane Journal
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• v.27 no.6
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• pp.506-510
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• 2017

The interfacial polymerization method has been applied to various fields as a reaction in which reactive monomers dissolved in two immiscible solutions cause polymerization at the interface. In the case of water treatment membranes, m-phenylene diamine and trimesoyl chloride are used as reactants. The performance of the membrane is affected by various polymerization factors. In this study, we investigated how the spreading rate of the organic solution influences the surface and structure of the membrane. Spreading rate of organic solutions was adjusted to 7.6 and 25 mm/sec. The solution volume of the organic phase was adjusted to 1~3 drops. The observed results showed that cracks were not found in the polyamide membrane when dropping at a drop of 7.6 mm/sec and dropping two drops at 25 mm/sec. On the other hand, cracks occurred in all cases. Therefore, the spreading rate of the initial organic solvent is expected to greatly affect the performance of the polyamide membrane.

• Electrical & Electronic Materials
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• v.9 no.1
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• pp.30-37
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• 1996

Previously, crystallization of a-Si:H films on glass substrates were limited to anneal temperature below 600.deg. C, over 10 hours to avoid glass shrinkage. Our study indicates that the crystallization is strongly influenced by anneal temperature and weakly affected by anneal duration time. Because of the high temperature process and nonconducting substrate requirements for poly-Si TFTs, the employed substrates were limited to quartz, sapphire, and oxidized Si wafer. We report on poly-Si TFT's using high temperature anneal on a Si:H/Mo structures. The metal Mo substrate was stable enough to allow 1000.deg. C anneal. A novel TFT fabrication was achieved by using part of the Mo substrate as drain and source ohmic contact electrode. The as-grown a-Si:H TFT was compared to anneal treated poly-Si TFT'S. Defect induced trap states of TFT's were examined using the thermally stimulated current (TSC) method. In some case, the poly-Si grain boundaries were passivated by hydrogen. A-SI:H and poly-Si TFT characteristics were investigated using an inverted staggered type TFT. The poly -Si films were achieved by various anneal techniques; isothermal, RTA, and excimer laser anneal. The TFT on as grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. Some films were annealed at temperatures from 200 to >$1000^{\circ}C$ The TFT on poly-Si showed an improved $I_on$$I_off$ ratio of $10_6$, reduced gate threshold voltage, and increased field effect mobility by three orders. Inverter operation was examined to verify logic circuit application using the poly Si TFTs.