• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.381-387
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• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• Proceedings of the Korean Magnestics Society Conference
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• 2000.09a
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• pp.369-376
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• 2000

Change of magnetic properties in CoCrPt/Ti perpendicular media with varying CoCrPt films thickness has been studied. As CoCrPt films thickness increase, the Ms(magnetization saturation) drastically increases at thinner thickness and gradually increases with further increase in thickness from 25nm. This Ms behaviour is associated with primarily the formation of "amorphous-like" reacted layer by intermixing of CoCrPt and Ti at CoCrPt/Ti interface and secondarily change of Cr segregation mode with varying the CoCrPt films thickness. Magnetic domain structure distinctively changes with increasing CoCrPt magnetic layer(ML) thickness. Also the strength of exchange coupling measured from the slope in demagnetizing region in M-H loop changes with ML thickness. Details of the above magnetic properties will be discussed. The expansion of lattice parameters a and c at thinner thickness suggests that Cr segregation mode may be connected with the residual stress of the films. Finally, negative nucleation field(Hn) behaviour with the exchange slope will be reported.

• Journal of the Korean institute of surface engineering
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• v.40 no.5
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• pp.225-233
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• 2007

Effects of alloying elements on the corrosion layer formation of Pb-grid/active materials interface has been researched for improvement of corrosion resistance of Pb-Ca alloy. For this research, various amounts of alloying elements such as Sn, Ag and Ba were added to the Pb-Ca alloys and investigated their corrosion behaviors. Batteries fabricated by using these alloys as cathode grids were subjected to life cycle test. Overcharge life cycle test was carried out at $75^{\circ}C$, 4.5 A, for 110 hrs. with KS standard (KSC 8504). And then, after keeping the battery with open circuit state for 48 hr, discharge was carried out at 300A for 30 sec. Corrosion morphology and interface between Pb-grid and active materials were investigated by using ICP, SEM, WDX, and LPM. Corrosion layer of Pb-Ca alloy got thicken with increasing Ca content. For Pb-Ca-Sn alloy, thickness of corrosion layer decreased as Sn and Ag content increased gradually. In case of Pb-Ca-Sn-Ba alloy, thickness of corrosion layer decreased up to 0.02 wt% Ba addition, whereas, it was not changed in case of above 0.02 wt% Ba addition.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.465-468
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• 1987

This paper describes a model to calculate the equilibrium electron density of MODFET at the interface that takes into account the simultaneous shallow and deep level in the Al-GaAs layer. In the present study we have made an investigation of the interface electron density with different values of the AlGaAs doping density and spacer layer thickness, considering simultaneously two doner levels. In this case, the ratio of the shallow to the deep donor concentraction is considered. From the comparison with early experimental results we could find the deep level and that the deep donor concentration is about 50% with the Al mole fraction X ${\sim}0.3$, activation energy Edx=65meV, temperature $77^{\circ}K$ and spacer thickness range $50A{\sim}100A$. Also we have investigated the effect of the temperature. As temperature increase, at critical mole fraction X the nature of the donor concentration changes from $\Gamma$ to L and X.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.452-452
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• 2011

Using ab initio calculations, we reveal the origins of the extraordinarily increased electric conductivity of the LaAlO3/SrTiO3 interface. In both of the two (LaAlO3)m/ SrTiO3 heterojunction models (m=3, 5), the oxygen atoms in the cells were displaced toward the n-type interface and the Ti-centered octahedron structure was compressed along the [001] direction by the atomic reconstructions at the (LaAlO3)m/(SrTiO3)4 interfaces. As a result, the 3dxy orbital of the Ti atom was preferentially occupied due to the lowered energy state of the 3dxy orbital, which arises from the crystal field asymmetry. We reason that the extra electrons occupy the 3dxy orbital are accumulated at the interface by the displacement of the oxygen atoms. This accumulation contributes to the conductivity of the n-type interface. In addition, through a comparison of the atomic displacements and charge accumulation amounts between the two thickness models (m=3, 5), the thickness-dependency of the conductivity can be explained.

• Journal of KSNVE
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• v.9 no.4
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• pp.643-651
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• 1999

A brief description of the current technology (contact-start-stop) employed in most of today's hard disk drive is presented. The dynamics and head/disk interactions during a start/stop process are very complicated and no one has been able to accurately model the interactions. Thus, the head/disk interface that meets the start/stop durability and stiction requirements are always developed statistically. In arriving at a solution. many sets of statistical tests are run by varying several parameters. such as, the carbon overcoat thickness. lubricant thickness. disk surface roughness, etc. Consequently, the cost associated III developing an interface could be significant since the outcome is difficult to predict. An alternative method known as Load/Unload technology alters the problem set. such that. the start/stop performance can be designed in a predictable manner. Although this techno¬logy offers superior performance and significantly reduces statistical testing time, it also has some potential problems. However. contrary to the CSS technology. most of the problems can be solved by design and not by trial and error. One critical problem is that of head/disk contacts during the loading and unloading processes. These contact can cause disk and slider damage because the contacts are likely to occur at high disk speeds resulting in large friction forces. Use of glass substrate disks also may present problems if not managed correctly. Due to the low thermal conductivity of glass substrates. any head/disk contacts may result in erasure due to frictional heating of the head/disk interface. In spite of these and other potential problems. the advantage with L/UL system is that these events can be understood. analyzed. and solved in a deterministic manner.

• Journal of Radiation Industry
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• v.5 no.1
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• pp.95-99
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• 2011

The electrical and mechanical properties of electrode for radiation detection are very important. In general, Au electrode and CZT crystal are combined to form ohmic contacts, and the best energy resolution is shown at the Au electrode. The metal contacts are fabricated by electroless deposition method, sputtering deposition method and thermal evaporation method. The electrode fabrication is easy with use of the thermal evaporation method, while an adhesive strength is weak. Thus interface materials such as Ag, Al and Ni were investigated to overcome defects generated by the this method. The thickness of the interface material between the Au electrode and the CZT crystal was 100 Angstroms, the Au electrode with thickness of 400 Angstroms was deposited. The Al+Au electrode is shown that the results of current-voltage and radiation response are similar to results of Au electrode.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.24 no.12
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• pp.1635-1643
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• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2003.10a
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• pp.383-388
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• 2003

This paper deals with the singular stresses developed in a polymer coating on concrete due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity dominates a very small region relative to layer thickness. Since the exceedingly large stresses at the interface corner cannot be borne by coating materials, local yielding or delamination can occur in the vicinity of free surface.