• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.

• Composites Research
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• v.32 no.3
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• pp.148-157
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• 2019

In this study, $C_f/SiC$, $SiC_f/SiC$ and $C_f-SiC_f/SiC$ ceramic composites reinforcing carbon fiber, SiC fiber and hybrid fiber were fabricated by hybrid TGCVI and PIP process. After the thermal shock cycle, 3-point bending and Oxy-Acetylene torch test, their mechanical behavior, oxidation and erosion resistance were evaluated. The $C_f/SiC$ composite showed a decrease in mechanical property along with increasing temperature, a pseudo-ductile fracture mode and a large quantity of erosion. The $SiC_f/SiC$ composite exhibited stronger mechanical property and lower erosion rate compared to the $C_f/SiC$, but brittle fracture mode. On the other hand, hybrid type of $C_f-SiC_f/SiC$ composite gave the best mechanical property, more ductile failure mode than the $SiC_f/SiC$, and lower erosion rate than the $C_f/SiC$. During the Oxy-Acetylene torch test, the $SiO_2$ formed by reaction of the SiC matrix with oxygen prevented further oxidation or erosion of the fibers for $C_f-SiC_f/SiC$ and $SiC_f/SiC$ composites particularly. In conclusion, if a hybrid composite with low porosity is prepared, this material is expected to have high applicability as a high temperature thermo-structural composite under high temperature oxidation atmosphere by improving low mechanical property due to the oxidation of $C_f/SiC$ and brittle fracture mode of $SiC_f/SiC$ composite.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Fire Science and Engineering
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• v.31 no.3
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• pp.63-72
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• 2017

This study fabricated a low-voltage 10 circuit distribution board based on the KEMC (Korea Electrical Manufacturers Cooperative) 2102-610 standard and performed a characteristics assessment of the developed 10 circuit distribution board to secure product stability. The developed 10 circuit distribution board is designed to have the characteristics of insulation materials, as well as resistance to corrosion ultraviolet radiation and mechanical impact. The developed distribution board is fabricated to have an appropriate protection class of enclosure, electric shock prevention and protection circuits, switchgear and its components, internal electrical circuits and connectors, external conduct terminal, insulation characteristics, temperature rise test, heat resistance, etc. The developed 10 circuit distribution board consists of a single phase circuit and 3-phase circuits. It is possible to measure in real time the leakage current generated from the load distribution line by installing a sensor module at the load side of each of the branched switchgears. In addition, it is possible to increase a circuit according to the use and purpose of the load and to also manage and check the load in real time. Temperature rise tests were performed on the developed 10 circuit distribution board at 18 places including the inlet connection, main circuit and distribution circuit bus bars and bus bar supports, etc. The highest temperature of $65.3^{\circ}C$ was measured at the R-Phase of the connection of the MCCB power supply for the branch circuit bus bar and a temperature rise of $61.6^{\circ}C$ was measured at the T-Phase of the load side. When applying thermal stress to an MCCB for 6 hours at $180^{\circ}C$ using a heat resistant experimental device, it was found that the actuator lever was transformed and moved in the tripped state.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.39 no.1
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• pp.1-8
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• 2002

The effects of the addition of either monoclinic $ZrO_2$($ZrO_2$(m)) or tetragonal $ZrO_2$($ZrO_2$(t)) containing 5.35wt% $Y_2O_3$ on the physical properties and electrical conductivity of TEX>$Al_2O_3$ were investigated. The addition of $ZrO_2$(m) and $ZrO_2$(t) increased sintered density of $Al_2O_3$. The Vickers hardness also increased as addition of >($ZrO_2$(t) increased going through a maximum at 20wt% and the hardness of the specimens was found to be dependent on the sintered density. The addition of $ZrO_2$(t) improved the hardness of $Al_2O_3$-$ZrO_2$ systems and the $ZrO_2$(m) addition showed the better effect on the thermal shock property of $Al_2O_3$-$ZrO_2$ systems than that of the $ZrO_2$(t) addition. Above 15wt% addition of $ZrO_2$(t), the electrical conductivity is gradually increased with increasing applied voltage but not effects by addition of $ZrO_2$(m).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.7
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• pp.713-719
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• 2016

The NOx conversion properties of Mn-Cu-$TiO_2$ and $V_2O_5$/$TiO_2$ catalysts were studied for the selective catalytic reduction (SCR) of NOx with ammonia. The performance of the catalysts was investigated in terms of their $NOx$ conversion activity as a function of the reaction temperature and space velocity. The activity of the Mn-Cu-$TiO_2$ catalyst decreased with increasing reaction temperature and space velocity. However, the activity of the $V_2O_5$/$TiO_2$ catalyst increased with increasing reaction temperature. High activity of the Mn-Cu-$TiO_2$ catalyst was observed at temperatures below $200^{\circ}C$. H2-TPR and XPS analyses were conducted to explain these results. It was found that the activity of the Mn-Cu-$TiO_2$ catalyst was influenced by the thermal shock caused by the change of the initial reaction temperature, whereas the $V_2O_5$/$TiO_2$ catalyst was not affected by the initial reaction temperature. In the case of catalyst C, the $NO_x$ conversion efficiency decreased with increasing space velocity. The decrease in the $NO_x$ conversion efficiency with increasing space velocity was much less for catalyst D than for catalyst C.

• The Korean Journal of Malacology
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• v.19 no.1
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• pp.19-24
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• 2003

Artificial spawning, larval and spat developments of the bay scallop, Argopecten irradians, which was transplanted from China on 16 August 1996, were investigated monthly until August 1997 in the Deukyang Bay, Jangheung-gun, Jeollanam-do, Korea. Sufficient amount of cultured microalgae supplemented seawater were supplied as food (6 kinds of phytoplankton) for fully grown adult individuals at 17.1-23.2$^{\circ}C$ for 44 days. A total of 45,320,000 eggs were spawned by way of 2 times of artificial spawning inductions such as exposure stimulus to the air and thermal shock (with water temperature) on 29 January and 31 January in 1997. Artificially fertilized eggs were developed to D-shaped larvae (77.5 ${\times}\;63.8\;{\mu}m)$ and metamorphosed to larvae (191.8 ${\times}\;181.2\;{\mu}m)$ 181.2 m) in the attached larval stage on the collectors. A total of 110,000 spats (average 3.04 mm in shell length) were produced at 22.8-26.3$^{\circ}C$ and 31.0-34.4 psu in the indoor rearing tank from 14 February through 7 May in 1997. In case of Argopecten irradians, if the attached larvae in the attachment stage are detached from the collector, they could not live. Accordingly, it is assumed that survival (%) of the attached larvae of A. irridians showed very low because of weak power attached to the collector due to the small number of the byssuses of the attached larva, not the short attachment period by the byssus as seen in other scallops such as Argopecten balloti.

• The Bulletin of The Korean Astronomical Society
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• v.41 no.2
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• pp.64.3-65
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• 2016

The NISS (Near-infrared Imaging Spectrometer for Star formation history) is the near-infrared instrument optimized to the Next Generation of small satellite series (NEXTSat). The capability of both imaging and low spectral resolution spectroscopy in the near-infrared range is a unique function of the NISS. The major scientific mission is to study the cosmic star formation history in local and distant universe. For those purposes, the main observational targets are nearby galaxies, galaxy clusters, star-forming regions and low background regions. The off-axis optical design is optimized to have a wide field of view ($2deg.{\times}2deg.$) as well as the wide wavelength range from 0.95 to $3.8{\mu}m$. Two linear variable filters are used to realize the imaging spectroscopy with the spectral resolution of ~20. The mechanical structure is considered to endure the launching condition as well as the space environment. The compact dewar is confirmed to operate the infrared detector as well as filters at 80K stage. The electronics is tested to obtain and process the signal from infrared sensor and to communicate with the satellite. After the test and calibration of the engineering qualification model (EQM), the flight model of the NSS is assembled and integrated into the satellite. To verify operations of the satellite in space, the space environment tests such as the vibration, shock and thermal-vacuum test were performed. Here, we report the test results of the flight model of the NISS.

• The Bulletin of The Korean Astronomical Society
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• v.42 no.1
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• pp.40.1-40.1
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• 2017

The NISS (Near-infrared Imaging Spectrometer for Star formation history) is the near-infrared spectro-photometric instrument optimized to the Next Generation of small satellite series (NEXTSat). To achieve the major scientific objectives for the study of the cosmic star formation in local and distant universe, the spectro-photometric survey covering more than 100 square degree will be performed. The main observational targets will be nearby galaxies, galaxy clusters, star-forming regions and low background regions. The off-axis optics was developed to cover a wide field of view ($2deg.{\times}2deg.$) as well as the wide wavelength range from 0.95 to $2.5{\mu}m$, which were revised based upon the recent test and evaluation of the NISS instrument. The mechanical structure were tested under the launching condition as well as the space environment. The signal processing from infrared sensor and the communication with the satellite were evaluated after the integration into the satellite. The flight model of the NSS was assembled and integrated into the satellite. To verify operations of the satellite in space, the space environment tests such as the vibration, shock and thermal-vacuum test were performed. The accurate calibration data were obtained in our test facilities. Here, we report the test results of the flight model of the NISS.