• Journal of the Korean Vacuum Society
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• v.14 no.4
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• pp.215-221
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• 2005

Thermoelectric bismuth telluride thin films were prepared on $SiO_{2}$/Si substrate with co-sputtering of bismuth and tellurium targets. The effects of deposition temperature on surface morphology, crystallinity and electrical transport properties were investigated. Hexagonal crystallites were clearly visible at the surface of films deposited above $290 ^{\circ}C$. Change of dominant phase from rhombohedral $Bi_2Te_3$ to hexagonal BiTe was confirmed with X-ray diffraction analysis. The deviation from stoichiometric composition at high deposition temperature resulted in the change of structural and electrical characteristics. Seebeck coefficients of all samples have negative value, indicating the prepared $Bi_XTe_Y$ films are n-type thermoelectric. Optimum of Seebeck coefficient and power factor were obtained at the deposition temperature of $225 \^{circ}$C (about -55 $\mu$V/K and $3\times10^{-4}$ W/$k^{2}$m, respectively). Deterioration of thermoelectric properties at higher temperature.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.543-549
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• 2003

In order to investigate the thermoelectric properties of $Zn_{k}$ $In_2$$O_{ 3＋k}$ homologous compounds, the samples of $Zn_{k}$ /$In_2$$O_{3＋k}$ / (k = integer between 1 and 9) were prepared by calcining the mixed powders of ZnO and $In_2$$O_3$fellowed by sintering at 1823 K for 2 hours in air, and their electrical conductivities and Seebeck coefficients were measured as a function of temperature in the range of 500 K to 1150 K. X-ray diffraction analysis of the sintered samples clarified that single-phase specimens were obtained for $Zn_{k} /$In_2$$O_{3＋k}$ with k = 3, 4, 5, 7, 8, 9. Electrical conductivity of the $Zn_{k}$ $In_2$$O_{3＋k}$ / decreased with increasing temperature, and decreased with increasing k for k $\geq$ 3. The Seebeck coefficient was negative at all the temperatures for all compositions, confirming that $Zn_{k}$ $In_2$$O_{3＋k}$ / is an n-type semiconductor. Absolute values of the Seebeck coefficient increased linearly with increasing temperature and increased with increasing k for k $\geq$ 3. The temperature dependence of the Seebeck coefficient indicated that Z $n_{k}$I $n_2$ $O_{3＋k}$ could be treated as an extrinsic degenerate semiconductor. Figure-of-merits of Z $n_{k}$I $n_2$ $O_{3＋k}$ were evaluated from the measured electrical conductivity and Seebeck coefficient, and the reported thermal conductivity. Z $n_{7}$ I $n_2$ $O_{10}$ has the largest figure-of-merit over all the temperatures, and its highest value was $1.5{\times}$10$^{-4}$ $K^{-1}$ at 1145 K.5 K.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.502-507
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• 2010

In order to design nano structured materials with enhanced thermoelectric properties, the alloys in the pseudo-binary $Bi_2Te_3$-PbTe system are investigated for their micro structure properties. For this synthesis, the liquid alloys are cooled by the water quenching method. Micro structure images are obtained by using an electron probe micro analyzer(EPMA). Dendritic and lamellar structures are clearly observed with the variation in the composition ratio between $Bi_2Te_3$ and PbTe. The increase in the $Bi_2Te_3$ composition ratio causes to change of the structure from dendritic to lamellar. The Seebeck coefficient of sample 5, in which the mixture rate of $Bi_2Te_3$ is 83%, is measured as the highest value. In contrast, the others decrease with the increase of the $Bi_2Te_3$ composition ratio. Meanwhile, p-type characteristics are observed in sample 6, at 91%-$Bi_2Te_3$ mixture rate. The power factors of the all samples are calculated with the Seebeck coefficient and resistivity.

• Korean Journal of Materials Research
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• v.13 no.5
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• pp.292-296
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• 2003

In an attempt to enhance phase transformation and homogenization of Mn-doped $FeSi_2$, mechanical alloying of elemental powders was applied. Cold pressing and sintering in vacuum were carried out to produce a dense microstructure, and then isothermal annealing was employed to induce a phase transformation to the $\beta$-$FeSi_2$semiconductor. Phase transitions in this alloy system during the process were investigated by using XRD, EDS and SEM. As-milled powders after 100 h of milling were shown to be metastable state. As-sintered iron silicides consisted of untransformed mixture of $\alpha$-$Fe_2$$Si_{5}$and $\varepsilon$-FeSi phases. $\beta$-$FeSi_2$phase transformation was induced by subsequent isothermal annealing at $830^{\circ}C$, and near single phase of $\beta$-$FeSi_2$was obtained after 24 h of annealing. Thermoelectric properties in terms of Seebeck coefficient, and electrical conductivity were evaluated and correlated with phase transformation. Seebeck coefficient electrical resistivity and hardness increased with increasing annealing time due to $\beta$ phase transformation.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.33-38
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• 2012

An in-plane thermoelectric sensor was processed on a glass substrate by evaporation of the n-type Bi-Te and p-type Sb-Te thin films, and its sensing characteristics were evaluated. The n-type Bi-Te thins film used to fabricate the inplane sensor exhibited a Seebeck coefficient of -165 ${\mu}V$/K and a power factor of $80{\times}10^{-4}W/K^2-m$. The p-type Sb-Te thin film used to fabricate the in-plane sensor exhibited a Seebeck coefficient of 142 ${\mu}V$/K and a power factor of $51.7{\times}10^{-4}W/K^2-m$. The in-plane thermoelectric sensor consisting of 15 pairs of the n-type Bi-Te and the p-type Sb-Te evaporated thin films exhibited a sensitivity of 2.8 mV/K.

• Journal of the Korean Ceramic Society
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• v.40 no.11
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• pp.1106-1112
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• 2003

For the purpose of making clear the role of oxygen in the thermoelectric properties of FeSi$_2$, thermoelectric measurements and spectroscopic characterization were conducted for the oxidized specimens fabricated from ($\alpha$+$\varepsilon$)-phases and/or $\beta$-phase. Addition of oxygen to FeSi$_2$ prevented both densification during sintering and transformation from metallic phases to semiconducting phase during annealing treatment. In an specimens, electrical conductivity and thermal conductivity decreased with oxidation time. The Seebeck coefficient was positive and small for pure FeSi$_2$. And/or the oxidized specimens fabricated from ($\alpha$+$\varepsilon$)-phases. However, it was negative and showed a maximum peak at about 500 K for the oxidized FeSi$_2$ fabricated from $\beta$-phase. The value of maximum peak increased with oxidation time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.126-127
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• 2007

Sn-filled and Fe-doped $CoSb_3$ skutterudites were synthesized by encapsulated induction melting. Single ${\delta}$-phase was successfully obtained by subsequent annealing and confirmed by X-ray diffraction analysis. Temperature dependences of Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed the p-type conduction. Electrical resistivity increased with increasing temperature, which shows that the $Sn_zCo_3FeSb_{12}$ skutterudite is highly degenerate. Thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. Thermoelectric figure of merit was enhanced by Sn filling and its optimum filling content was considered to be z=0.3 in the $Sn_zCo_3FeSb_{12}$ system.

• Korean Journal of Materials Research
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• v.27 no.8
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• pp.438-444
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• 2017

In this work, the effects of hydrogen reduction on the microstructure and thermoelectric properties of $(GeTe)_{0.85}(AgSbTe_2)_{0.15}$ (TAGS-85) were studied by a combination of gas atomization and spark plasma sintering. The crystal structure and microstructure of TAGS-85 were characterized by X-ray diffraction(XRD) and scanning electron microscopy (SEM). The oxygen content of both powders and bulk samples were found to decrease with increasing reduction temperature. The grain size gradually increased with increasing reduction temperature due to adhesion of fine grains in a temperature range of 350 to $450^{\circ}C$. The electrical resistivity was found to increase with reduction temperature due to a decrease in carrier concentration. The Seebeck coefficient decreased with increasing reduction temperature and was in good agreement with the carrier concentration and carrier mobility. The maximum power factor, $3.3{\times}10^{-3}W/mK^2$, was measured for the non-reduction bulk TAGS-85 at $450^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.3
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• pp.622-629
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• 1988

In order to improve the sensitivity of the wafer type heat flux sensor, some heat flux sensors were manufactured and examined by using thermoelectric semiconductor material (bismuth telluride) whose Seebck coefficient is much larger than those of metallic thermocouple materials. Because the thermoelectric element cannot be bended or welded, a peculiar sensor structure and manufacturing process were designed. As a result, it is revealed that the characteristic sensitivity of the manufactured sensor is about 10 times larger than that of marketed sensor even though there are some troubles in stiffness for reciprocal use. If we make this kind of sensors smaller and thinner, it will be a useful method to measure the local heat flux from the surface of complex configuration.

• Journal of Powder Materials
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• v.24 no.2
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• pp.108-114
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• 2017

We fabricate fine (<$20{\mu}m$) powders of $Bi_{0.5}Sb_{1.5}Te_3$ alloys using a large-scale production method and subsequently consolidate them at temperatures of 573, 623, and 673 K using a spark plasma sintering process. The microstructure, mechanical properties, and thermoelectric properties are investigated for each sintering temperature. The microstructural features of both the powders and bulks are characterized by scanning electron microscopy, and the crystal structures are analyzed by X-ray diffraction analysis. The grain size increases with increasing sintering temperature from 573 to 673 K. In addition, the mechanical properties increase significantly with decreasing sintering temperature owing to an increase in grain boundaries. The results indicate that the electrical conductivity and Seebeck coefficient ($217{\mu}V/K$) of the sample sintered at 673 K increase simultaneously owing to decreased carrier concentration and increased mobility. As a result, a high ZT value of 0.92 at 300 K is achieved. According to the results, a sintering temperature of 673 K is preferable for consolidation of fine (<$20{\mu}m$) powders.