• JSTS:Journal of Semiconductor Technology and Science
• /
• 제12권1호
• /
• pp.18-23
• /
• 2012

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a $0.13{\mu}m$ CMOS MPW process, and the operation of the chip is verified.

• 마이크로전자및패키징학회지
• /
• 제25권3호
• /
• pp.67-74
• /
• 2018

두께 $2.5{\sim}10{\mu}m$인 n형 $Bi_2Te_3$와 p형 $Sb_2Te_3$ 레그 8쌍으로 구성되어 있는 in-plane형 열전박막소자를 전기도금법으로 Si submounts에 형성하고, LED 칩의 구동에 의해 발생하는 겉보기 온도차 ${\Delta}T$와 레그 두께에 따른 발전특성을 분석하였다. LED 방출열에 의해 인가된 ${\Delta}T$가 7.4K일 때 각기 두께 $2.5{\mu}m$, $5{\mu}m$ 및 $10{\mu}m$의 p-n 레그들로 구성된 열전박막소자는 6.1 mV, 7.4 mV 및 11.8 mV의 open circuit 전압을 나타내었으며, 6.6 nW, 12.8 nW 및 41.9 nW의 최대 출력전력을 나타내었다.

• 한국진공학회지
• /
• 제6권1호
• /
• pp.69-76
• /
• 1997

순간 증착법으로 $Bi_{0.5}Sb_{1.5}Te_3$(p형)와 $Bi_2Te_{2.4} Se_{0.6}$(n형) 박막을 제조하여 두께와 어닐 링 조건에 따른 Seebeck 계수, 전기전도도, carrier 농도 및 이동도, 열전도도, 성능지수의 변화 등 열-전기적 특성을 조사하였다. 473K에서, 1시간 진공 열처리한 결과 p형과 n형의 성능지구는 각각 $1.3{\times}10^{-3}K^{-1}$ 및 $0.3{\times}10^{-3}K^{-1}$으로 향상되었으며 두께에 크게 의존하지 않았 다. 이런 성질을 갖는 열전 박막을 소자화한 박막 온도 센서를 유리와 Teflon기판 위에 제 조하였으며, 이들의 온도 변화에 대한 열기전력, 민감도 및 시간 상수 등 센서 특성을 측정 하였다. p 및 n형의 leg 폭 1mm$\times$길이 16mm인 박막 온도 센서의 경우, Teflon 기판일 때 좋은 성능을 나타내었으며, 민감도는 2.91V/W, 시간 상수는 28.2초이었다.

• 전기화학회지
• /
• 제23권1호
• /
• pp.18-23
• /
• 2020

Antimony telluride (Sb_xTe_y) thin films were synthesized by an electrodeposition method with a control of applied potential at room temperature. Characterization of electrical and thermoelectric properties such as conductivity, Seebeck coefficient, and power factor (P.F.) were conducted as a function of the chemical composition of the electrodeposited films. Morphology of thin films were dense and uniform and the composition was tailored from 25 to 60 at.% of the Sb content by altering the applied potential from -0.13 to -0.27 V (vs. SCE). The conductivity of the films were ranged from 2 × 10^-4 ~ 5 × 10^-1 S/cm indicating their amorphous behavior. The meaured Seebeck coefficient of films were relatively high compared to that of bulk single cyrstal Sb_xTe_y due to their low carrier concentration. The variation of the Seebeck coefficient of the films was also related to the change of chemical composition, showing the power factor of ~10 ㎼/mK².

• 한국재료학회지
• /
• 제14권1호
• /
• pp.41-45
• /
• 2004

P-type $Bi_{0.5}$$Sb_{1.5}$ $Te_3$ thin films were deposited by the flash evaporation technique, and their thermoelectric properties and electronic transport parameters were investigated. The effective mean free path model was adopted to examine the thickness effect on the thermoelectric properties. Annealing effects on the carrier concentration and mobility were also studied, and their variations were analyzed in conjunction with the antisite defects. Seebeck coefficient and electrical resistivity versus inverse thickness showed a linear relationship, and the effective mean free path was found to be 3150$\AA$. No phase transformation and composition change were observed after annealing treatment, but carrier mobility increased due to grain growth. Carrier concentration decreased considerably due to reduction of the antisite defects, so that electrical conductivity decreased and Seebeck coefficient increased. When annealed at 473 K for 1 hr, Seebeck coefficient and electrical conductivity were $160\mu$V/K and 610 $W^{-1}$ $cm^{ -1}$, respectively. Therefore, the thermoelectric quality factor were also enhanced to be $16\mu$W/cm $K^2$.>.

• 한국전기전자재료학회논문지
• /
• 제33권2호
• /
• pp.141-146
• /
• 2020

Thermoelectric Bi₂Te₃ thin films were synthesized by a co-sputtering method at 300℃. A Fe dopant was considered to enhance the thermoelectric properties of the system. The Seebeck coefficient of the Fe-doped films increased whereas the electrical conductivity decreased. As a result, the power factor of the system increased owing to the enhanced Seebeck coefficient. Grain growth inhibition was detected in the Fe-doped system, which produced more grain boundaries in the Fe-doped films than in the undoped system. The increased grain boundary scattering was deemed to be effective for a reduced thermal conductivity. This is advantageous for the preparation of high-performance thermoelectric films.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 1992년도 추계학술발표강연 및 논문개요집
• /
• pp.53-53
• /
• 1992

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 1993년도 제4회 학술발표회 논문개요집
• /
• pp.70-71
• /
• 1993

• 한국진공학회지
• /
• 제15권2호
• /
• pp.180-185
• /
• 2006

[ $Bi_{0.5}Sb_{1.5}Te_{3}/Bi_{2}Te_{2.4}Se_{0.6}$ ]계 박막형 열전발전 소자에 의해 volt 단위의 비교적 고전압에서 microwatt 수준의 출력을 발생시킬 수 있었다. 최대 출력은 온도차와 2차 함수적인 관계가 있었고, 주어진 온도차에서 판형 모듈의 적층수에 비례하여 증가하였다. 판형 모듈의 적층수와 직렬/병렬 연결 조합의 변화에 의해 출력 전압과 전류를 조절할 수 있었다. 온도차에 대한 개회로 전압과 폐회로 전류의 변화는 직선성을 보였다. 개회로 전압은 직렬 연결의 경우 판형 모듈의 수에 의존하였지만, 병렬 연결의 경우에는 의존하지 않았다. 반면, 폐회로 전류는 직렬연결의 경우 판형 모듈의 적층수와 무관하게 일정한 값을 나타내었고, 병렬 연결의 경우 판형 모듈의 적층수에 비례하여 증가하였다.

• 한국재료학회지
• /
• 제27권2호
• /
• pp.89-93
• /
• 2017

A thin film thermoelectric generator that consisted of 5 p/n pairs was fabricated with $1{\mu}m$-thick n-type $In_3Sb_1Te_2$ and p-type $Ge_2Sb_2Te_5$ deposited via radio frequency magnetron sputtering. First, $1{\mu}m$-thick GST and IST thin films were deposited at $250^{\circ}C$ and room temperature, respectively, via radio-frequency sputtering; these films were annealed from 250 to $450^{\circ}C$ via rapid thermal annealing. The optimal power factor was found at an annealing temperature of $400^{\circ}C$ for 10 min. To demonstrate thermoelectric generation, we measured the output voltage and estimated the maximum power of the n-IST/p-GST generator by imposing a temperature difference between the hot and cold junctions. The maximum output voltage and the estimated maximum power of the $1{\mu}m$-thick n-IST/p-GST TE generators are approximately 17.1 mV and 5.1 nW at ${\Delta}T=12K$, respectively.