• Title/Summary/Keyword: Thermoelectric cooling system

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An Experimental Study on the Optimal Operation Condition of an Air-Cooler using Thermoelectric Modules (열전모듈을 이용한 냉방기의 최적 운전조건에 관한 실험적 연구)

  • Hwang, Jun;Kang, Byung-Ha
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.18 no.1
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    • pp.66-72
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    • 2006
  • This article presents the optimal operation of an air conditioner using thermoelectric modules. A prototype of air conditioner using four thermoelectric modules has been designed and built. The system performance with evaporative cooling for hot side of the module are studied in detail for several operating parameters, such as input power to the thermoelectric module, fans and pump. It is found that the optimal input voltage to the thermoelectric module and pump is selected for the best system performance based on the cooling capacity and the COP at a given operating condition. It is also found that both the cooling capacity and COP of a system is increased with an increase in the input power to fans. The cooling performance could be improved when the ambient temperature is increased and the relative humidity is decreased since the evaporative cooling at the hot side has been increased.

Development for Inserted Type Coling System in Computer (컴퓨터 내장형 냉각시스템 개발)

  • Lee, Hyeon-Yong;Im, Seon-Jong
    • Proceedings of the Safety Management and Science Conference
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    • 2009.11a
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    • pp.399-404
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    • 2009
  • The research for computer cooling system has been researched briskly at home and abroad. Most of computer cooling systems are the air cooling method using cooling fan. The air cooling system are most widely used for low cost and easy installation but have limits in cooling. The water cooling system are good for cooling efficiency but bad for installation. This paper presents the developing for cooling system to be inserted in computer using thermoelectric module.

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Optimization of Thermoelectric Elements for Thermoelectric Coolers (열전냉동기용 열전요소의 최적화)

  • Jeong, Eun-Soo
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.24 no.5
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    • pp.409-414
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    • 2012
  • A theoretical investigation to optimize thermoelectric elements for thermoelectric coolers was performed using a new one-dimensional analytic model. Mathematical expressions for the optimum current and the optimum length of a thermoelectric element, which maximize the coefficient of performance of thermoelectric coolers, were obtained. The optimum current is expressed in terms of the cooling load for a thermoelectric element, the hot and cold side temperatures and thermoelectric properties, but not the length of a thermoelectric element. The optimum current is proportional to the cooling load and decreases as the temperature difference between the hot and cold sides decreases. It is also shown that the optimum length of a thermoelectric element decreases as the cooling load increases.

Development of Cooling and Heating System for Matt (매트용 냉난방 시스템 개발)

  • Cho, Hyun-Seob
    • Proceedings of the KAIS Fall Conference
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    • 2008.05a
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    • pp.163-166
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    • 2008
  • This study developed matt used by thermoelectric device to use both cooling and heating. To develop this system, heating system used sheath heater and cooling system used thermoelectric device. A Flow of water controlled by a capillary tube system made by polymethyl. Results by this system very lowered spending of energy.

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A Study on Control of Heat Generation in Computer using Thermoelectric Cooling System (열전냉각시스템을 이용한 컴퓨터의 발열제어에 관한 연구)

  • Oh, Yool-Kwon;Yang, Ho-Dong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.1
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    • pp.43-49
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    • 2015
  • In recent years, the amount of heat generated inside of the computer has more increased because of high performance, multi-function, miniaturization and light weight. It is necessary to control the effective heat generation to improve performance and life extension of the computer. In this study, thermoelectric cooling system was manufactured using thermoelectric module and was attached to computer in order to control the heat generated inside computer. And the temperature distributions inside computer were experimentally measured and compared with and without thermoelectric cooling system to investigate the effect of cooling system. Also, to estimate the new cooling system which can substitute for the existing computer cooling system, temperature distributions inside computer were calculated by numerical analysis when there was no cooling system and was applied only cooling system to computer.

Experimental fabrication and analysis of thermoelectric devices (복합재료에 의한 열전변환 냉각소자의 개발에 관한 연구)

  • 성만영;송대식;배원일
    • Electrical & Electronic Materials
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    • v.9 no.1
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    • pp.67-75
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    • 1996
  • This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

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A Study on Performance of Thermoelectric Air-Cooling System in Parallel Flow (평행유동에서 공랭식 열전모듈 냉각시스템의 성능에 관한 연구)

  • Karng, Sarng-Woo;Shin, Jae-Hoon;Han, Hun-Sik;Kim, Seo-Young
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.23 no.6
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    • pp.421-429
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    • 2011
  • Experimental and theoretical studies on cooling performance of two-channel thermoelectric air-cooling system in parallel flow are conducted. The effects of operating temperature to physical properties of thermoelectric module (TEM) are experimentally examined and used in the analysis of an air-cooling system considering thermal network and energy balance. The theoretical predicted temperature variation and cooling capacity are in good agreement with measured data, thereby validating analytic model. The heat absorbed rate increases with increasing the voltage input and decreasing thermal resistance of the system. The power consumption of TEM is linearly proportional to mean temperature differences due to variations of the physical properties on operation temperature of TEM. Furthermore thermal resistance of hot side has greater effects on cooling performance than that of cold side.

Development of Cooling/Warming System Using Thermoelectric Device (열전소자를 이용한 냉·온장시스템 개발)

  • Kim, Kee-Hwan
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.9 no.3
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    • pp.131-136
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    • 2009
  • The thermoelectric effect is the direct conversion of temperature differences to electric voltage and vice versa. A thermoelectric device creates a voltage when there is a different temperature on each side. Conversely when a voltage is applied to it, it creates a temperature difference. This effect is used in this paper to cool objects or to heat them. A cooling/warming system with thermoelectric device is introduced and controlled with PC and LabVIEW.

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A Study on the Hot Spot Cooling Using Thermoelectric Cooler (열전냉각 모듈을 이용한 국소 냉각에 관한 연구)

  • Kim, Ook-Joong;Lee, Kong-Hoon
    • Proceedings of the SAREK Conference
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    • 2007.11a
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    • pp.640-645
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    • 2007
  • An experimental apparatus to show the hot spot cooling of an IC chip using a thermoelectric cooler is developed. The spot heating in very small area is achieved by the applying CO$_2$ laser source and temperatures are measured using miniature thermocouples. The active effects of thermoelectric cooler on the hot spot cooling system such as rapid heat spreading in the chip and lowering the peak temperature around the hot spot region are investigated. The experimental results are simulated numerically using the TAS program, which the performance characteristics such as Seebeck coefficient, electrical resistance and thermal conductivity of the thermoelectric cooler are searched by trial and error. Good agreements are obtained between numerical and experimental results if the appropriate performance data of the thermoelectric cooler are given.

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