• Steel and Composite Structures
• /
• v.14 no.1
• /
• pp.41-55
• /
• 2013

Fiber reinforced polymers (FRP) materials are increasingly being used for strengthening and repair of steel structures. An issue that concerns engineers in steel members which are retrofitted with FRP is stress experienced due to temperature changes. The changing temperature affects the interface bond between the FRP and Steel. This research focused on the effects of cyclical thermal loadings on the interface properties of FRP bounded to steel members. Over fifty tests were conducted to investigate the thermal effects on bonding between FRP and steel, which were cycled from temperature of $-11^{\circ}C$ ($12^{\circ}F$) to $60^{\circ}C$ ($140^{\circ}F$) for 21-36 days. This investigation consisted of two test protocols, 1) the tensile test of epoxy resin, tack coat, FRP and FRP-steel plate, 2) tensile test of each FRP compound and FRP with steel after going through thermal cyclic loading. This investigation reveals an extensive reduction in the composite's strength.

• Korean Journal of Materials Research
• /
• v.11 no.9
• /
• pp.721-726
• /
• 2001

Directional solidification experiments have been carried out at the solidification rates from 0.5 to 50$\mu\textrm{m}$/s in Mar M-247LC superalloy in which several important liquid properties were estimated by analyzing the interface stability and temperature gradient at the solid/liquid interface. The diffusion coefficient in the liquid was estimated by employing the constitutional supercooling criterion. The temperature gradients changed with solidification rates and latent heat of solidification. The thermal conductivities of solid and liquid could be estimated by heat flux balance at the solid liquid interface.

• Korean Journal of Materials Research
• /
• v.29 no.7
• /
• pp.443-450
• /
• 2019

Thermal management is a critical issue for the development of high-performance electronic devices. In this paper, thermal conductivity values of mild steel and stainless steel(STS) are measured by light flash analysis(LFA) and dynamic thermal interface material(DynTIM) Tester. The shapes of samples for thermal property measurement are disc type with a diameter of 12.6 mm. For samples with different thickness, the thermal diffusivity and thermal conductivity are measured by LFA. For identical samples, the thermal resistance($R_{th}$) and thermal conductivity are measured using a DynTIM Tester. The thermal conductivity of samples with different thicknesses, measured by LFA, show similar values in a range of 5 %. However, the thermal conductivity of samples measured by DynTIM Tester show widely scattered values according to the application of thermal grease. When we use the thermal grease to remove air gaps, the thermal conductivity of samples measured by DynTIM Tester is larger than that measured by LFA. But, when we did not use thermal grease, the thermal conductivity of samples measured by DynTIM Tester is smaller than that measured by LFA. For the DynTIM Tester results, we also find that the slope of the graph of thermal resistance vs. thickness is affected by the usage of thermal grease. From this, we are able to conclude that the wide scattering of thermal conductivity for samples measured with the DynTIM Tester is caused by the change of slope in the graph of thermal resistance-thickness.

• Journal of the Korean institute of surface engineering
• /
• v.39 no.4
• /
• pp.147-152
• /
• 2006

Failure mechanisms of electron beam physical vapor deposited thermal barrier coatings(EB-PVD TBCs) that occur during thermal cyclic oxidation were investigated. The investigations include microstructural degradation of NiCrAIY bond coat, thermally grown oxides(TGOs) along the ceramic top coat-substrate interface and fracture path within TBCs. The microstructural degradation of the bond coat during cyclic oxidation created Al depleted zones, resulting in reduction of NiAl and ${\gamma}$-Ni solid solution phase. It was observed that the fracture took placed primarily within the TGOs or at the interfaces between TGOs and bond coat.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.26 no.7
• /
• pp.1384-1392
• /
• 2002

Single fiber pull-out technique has been commonly used to characterize the mechanical behavior of interface in fiber reinforced composite materials. An improved analysis considering the effects of transversely isotropic properties of fiber and the effects of thermal residual stresses in both radial and axial directions along the fiber/matrix interface is developed for the single fiber pull-out test. Although the stress transfer properties across the interface is not much affected by considering the transversely isotropic properties of fiber, interfacial debonding is notably encouraged by the effect. The interfacial shear stress that plays an important role in interfacial debonding is very much affected by the component of axial thermal residual stress in the bonded region, which can induce a two-way debonding mechanism.

• Journal of the Microelectronics and Packaging Society
• /
• v.5 no.2
• /
• pp.37-48
• /
• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Progress in Superconductivity and Cryogenics
• /
• v.15 no.2
• /
• pp.48-51
• /
• 2013

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.6
• /
• pp.94-102
• /
• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Elastomers and Composites
• /
• v.50 no.1
• /
• pp.62-67
• /
• 2015

The surface modification of microfibriled cellulose (MFC) was carried out through the hydrolysis-condensation reaction using (3-aminopropyl)triethoxysilane (APS) and 3-glycidyloxypropyltriethoxysilane (GPS) and then the modified cellulose was compounded with bio-degradable poly(lactic acid) (PLA). Also, pristine MFC was compounded with PLA as a control groups. The confirmation of surface modification for the pristine MFC was characterized by FT-IR and SEM/EDX. The thermal and mechanical properties of the PLA/MFC composites depended on the content of MFC and the type of silane coupling agents. From the thermal, morphological and mechanical behaviors of the PLA/MFC composites, it was found that GPS-MFC was more successful to improve the interface adhesion between PLA matrix and the surface of MFC than that of APS-MFC.

• Transactions on Electrical and Electronic Materials
• /
• v.1 no.4
• /
• pp.25-29
• /
• 2000

In this paper, PET(Ployethylene Terephthalate) films with semiconducting and interface layers were investigated, The electrical properties, such as volume resistivity, tan$\delta$(dissipation factor) and breakdown strength at various temperatures were measured. Thermal analysis of PET and semiconducting films were measured and compared by differential scanning calorimeter(DSC) of each film. It is found that the volume resistivity of films(dependence on semiconducting interface layers)and electrical properties of PET films are changed ,Breakdown strength and dissipation factor of PET films with semiconducting layer (PET/S/PET) are decreased more greatly than PET and PET/PET films, due to the increase of charge density of charges at two contacted interfaces between PET and semiconductor, The dissipation factor of each films in increased with temperature,. For PET/S/PET film, is depended on temperature more than PET of PET/PET. However, the breakdown strength is increased up to 85$\^{C}$ and then decreased over 100$\^{C}$The electrical properties of PET films with semiconducting/interface layer are worse than without it It is due to a result of temperature dependency, which deeply affects thermal resistance property of PET film more than semiconducting/interface layers.