• Title/Summary/Keyword: Thick film technology

Search Result 414, Processing Time 0.025 seconds

Analysis of Fabrication Technology for Thick film Paste (Thick Film Paste제조 기술 분석)

  • Kim, Soo-Yong;Jung, Won-Chae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2002.11a
    • /
    • pp.354-357
    • /
    • 2002
  • 박막과 후막을 구분하고 현재에는 막의 형성 구분에 따라 박막에는 진공증착 후막에는 Screen Printing, Dipping, Brashing, Rolling으로 구분한다. 기술에는 여러 가져가 있는데, 금속 분말 제조기술, 유리분말제조기술, 유기바인더제조기술, 첨가제배합기술, 전자측정기술, 분체제어기술이 있다. 본 연구의 목표는 용도에 알맞은 최적화된 새로운 제조기술을 제시하고자 한다.

  • PDF

Characteristics of $\alpha$-$Fe_2O_3$ Thick Film Fabricated by Screen Printing Method

  • Kim, Byung-Soo;Chung, Yong-Sun;Auh, Keun-Ho
    • Proceedings of the Korea Association of Crystal Growth Conference
    • /
    • 1998.09a
    • /
    • pp.65-70
    • /
    • 1998
  • Fine powders of $\alpha$-Fe2O3 were prepared by precipitation method using iron (III) nitrate in ethanol solvent and the thick film using this powder was made by the screen printing technology. Effects of the reaction temperature and concentration of the iron (III) nitrate on the particle size and specific surface area were studied. Also, the relationship between the powder size and properties of the thick film was discussed.

  • PDF

An Experimental Study on the Manufacturing Method and Performance of Planar Thick Film Heaters for Electric Vehicle Heating (전기자동차의 난방용 면상 후막히터의 제조방법과 성능에 관한 실험적 연구)

  • Chae-Yeol Lee;Jong-Han Im;Jae-Wook Lee;Sang-Hee Park
    • Journal of the Korean Society of Industry Convergence
    • /
    • v.27 no.3
    • /
    • pp.685-692
    • /
    • 2024
  • Currently used heating elements are metal and non-metal heating elements, including various types of heaters, and resistance line heating elements have a problem of decreasing thermal efficiency over time, so to solve this problem, a planar heating element using high-purity carbon materials and oxidation-resistant inorganic compounds was applied. Through the manufacture of planar heating elements using CNT, ruthenium composite materials, and ruthenium oxide, physicochemical performance and capacity were increased, and instantaneous responsiveness was increased. Through thick film technology applicable to various base bodies, fine patterns were formed by the screening method in consideration of the fact that the performance of the heat source depends on the viscosity and pattern shape. The heating element was manufactured by thick film printing technology by mixing ruthenium oxide, CNT, Ag, etc. The characteristics of each paste were analyzed through viscosity measurement, and STS 430 was used as a base. Surface temperature and efficiency were measured by testing heaters manufactured for small wind tunnels and real-vehicle experiments. The surface temperature decreased as the air volume increased, and the optimal system boundary was found to be about 200 mm. Among the currently used heating elements, this paper manufactured a planar heating element using thick film technology to find out the relationship between air volume and temperature, and to study the surface temperature.

Characteristics of PMN-PZ-PT Thick Film Ceramic by Low-Temperature Sintering Aids (저온 소결 조제에 따른 PMN-PZ-PT 후막 세라믹 특성)

  • Jung, Myungwon;Jeon, Dae-Woo;Kim, Jin-Ho;Lee, Youngjin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.29 no.8
    • /
    • pp.476-482
    • /
    • 2016
  • Convectional PZT based piezoelectric ceramics have to sinter at high temperature about $1,200^{\circ}C$ for their suitable electrical properties. However, some issues: low temperature sintering piezoelectric ceramic composition and reliable internal electrode, have recently attracted a great deal of interest as a highly efficient multi-layered piezoelectric ceramics. In order to optimize low temperature sintering conditions of thick-film PMN-PZ-PT ceramic, it was investigated sintering and piezoelectric properties according to the change of $LiBiO_2$ contents. Thus, the superior piezoelectric properties were found at the pallet type PMN-PZ-PT optimized with low sintering processing at $925^{\circ}C$ including 7 wt% $LiBiO_2$ sintering aid. Consequentially, we successfully manufactured thick-film PMN-PZ-PT ceramics, which had superior piezoelectric and dielectric properties, with 5 wt% of $LiBiO_2$ sintering aid at temperature of $900^{\circ}C$.

Photo-imageable Thick-Film Lithography Technology for Embedded Passives Fabrication (내장형 수동소자의 제조를 위한 포토 이미징 후막리소그라피 기술)

  • Lim, Jong-Woo;Kim, Hyo-Tea;Kim, Jong-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2007.06a
    • /
    • pp.303-303
    • /
    • 2007
  • Photo-imageable thick-film lithography technology was developed for the fabrication of embedded passives such as inductors and capacitors. In this study, photo-imageable dielectric and conductor pastes have apoted a negative type. Sodalime glass wafer, alumina substrate and zero-shrinkage LTCC green tapes were used as substrates. In result, The lithographic patterns were designed as lines and spaces for conductor material, or via-holes for ceramic, LTCC, materials. The scattering and reflection of UV-beam on the substrate had negative effects on fine patterning. The patterning performance was varied with the exposing and developing process conditions, and also varied with the substrate materials. Fine resolution of less then $50/50{\mu}m$ in line and space was obtained, which is difficult in screen printing method.

  • PDF

Study on variation of electrical properties of polymer thick film resistor regarding curing temperature, printing process and substrate (경화 온도와 인쇄 공정 및 기판에 따른 폴리머 후막 저항체의 특성 변화에 대한 연구)

  • Yoo, Myong-Jae;Lee, Sang-Myong;Park, Seong-Dae;Lee, Woo-Sung;Kang, Nam-Kee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2005.07a
    • /
    • pp.311-312
    • /
    • 2005
  • Applying a designed test coupon pattern for fabricating resistors various resistors were formed using PTF(polymer thick film) pastes. Aspect ratio from 0.25 to 4 were selected for fabricating resistors. Formed resistors were cured at $170^{\circ}C$ and $240^{\circ}C$. Electrical properties of fabricated resistors were measured and their values analyzed in relation to cure temperature and formed geometry via printing. Also effects of substrates used for fabricating resistors were observed.

  • PDF

Thick Film Resistance Paste for Improving Reliability and TCR Properties of Embedded Resistor Board (내장형 저항 기판의 신뢰성과 TCR 개선을 위한 후막 저항 페이스트에 관한 연구)

  • Lee, S.M.;Yoo, M.J.;Park, S.D.;Kang, N.K.;Nam, S.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.15 no.1
    • /
    • pp.27-31
    • /
    • 2008
  • Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

  • PDF

Effect of the Oxide Glass on the Metal Sintering Behavior in Silver Thick-Film System

  • Chung Young Sir;Kim Ho-Gi
    • Proceedings of the Korean Ceranic Society Conference
    • /
    • 1986.12a
    • /
    • pp.259-267
    • /
    • 1986
  • The sintering behavior of silver-oxide glass composite thick-film has been studied with varing glass content. It is shown that during heat treatment glass became liquid phase to deeply affect the microstructure development of the silver particles and to control the physical properties of the thick-films. As glass content increased, the initial repacking of silver particles took place rapidly but the homogeneities of the microstructure showed different features. When the glass content was over some range, the silver particles exuded glass to decrease net energy and glass formed liquid pools separated from the solid skeletons. Finally the relations between the microstructures and electrical properties of the thick-film were discussed.

  • PDF

Effect of P(VDF/TrFE) Film Thickness on the Characteristics of Pyroelectric Passive Infrared Ray Sensor for Human Body Detection (P(VDF/TrFE) 필름의 두께에 따른 인체 감지형 초전형 PIR 적외선 센서의 특성)

  • Kwon, Sung-Yeol
    • Journal of Sensor Science and Technology
    • /
    • v.20 no.2
    • /
    • pp.114-117
    • /
    • 2011
  • A thick 25 ${\mu}m$ thickness poled P(VDF/TrFE) film pyroelectric infrared ray sensor has been fabricated and then thin 1.6 ${\mu}m$ thickness P(VDF/TrFE) film pyroelectric infrared ray sensor has been fabricated also. These thick and thin P(VDF/TrFE) film pyroelectric infrared ray sensor was mounted in TO-5 housing to detect infrared light of 5.5 ~ 14 ${\mu}m$ wavelength for human body detecting with each other. The noise output voltage of the thick P(VDF/TrFE) film pyroelectric infrared ray sensor were 380 mV and NEP(noise equivalent power) is $3.95{\times}10^{-7}$ W which is the similar value with the commercial pyroelectric infrared ray sensor using ceramic materials as a sensing material. The NEP and specific detectivity $D^*$ of the thin P(VDF/TrFE) film pyroelectric infrared ray sensor were $2.13{\times}10^{-8}$ W and $9.37{\times}106$ cm/W under emission energy of 13 ${\mu}W/cm^2$ respectively. These result caused by lower thermal diffusion coefficient of a thin 1.6 ${\mu}m$ thickness PVDF/TrFE film than the thick 25 ${\mu}m$ thickness poled P(VDF/TrFE) film pyroelectric infrared ray sensor.

Electrical Conduction Characteristics of a Thick-film Form Multiwalled Carbon Nanotubes for Field Electron Emitter

  • Lee, Yun-Hi;Kim, Hoon;Ju, Byeong-Kwon;Yu, Jae-Eun;Oh, Myung-Hwan
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2000.01a
    • /
    • pp.53-54
    • /
    • 2000
  • Measurements of the direct current resistivity, on multiwalled carbon nanotubes(MWNT) for field electron emitter source that had been screen printed in a thick film form were made as a function of temperature T in the range of 1.7K-390K. In this measuring temperature range, the electrical resistivity for the MWNT show that the main contribution to the conductivity comes form carries that hop directly between localized states executing variable range hopping processes. This thick-film form system for large area display showed a high bright light emission as well as very low turn-on field as like an individual MWNT system at room temperature. Furthermore, the electron emission characteristics followed well typical Fowler-Nordheim conduction under the vacuum.

  • PDF