• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.13-21
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• 2014

Technology for high power devices has made impressive progress in increasing the current density of power semiconductor, system module, and design optimization, which realize high power systems with heterogeneous functional integration. Depending on the performance development of high power semiconductor, packaging technology of high power device is urgently required for efficiency improvement of the device. Power device packaging must provide superior thermal management due to high operating temperature of power modules. Here we, therefore, review critical challenges of typical power electronics packaging today including core assembly processes, component materials, and reliability evaluation regulations.

• Journal of international Conference on Electrical Machines and Systems
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• 제2권4호
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• pp.441-446
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• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

• 한국포장학회지
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• 제21권3호
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• pp.97-106
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• 2015

RTE(ready-to-eat)형 전자레인지 가열용 제품들의 가열 조리 시 특정 부위의 열 변형이 발생하여 전자레인지 포장재의 재질 및 형태별 가열 패턴을 조사하였다. 국내에서 유통되고 있는 시료 9종 중 5개의 시료에서 열 변형이 발생되었고, 국외에서 유통되고 있는 시료 11종 중 8종에서 열 변형이 발생되었다. 국외 시료의 경우 국내 시료보다 열 변형 정도는 덜 하였지만 일부 발생되는 것을 확인하였다. 또한 트레이 타입 용기에 열 변형이 발생하는 소스를 담고 전자레인지로 가열하였을 때도 리드지 및 컵에서 열 변형이 관찰되었다. 국내외에서 유통되고 있는 전자레인지 가열용 제품의 염도, 당도, pH 및 점도를 측정한 결과 열 변형 발생 유무 및 정도에 따른 일정한 경향은 없었다. 하지만 극히 낮거나 높은 점도를 가진 시료에서 열 변형이 나타나지 않았고 내용물의 형태 및 포장재의 형태에 따라 열 변형의 차이가 있었다. 따라서 제품의 열 전환 및 열전달을 고려하여 포장재의 깊이 등 설계를 반영하여 포장 내 전자파의 집중을 방지하는 등의 기술 도입이 필요할 것으로 판단된다.

• 한국포장학회지
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• 제27권2호
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• pp.85-90
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• 2021

The gamma irradiation was on to Poly(butylene sebacate-co-terephthalate) (PBSeT), Poly(butylene adipate-co-terephthalate) (PBAT), Poly(lactic acid) (PLA) and casting polypropylene (CPP) at dose levels from 0 to 50 kGy. The properties of gamma irradiated samples were analyzed using DSC, TGA, UTM and FT-IR spectra. The mechanical and thermal properties of PBSeT and PBAT after gamma irradiation were less affected than CPP. The tensile strength and elongation of PBSeT was not affected by gamma irradiation, while these of PBAT, PLA and CPP were significantly decreased at 50 kGy gamma-ray dose. The thermal stability of PBSeT, PBAT, PLA and CPP showed a similar tendency to tensile strength. The glass transition temperature(T_g) and melting temperature(T_m) of PBSeT and PBAT were not altered by increasing gamma-ray dose, while these of PLA and CPP decreased. The chemical composition of all samples was not modified by gamma irradiation, and it was confirmed by FT-IR spectra. Based on mechanical and thermal stability studies of gamma irradiation on bioplastics, tested biodegradable packaging materials showed a potential to be used in sterilization process up to 35 kGy.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 한국포장학회지
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• 제21권3호
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• pp.107-113
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• 2015

This work focused on the study of thermal properties and kinetic behavior of LDPE-nanoclay composite films. The effect of nanoclay content (0.5, 1, 3, and 5 wt%) on thermal stability and crystallization characteristics of the nanocomposites were investigated by Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). The results from endothermic curve showed that the nanoclay played an important role in the crystallization of nanocomposites by acting as nucleating agent. From exothermic curve, there was a crystallization temperature shift which was attributed to crystallization process induced by nanoclay. The TGA results showed that the addition of nanoclay significantly increased the thermal stability of LDPE matrix, which was likely due to the characteristic of layered silicates/clays dispersed in LDPE matrix as well as the formation of multilayered carbonaceous-silicate char. A well-known Coats-Redfern method was used to evaluate the decomposition activation energy of nanocomposite. It was demonstrated that introducing of nanoclay to LDPE matrix escalated the activation energy of nanocomposite decomposition resulting in thermal stability improvement.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.23-29
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• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• 월간포장계
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• 통권290호
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• pp.78-79
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• 2017

• 펄프종이기술
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• 제39권2호
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• pp.45-53
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• 2007

When micro flute corrugated paperboards are used for food packaging, they necessarily need to meet the requirements for the distribution, transportation, and storage of food. The requirements could vary ac-cording to the contents in the packaging boxes. Microflute corrugated packaging paperboard for hot foods such as just-made coffee and hamburger requires to have a decent resistance property against high temperature. Along with a recent trend for small-quantity-multi-item upgraded packaging, semiconductor products and consumer-electronic appliances become to be packed using the environmental friendly micro flute corrugated paperboard. In this case, the electric resistance property of the microflute corrugated paperboard becomes important. This study was carried out to investigate on the thermal conductivity and electric resistance properties of micro flute corrugated paperboard.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.153-157
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• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.