• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.1
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• pp.12-16
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• 2011

In this study, we fabricated the flexible pentacene TFTs with the polymer gate dielectric and contact printing method by using the silver nano particle ink as a source/drain material on plastic substrate. In this experiment, to lower the cross-linking temperature of the PVP gate dielectric, UV-Ozone treatment has been used and the process temperature is lowered to $90^{\circ}C$ and the surface is optimized by various treatment to improve device characteristics. We tried various surface treatments; $O_2$ Plasma, hexamethyl-disilazane (HMDS) and octadecyltrichlorosilane (OTS) treatment methods of gate dielectric/semiconductor interface, which reduces trap states such as -OH group and grain boundary in order to improve the OTFTs properties. The optimized OTFT shows the device performance with field effect mobility, on/off current ratio, and the sub-threshold slope were extracted as $0.63cm^2 V^{-1}s^{-1}$, $1.7{\times}10^{-6}$, and of 0.75 V/decade, respectively.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.11 no.12
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• pp.5998-6016
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• 2017

In thin-film transistor liquid-crystal displays (TFT-LCDs), which are most commonly used in mobile devices, the backlight accounts for about 70% of the power consumption. Therefore, most low-power-related studies focus on realizing power savings through backlight dimming. Image compensation is performed to mitigate the visual distortion caused by the backlight dimming. Therefore, popular techniques include pixel compensation for brightness recovery and contrast enhancement, such as histogram equalization. However, existing pixel compensation techniques often have limitations with respect to blur owing to the pixel saturation phenomenon, or because contrast enhancement cannot adequately satisfy the human visual system (HVS). To overcome these, in this study, we propose a novel dimming technique to achieve both power saving and HVS-awareness by combining the pixel compensation and histogram specifications, which convert the original cumulative density function (CDF) by designing and using the desired CDF of an image. Because the process of obtaining the desired CDF is customized to consider image characteristics, histogram specification is found to achieve better HVS-awareness than histogram equalization. For the experiments, we employ the LIVE image database, and we use the structural similarity (SSIM) index to measure the degree of visual satisfaction. The experimental results show that the proposed technique achieves up to 15.9% increase in the SSIM index compared with existing dimming techniques that use pixel compensation and histogram equalization in the case of the same low-power ratio. Further, the results indicate that it achieves improved HVS-awareness and increased power saving concurrently compared with previous techniques.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.20-25
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• 2010

An integrated Mach-Zehnder interferometric sensor operating at 632.8 nm was designed and fabricated by the technology of planar rib waveguides. Rib waveguide based on silica system ($SiO_2-SiO_xN_y-SiO_2$) was geometrically designed to have single mode operation and high sensitivity. It was structured by semiconductor fabrication processes such as thin film deposition, photolithography, and RIE (Reactive Ion Etching). With the power observation, propagation loss measurement by cut-back method showed about 4.82 dB/cm for rib waveguides. Additionally the chromium mask process for an etch stop was employed to solve the core damaging problem in patterning the sensing zone on the chip. Refractive index measurement of water/ethanol mixture with this device finally showed a sensitivity of about $\pi$/($4.04{\times}10^{-3}$).

• Journal of Sensor Science and Technology
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• v.29 no.4
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• pp.266-269
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• 2020

In this study, we investigated the effect of a sulfur passivation (S-passivation) process step on the electrical properties of surface-channel In_0.7Ga_0.3As quantum-well (QW) metal-oxide-semiconductor field-effect transistors (MOSFETs) with S/D regrowth contacts. We fabricated long-channel In_0.7Ga_0.3As QW MOSFETs with and without (NH₄)₂S treatment and then deposited 1/4 nm of Al₂O₃/HfO₂ through atomic layer deposition. The devices with S-passivation exhibited lower values of subthreshold swing (74 mV/decade) and drain-induced barrier lowering (19 mV/V) than the devices without S-passivation. A conductance method was applied, and a low value of interface trap density D_it (2.83×10¹² cm^-2eV^-1) was obtained for the devices with S-passivation. Based on these results, interface traps between InGaAs and high-κ are other defect sources that need to be considered in future studies to improve III-V microsensor sensing platforms.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.4
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• pp.15-24
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• 2000

The dielectric relaxation of high-dielectric capacitors could be understood as a dynamic property of the capacitor in the time domain, which is regarded as a primarily important charge loss mechanism during the refresh time of DRAMs. Therefore, the equivalent circuit of the dielectric relaxation of the high-dielectric capacitor is essentially required to investigate its effects on DRAM. Nevertheless, There is not any theoretical method which is generally applied to realize the equivalent circuit of the dielectric relaxation. Recently, we have developed a novel procedure for the circuit modeling of the dielectric relaxation of high-dielectric capacitor utilizing the frequency domain. This procedure is a general method based on theoretical approach. We have also verified the feasibility of this procedure through experimental process. Finally, we successfully investigated the effect of dielectric relaxation on DRAM operation with the obtained equivalent circuit through this new method.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.633-636
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• 2003

In this work, We, for the first time, present the effects of the thermal annealing of the W/SiO$_2$ multi-layer quarter wavelength reflectors on the resonant properties of the ZnO-based SMR devices. In order to improve the resonant properties of the SMR devices, we annealed thermally the reflectors formed on a silicon substrate using a RF magnetron sputtering technique. As a result, the resonant properties of the SMR devices were observed to strongly depend on the annealing conditions applied to the reflectors. The SMR devices with the reflectors annealed at 40$0^{\circ}C$/30min showed excellent resonance properties as compared to those with the reflectors non-annealed (as-deposited). The newly proposed simple thermal annealing process will be very useful to more effectively improve the resonant properties of the future SMR devices with W/SiO$_2$ multi-layer quarter wavelength reflectors.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.361.2-361.2
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• 2014

Transition metal dichalcogenides (MoS2, WS2, WSe2, MoSe2, NbS2, NbSe2, etc.) are layered materials that can exhibit semiconducting, metallic and even superconducting behavior. In the bulk form, the semiconducting phases (MoS2, WS2, WSe2, MoSe2) have an indirect band gap. Recently, these layered systems have attracted a great deal of attention mainly due to their complementary electronic properties when compared to other two-dimensional materials, such as graphene (a semimetal) and boron nitride (an insulator). However, these bulk properties could be significantly modified when the system becomes mono-layered; the indirect band gap becomes direct. Such changes in the band structure when reducing the thickness of a WS2 film have important implications for the development of novel applications, such as valleytronics. In this work, we report for the controlled synthesis of large-area (~cm2) single-, bi-, and few-layer WS2 using a two-step process. WOx thin films were deposited onto a Si/SiO2 substrate, and these films were then sulfurized under vacuum in a second step occurring at high temperatures ($750^{\circ}C$). Furthermore, we have developed an efficient route to transfer these WS2 films onto different substrates, using concentrated HF. WS2 films of different thicknesses have been analyzed by optical microscopy, Raman spectroscopy, and high-resolution transmission electron microscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.347.1-347.1
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• 2014

최근, 박막 트랜지스터는 빠른 동작 속도, 낮은 공정비용 그리고 저온공정 등의 특성을 필요로 하고 있다. 그 중 indium-zinc oxide (InZnO)는 높은 전기적 특성, 높은 광 투과도 그리고 우수한 안정성 때문에 기존의 반도체를 대체할 수 있을 것으로 기대된다. InZnO의 경우 indium과 zinc의 조성비에 따라 특성 변화의 차이가 크기 때문에 다양한 조성비에 대한 연구가 보고되고 있는데, 기존의 InZnO 박막을 증착하는 방법의 경우에 조성비의 변화 과정에 많은 공정상의 어려움이 있다. 이 같은 문제점 때문에 조성비의 변화를 용이하게 할 수 있는 용액공정을 이용한 연구가 진행되고 있다. 또한 용액공정은 높은 균일성, 공정 시간 및 비용 감소 그리고 대면적화가 가능한 장점을 가지고 있다. 한편, 용액공정을 기반으로 한 InZnO의 경우에 용액 상태에서 고체 상태의 순수한 금속 산화물 상태로 바꾸기 위해 post-treatment 가 필요하다. 일반적으로 furnace 열처리 방법을 사용하는데, 이 경우 낮은 열효율 및 고비용 등의 문제점을 가지고 있다. 특히 glass 또는 flexible 기판의 경우 열처리 온도에 대한 제약이 있다. 이러한 문제를 해결하기 위한 방법으로 최근에 microwave irradiation를 이용한 저온 post-treatment 방법이 보고되고 있다. Microwave irradiation는 짧은 공정시간 및 열 균일성 등의 장점이 있다. 따라서 본 연구에서는 다양한 indium과 zinc의 조성비를 갖는 용액을 제작한 후 spin coating을 이용하여 증착한 InZnO 기반의 박막 트랜지스터를 제작하였다. Furnace와 microwave 방식으로 post-treatment 하여 비교 평가한 결과 microwave irradiation 한 경우 furnace 열처리 한 경우 보다 더 안정된 동작 전압을 가지는 것으로 나타났다. 따라서 저온공정이 가능한 microwave irradiation 방법으로 post-treatment 한다면 차세대 산화물 반도체로서의 적용이 가능할 것으로 기대된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.59-62
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• 1996

Plasma displays (PDP) as a large area wall-hanging display device are rabidly developed with flat CRT, TPT LCD and etc. Especially, AC Plasma Display Panels(AC PDPs) have the inherent memory function which is effective for large area displays. The memory function in AC PDPs is caused by the accumulation of the electrical charge on the protecting layer formed on the dielectric layer. This MgO protective layer prevents the dielectric layer from sputtering by ion in discharge plasma and also has the additional important roll in lowering the firing voltage due to the large secondary electron emission coefficient). Until now, the MgO Protective layer is mainly formed by E-Beam evaporation. With increasing the panel size, this process is difficult to attain cost reduction, and are not suitable for large quantity of production. To the contrary, the methode of shuttering are easy to apply on mass production and to enlarge the size of the panel and shows the superior adhesion and uniformity of thin film. In this study, we have prepared MgO protective layer on AC PDP Cell by reactive magnetron sputtering and studied the effect of MgO layer on the surface discharge characteristics of ac PDP.