• Title/Summary/Keyword: Thermal insulation material

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Analysis of the Insulation Effectiveness of the Thermal Insulator by the Installation Methods (보온단열재의 설치방법에 따른 보온성 효과 분석)

  • Kim, Young-Bok;Lee, Si-Young;Jeong, Byoung-Ryong
    • Journal of Bio-Environment Control
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    • v.18 no.4
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    • pp.332-340
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    • 2009
  • In this study, the thermal insulation effectiveness of the greenhouse insulators by the installation methods was investigated to find the right installation way of the insulation materials. Physical properties of the insulators such as thickness, air transmissivity, apparent density, ultraviolet rays cutoff ratio, reflectance, thermal conductivity, moisture absorptivity were evaluated and the insulation ability of the insulators were measured by the module experiments. For the same insulator, the insulation ability of the case with the outward direction of the black colored face, i.e., with the inward direction of the white colored face, was better than that of vice versa. The case of the black colored both surfaces was better than the case of the white colored both surfaces. For aluminium reflection material, the case with the outward direction of the lustre face, i.e., with the inward direction of the non-lustre face, was better than that of vice versa. For the same material with the inner thin polyethylene foam (or polyester) and the chemical wool, the case with the outward direction of the inner thin polyethylene foam (or polyester), i.e., with the inward chemical wool, was better than that of vice versa. Addition of the inner thin polyethylene foam increased the insulation effect very much.

Accelerated Thermal Aging Test for Predicting Lifespan of Urethane-Based Elastomer Potting Compound

  • Min-Jun Gim;Jae-Hyeon Lee;Seok-Hu Bae;Jung-Hwan Yoon;Ju-Ho Yun
    • Elastomers and Composites
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    • v.59 no.2
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    • pp.73-81
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    • 2024
  • In the field of electronic components, the potting material, which is a part of the electronic circuit package, plays a significant role in protecting circuits from the external environment and reducing signal interference among electronic devices during operation. This significantly affects the reliability of the components. Therefore, the accurate prediction and assessment of the lifespan of a material are of paramount importance in the electronics industry. We conducted an accelerated thermal aging evaluation using the Arrhenius technique on elastic potting material developed in-house, focusing on its insulation, waterproofing, and contraction properties. Through a comprehensive analysis of these properties and their interrelations, we confirmed the primary factors influencing molding material failure, as increased hardness is related to aggregation, adhesion, and post-hardening or thermal-aging-induced contraction. Furthermore, when plotting failure times against temperature, we observed that the hardness, adhesive strength, and water absorption rate were the predominant factors up to 120 ℃. Beyond this temperature, the tensile properties were the primary contributing factors. In contrast, the dielectric constant and loss tangent, which are vital for reducing signal interference in electric devices, exhibited positive changes(decreases) with aging and could be excluded as failure factors. Our findings establish valuable correlations between physical properties and techniques for the accurate prediction of failure time, with broad implications for future product lifespans. This study is particularly advantageous for advancing elastic potting materials to satisfy the stringent requirements of reliable environments.

Prediction of Thermal and Elastic Properties of Honeycomb Sandwich Plate for Analysis of Thermal Deformation (열변형 해석을 위한 허니컴 샌드위치 평판의 열 및 탄성 물성치 예측에 관한 연구)

  • Hong, Seok Min;Lee, Jang Il;Byun, Jae Ki;Choi, Young Don
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.38 no.4
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    • pp.347-355
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    • 2014
  • Thermal problems that are directly related to the lifetime of an electronic device are becoming increasingly important owing to the miniaturization of electronic devices. To solve thermal problems, it is essential to study thermal stability through thermal diffusion and insulation. A honeycomb sandwich plate has anisotropic thermal conductivity. To analyze the thermal deformation and temperature distribution of a system that employs a honeycomb sandwich plate, the thermal and elastic properties need to be determined. In this study, the thermal and elastic properties of a honeycomb sandwich plate, such as thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and shear modulus, are predicted. The properties of a honeycomb sandwich plate vary according to the hexagon size, thickness, and material properties.

A Study on the Thermal and Electrical Characteristics with Manufacture of the Heating Element by Using Carbon with Bar Type (봉상 카본 발열체의 제조와 열 및 전기적 특성에 관한 연구)

  • 배강열;이광성;정한식;정희택;정효민
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.16 no.5
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    • pp.430-437
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    • 2004
  • This paper is intended as an investigation of study on the thermal and electrical characteristics of the carbon heating element. In this experimentation, the electric material used is the crystalline graphite a kind of natural graphite. The bentonite is used to solidify the heating element and the vacuum furnace is used for sintering it. It is noted that the natural drying time should be at least 58 hours. The plating of the electric pole with the electroless nickel showed the lowest contact resistance among others. The resistance shows linear variation with regard to length. For the insulation and resolution, the glaze coating is best with 80% of water content. The temperature rising characteristic of the heating element is better than sheath heater saving 43% of rising time. The correlation equation for temperature was obtained with the electric power.

Slim Design for Membrane Type LNGC using 3X-Board (3X-Board를 적용한 멤브레인형 LNGC의 Slim화 설계)

  • Ryu, Sung-Heon;Cho, Jin-Rae;Ha, Mun-Keun;Lee, Joong-Nam
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1280-1285
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    • 2003
  • In the developement of LNG cargo, the current concern focuses on the slim design of insulation layer to increase the LNG carrying capacity. Not only thermal stability with BOR(Boil-Off Rate) but structual stability against the LNG weight and the sloshing phenomenon must be also considered. In this paper, we applied the stitched sandwitch composite called the 3X-Board which is stitched through the core thickness direction using glass fiber to the LNG cargo. We evaluated the thermal and structural characteristics of 3X-Board by changing the core thickness and the material, in order to explore a validity for the slim design through the finite element analysis.

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A Study on Evaluation of Bending Strength in FGM (경사기능재료의 굽힘강도 평가에 관한 연구)

  • Song, Jun-Hee;Kim, Hong-Gun
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.6
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    • pp.658-663
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    • 2009
  • Metal/ceramic composites structures have many attractive properties with great potential for applications that demand high stiffness as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. Thus, determination of adhesive properties for coating part is one of the most important problems for the extension of the use of coated materials. In this work, bending strength of Functionally Graded Materials(FGM) are evaluated by means of bending strength tester. The graded layer according to the load condition showed the change of the bend strength.

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Study on the Energy Saving for School Buildings - through thermal effect of the transparent insulated opaque envelopes - (학교건물의 에너지 절약에 관한 연구 - 투명 단열외피의 열적성능을 중심으로 -)

  • Lee, S.;Kim, S.H.;Kim, K.C.
    • Journal of Power System Engineering
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    • v.10 no.1
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    • pp.41-45
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    • 2006
  • The thermal effect of a transparent insulated opake wall with solar energy was investigated theoretically. The heat gain through transparent insulated opake wall was studied for relative simple conditions. The stationary heat transport effect was studied for layer which is built on the opake wall. This study shows that a relative low solar radiation intensity causes a great heat reduction through the transparent insulated opake wall.

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Low Temperature Co-firing of Camber-free Ceramic-metal Based LED Array Package (세라믹-금속 기반 LED 어레이 패키지의 저온동시소성시 휨발생 억제 연구)

  • Heo, Yu Jin;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.35-41
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    • 2016
  • Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

Microstructure and Thermal Insulation Properties of Ultra-Thin Thermal Insulating Substrate Containing 2-D Porous Layer (2차원 기공층을 포함하는 초박형 단열기판의 미세구조 및 단열 특성)

  • Yoo, Chang Min;Lee, Chang Hyun;Shin, Hyo Soon;Yeo, Dong Hun;Kim, Sung Hoon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.11
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    • pp.683-687
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    • 2017
  • We investigated the structure of an ultra-thin insulating board with low thermal conductivity along z-axis, which was based on the idea of void layers created during the glass infiltration process for the zero-shrinkage low-temperature co-fired ceramic (LTCC) technology. An alumina and four glass powders were chosen and prepared as green sheets by the tape casting method. After comparison of the four glass powders, bismuth glass was selected for the experiment. Since there is no notable reactivity between alumina and bismuth glass, alumina was selected as the supporting additive in glass layers. With 2.5 vol% of alumina powder, glass green sheets were prepared and stacked alternately with alumina green sheet to form the 'alumina/glass (including alumina additive)/alumina' structure. The stacked green sheets were sintered into an insulating substrate. Scanning electron microscopy revealed that the additive alumina formed supporting bridges in void layers. The depth and number of the stacking layers were varied to examine the insulating property. The lowest thermal conductivity obtained was 0.23 W/mK with a $500-{\mu}m-thick$ substrate.

Investigation of the Cryogenic Performance of the High Density Polyurethane Foam (고밀도 폴리우레탄 폼의 극저온 성능 분석)

  • Jeong-Hyeon Kim;Jeong-Dae Kim;Tae-Wook Kim;Seul-Kee Kim;Jae-Myung Lee
    • Journal of the Korean Society of Industry Convergence
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    • v.26 no.6_3
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    • pp.1289-1295
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    • 2023
  • Polyurethane foam insulation required for storing and transporting cryogenic liquefied gas is already widely used as a thermal insulation material for commercial LNG carriers and onshore due to its stable price and high insulation performance. These polyurethane foams are reported to have different mechanical performance depending on the density, and the density parameter is determined depending on the amount of the blowing agent. In this study, density-dependent polyurethane foam was fabricated by adjusting the amount of blowing agent. The mechanical properties of polyurethane foam were analyzed in the room temperature and cryogenic temperature range of -163℃ at 1.5 mm/min, which is a quasi-static load range, and the cells were observed through microstructure analysis. The characteristics of linear elasticity, plateau, and densification, which are quasi-static mechanical behaviors of polyurethane foam, were shown, and the correlation between density and mechanical properties in a cryogenic environment was confirmed. The correlation between mechanical behavior and cell size was also analyzed through SEM morphology analysis. Polyurethane foam with a density of 180 kg/m3 had a density about twice as high as that of a polyurethane foam with a density of 96 kg/m3, but yield strength was about 51% higher and cell size was about 9.5% smaller.