• The korean journal of orthodontics
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• v.53 no.2
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• pp.89-98
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• 2023

Objective: This study aimed to compare the mechanical and thermal properties in the anterior and posterior segments of new and retrieved specimens of a commercially available multizone superelastic nickel-titanium (NiTi) archwire. Methods: The following groups of 0.016 × 0.022-inch Bioforce NiTi archwires were compared: a) anterior and b) posterior segments of new specimens and c) anterior and d) posterior segments of retrieved specimens. Six specimens were evaluated in each group, by three-point bending and bend and free recovery tests. Bending moduli (Eb) were calculated. Furthermore, the new specimens were evaluated with scanning electron microscopy/energy-dispersive X-ray spectrometry. A multiple linear regression model with a random intercept at the wire level was applied for data analysis. Results: The forces in the posterior segments or new specimens were higher than those recorded in the anterior segments or retrieved specimens, respectively. Accordingly, Eb also varied. Higher austenite start and austenite finish (Af) temperatures were recorded in the anterior segments. No statistically significant differences were found for these temperatures between retrieved and new wires. The mean elemental composition was (weight percentage): Ni, 52.6 ± 0.5; Ti, 47.4 ± 0.5. Conclusions: The existence of multiple force zones was confirmed in new and retrieved Bioforce archwires. The retrieved archwires demonstrated lower forces during the initial stages of deactivation in three-point bending tests, compared with new specimens. The Af temperature of these archwires may lie higher than the regular intraoral temperature. Even at 2 mm deflections, the forces recorded from these archwires may lie beyond biologically safe limits.

• Advances in nano research
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• v.10 no.2
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• pp.115-128
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• 2021

In this article, free vibration behavior of electro-magneto-thermo sandwich Timoshenko beam made of porous core and Graphene Platelet Reinforced Composite (GPLRC) in a thermal environment is investigated. The governing equations of motion are derived by using the modified strain gradient theory for micro structures and Hamilton's principle. The magneto electro are under linear function along the thickness that contains magnetic and electric constant potentials and a cosine function. The effects of material length scale parameters, temperature change, various distributions of porous, different distributions of graphene platelets and thickness ratio on the natural frequency of Timoshenko beam are analyzed. The results show that an increase in aspect ratio, the temperature change, and the thickness of GPL leads to reduce the natural frequency; while vice versa for porous coefficient, volume fractions and length of GPL. Moreover, the effect of different size-dependent theories such as CT, MCST and MSGT on the natural frequency is investigated. It reveals that MSGT and CT have most and lowest values of natural frequency, respectively, because MSGT leads to increase the stiffness of micro Timoshenko sandwich beam by considering three material length scale parameters. It is seen that by increasing porosity coefficient, the natural frequency increases because both stiffness and mass matrices decreases, but the effect of reduction of mass matrix is more than stiffness matrix. Considering the piezo magneto-electric layers lead to enhance the stiffness of a micro beam, thus the natural frequency increases. It can be seen that with increasing of the value of WGPL, the stiffness of microbeam increases. As a result, the value of natural frequency enhances. It is shown that in hc/h = 0.7, the natural frequency for WGPL = 0.05 is 8% and 14% less than its for WGPL = 0.06 and WGPL = 0.07, respectively. The results show that with an increment in the length and width of GPLs, the natural frequency increases because the stiffness of micro structures enhances and vice versa for thickness of GPLs. It can be seen that the natural frequency for aGPL = 25 ㎛ and hc/h = 0.6 is 0.3% and 1% more than the one for aGPL = 5 ㎛ and aGPL = 1 ㎛, respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.412-412
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• 2009

Carbon-based nano materials have a significant effect on various fields such as physics, chemistry and material science. Therefore carbon nano materials have been investigated by many scientists and engineers. Especially, since graphene, 2-dimemsonal carbon nanostructure, was experimentally discovered graphene has been tremendously attracted by both theoretical and experimental groups due to their extraordinary electrical, chemical and mechanical properties. Electrical conductivity of graphene is about ten times to that of silicon-based material and independent of temperature. At the same time silicon-based semiconductors encountered to limitation in size reduction, graphene is a strong candidate substituting for silicon-based semiconductor. But there are many limitations on fabricating large-scale graphene sheets (GS) without any defect and controlling chirality of edges. Many scientists applied micromechanical cleavage method from graphite and a SiC decomposition method to the fabrication of GS. However these methods are on the basic stage and have many drawbacks. Thereupon, our group fabricated GS through Thermo-electrical Pulse Induced Evaporation (TPIE) motivated by arc-discharge and field ion microscopy. This method is based on interaction of electrical pulse evaporation and thermal evaporation and is useful to produce not only graphene but also various carbon-based nanostructures with feeble pulse and at low temperature. On fabricating GS procedure, we could recognize distinguishable conditions (electrical pulse, temperature, etc.) to form a variety of carbon nanostructures. In this presentation, we will show the structural properties of OS by synthesized TPIE. Transmission Electron Microscopy (TEM) and Optical Microscopy (OM) observations were performed to view structural characteristics such as crystallinity. Moreover, we confirmed number of layers of GS by Atomic Force Microscopy (AFM) and Raman spectroscopy. Also, we used a probe station, in order to measure the electrical properties such as sheet resistance, resistivity, mobility of OS. We believe our method (TPIE) is a powerful bottom-up approach to synthesize and modify carbon-based nanostructures.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.5
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• pp.549-554
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• 2011

Recently, technical advances have been made in high efficiency gas turbine power plants. In domestic gas turbine facilities, the material properties of the blade and vane are degraded by the daily start-stop operations arising from the thermo mechanical cycle. We surveyed the time dependent degradation of the HP blade and vane to gather basic data for life assessment and damage analysis. The EOH(equivalent operating hours) of the blades were 23,686, 27,909, and 52,859 and the EOH of the vanes were 28,714 and 52,859, respectively. With increased operating hours, the shape of the primary ${\gamma}$' precipitate transformed from cubic to spherical, and its average size also increased. The leading edge area of the blades and the center of the vanes had the worst morphology, and this tendency agrees with the microhardness results. The thickness of the thermally grown oxide at the outer surface of the bond coat increased with increased operating hours.

• Biomaterials and Biomechanics in Bioengineering
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• v.2 no.1
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• pp.47-59
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• 2015

A bioactive and multifunctional elastin-like polymer (ELP) was produced by genetic engineering techniques to develop new artificial matrices with the ability to mimic the extracellular matrix (ECM). The basic composition of this ELP is a thermo- and pH-sensitive elastin pentapeptide which has been enriched with RGD-containing domains, the RGD loop of fibronectin, for recognition by integrin receptors on their sequence to promote efficient cell attachment. Hydrogels of this RGD-containing polymer were obtained by crosslinking with hexamethylene diisocyanate, a lysine-targeted crosslinker. These materials retain the "smart" nature and temperature-responsive character, and the desired mechanical behavior of the elastin-like polymer family. The influence of the degree of crosslinking on the morphology and properties of the matrices were tested by calorimetric techniques and scanning electron microscopy (SEM). Their mechanical behavior was studied by dynamical mechanical analysis (DMA). These results show the potential of these materials in biomedical applications, especially in the development of smart systems for tissue engineering.

• Steel and Composite Structures
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• v.25 no.2
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• pp.141-155
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• 2017

This paper presents an investigation into the magneto-thermo-mechanical vibration and damping of a viscoelastic functionally graded-carbon nanotubes (FG-CNTs)-reinforced curved microbeam based on Timoshenko beam and strain gradient theories. The structure is surrounded by a viscoelastic medium which is simulated with spring, damper and shear elements. The effective temperature-dependent material properties of the CNTs-reinforced composite beam are obtained using the extended rule of mixture. The structure is assumed to be subjected to a longitudinal magnetic field. The governing equations of motion are derived using Hamilton's principle and solved by employing differential quadrature method (DQM). The effect of various parameter like volume percent and distribution type of CNTs, temperature change, magnetic field, boundary conditions, material length scale parameter, central angle, viscoelastic medium and structural damping on the vibration and damping behaviors of the nanocomposite curved microbeam is examined. The results show that with increasing volume percent of CNTs and considering magnetic field, material length scale parameter and viscoelastic medium, the frequency of the system increases and critically damped situation occurs at higher values of damper constant. In addition, the structure with FGX distribution type of CNTs has the highest stiffness. It is also observed that increasing temperature, structural damping and central angle of curved microbeam decreases the frequency of the system.

• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.264-269
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• 2011

Hydrogen and hydrogen energy have been recognized as clean energy sources and high energy carrier. Mg and Mg alloys are attractive hydrogen storage materials because of their lightweight and low cost materials with high hydrogen capacity (about 7.6 wt.%). However, the commercial applications of the Mg hydrides are currently hinder by its high absorption/desorption temperature, and very slow reaction kinetics. However, Ti and Ti based hydrogen storage alloys have been thought to be the third generation of alloys with a high hydrogen capacity, which makes it difficult to handle because of high reactivity. One of the most methods to develope kinetics was addition of transition metal. Therefore, Mg-Ti-Cr-Nb alloy was fabricated to add TiCrNb by hydrogen induced mechanical alloying. TiCrNb systems have included transition metals, low operating temperatures and hydrogen storage materials. As-received specimens were characterized using X-ray Diffraction analysis (XRD), Scanning Electron Microscopy (SEM) and Thermo Gravimetric analysis/Differential Scanning Calorimetry (TG/DSC). $Mg-TiCr_{10}Nb$ systems were evaluated for hydrogen kinetics by Sievert's type Pressure-Composition-Isotherm (PCI) equipment. The operating temperature range was 473, 523, 573 and 623 K.

• Polymer(Korea)
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• v.31 no.1
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• pp.31-36
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• 2007

It has been reported that the surface properties of the plasma treated material were changed while maintaining its bulk properties. In this study, surface modification of nylon fiber by plasma treatment was tried to attain high water-repellency Nylon fiber was treated with RF plasma under a vacuum system using various parameters such as gas specious, processing time and processing power. Morphological changes by low pressure plasma treatment were observed using scanning electron microscopy (SEM) and atomic force microscopy (AFM). Moreover, the mechanical and inherent properties were analyzed by tensile strength, differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The high water-repellency property of nylon fiber was evaluated by a water-drop standard test under various conditions in terms of aging effect. The results showed that the water-repellency of plasma-surface-treated nylon fiber was greatly improved compared to untreated nylon fiber.