• Journal of the Korean Society for Precision Engineering
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• v.28 no.4
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• pp.513-520
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• 2011

The NIL processes have been studied to implement low cost, high throughput and high resolution application. A RNIL(roller NIL) is an alternative approach to flat nanoimprint lithography. RNIL process is necessary to transfer patterns on flexible substrates. Compared with flat NIL, RNIL has the advantages of better uniformity, less pressing force, and the ability to repeat the patterning process continuously on a large substrate. This paper studies the design, construction and verification of a thermal RNIL system. The proposed RNIL system can easily adopt the flat shaped hot plate which is one of the most important technologies for NIL. The NIL system can be used to transfer patterns from a flexible stamp to a flexible substrate, from a flexible stamp to a Si substrate, and from a roller stamp to a flexible substrate, etc. Patterning on flexible substrates is one of the key technologies to produce bendable displays, solar cells and other applications.

• Transactions of Materials Processing
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• v.16 no.4 s.94
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• pp.266-270
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• 2007

Inertia welding is a solid-state welding process in which butt welds in materials are made in bar and in ring form at the joint face, and energy required for welding is obtained from a rotating flywheel. The stored energy is converted to frictional heat at the interface under axial load. The quality of the welded joint depends on many parameters, including axial force, initial revolution speed and energy, amount of upset, working time, and residual stresses in the joint. Inertia welding was conducted to make the large rotor shaft for low speed marine diesel engine, alloy steel for shaft of 140mm. Due to material characteristics, such as, thermal conductivity and high temperature flow stress, on the two sides of the weld interface, modeling is crucial in determining the optimal weld parameters. FE simulation is performed by the commercial code DEFORM-2D. A good agreement between the predicted and actual welded shape is observed. It is expected that modeling will significantly reduce the number of experimental trials needed to determine the weld parameters.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.565-565
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• 2012

그래핀(Graphene) 기반의 전계효과 트랜지스터(Field effect transistor) 응용에 있어, 가장 핵심적인 도전과제중 하나는 에너지 밴드갭(Energy bandgap)을 갖는 그래핀 채널의 제작이다. 그래핀은 에너지 밴드갭이 존재하지 않는 반금속(semi metal)의 특성을 지니고 있어, 그 본래의 물리적 특성을 지니고서는 소자구현에 어려움이 있다. 그러나 폭이 수~수십 나노미터인 그래핀 나노리본(Graphene nanoribbon)의 경우 양자구속효과(Quantum confinement effect)에 의하여 에너지 밴드갭이 형성되며, 갭의 크기는 리본의 폭에 반비례한다는 연구결과가 보고된 바 있다. 이러한 이유에서, 효과적이며 실현가능한 그래핀 나노리본의 제작은 필수적이다. 본 연구에서는 은 나노 와이어(Ag nanowire)를 기반으로 한 그래핀 나노리본의 합성을 연구하였다. 은 나노와이어를 열화학 기상증착법(Thermal chemical vapor deposition)을 이용, 아세틸렌(Acetylene, C2H2) 가스를 탄소공급원으로 하여 그래핀을 나노와이어 표면에 합성하였다. 합성과정에서 구조에 영향을 미치는 요인인 합성온도와 가스의 비율, 압력 등을 조절하여 최적화된 합성조건을 확립하였다. 합성된 나노리본의 특성을 라만분광법(Raman spectroscopy)과 주사전자 현미경(Scanning electron microscopy), 투과전자현미경(Transmission electron microscopy), 원자힘 현미경(Atomic force microscopy)를 통하여 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.561-561
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• 2012

Graphene, two dimensional single layer of carbon atoms, has tremendous attention due to its superior property such as fast electron mobility, high thermal conductivity and optical transparency, and also found many applications such as field-effect transistors (FET), energy storage and conversion, optoelectronic device, electromechanical resonators and chemical sensors. Several techniques have been developed to form the graphene. Especially chemical vapor deposition (CVD) is a promising process for the large area graphene. For the electrically isolated devices, the graphene should be transfer to insulated substrate from Cu or Ni. However, transferred graphene has serious drawback due to remaining polymeric residue during transfer process which induces the poor device characteristics by impurity scattering and it interrupts the surface functionalization for the sensor application. In this study, we demonstrate the characteristics of solution-gated FET depending on the removal of polymeric residues. The solution-gated FET is operated by the modulation of the channel conductance by applying a gate potential from a reference electrode via the electrolyte, and it can be used as a chemical sensor. The removal process was achieved by several solvents during the transfer of CVD graphene from a copper foil to a substrate and additional annealing process with H2/Ar environments was carried out. We compare the properties of graphene by Raman spectroscopy, atomic force microscopy(AFM), and X-ray Photoelectron Spectroscopy (XPS) measurements. Effects of residual polymeric materials on the device performance of graphene FET will be discussed in detail.

• Journal of the Korean Society of Clothing and Textiles
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• v.28 no.1
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• pp.112-118
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• 2004

Recently, as the percentage of women employment has been growing, the demand for various facilities and services regarding household duties and infant rearing is increasing and so do the amount of the disposable diaper used. Among the components of disposable diaper, the top sheet contacting with infant skin directly is usually made with nonwoven textiles. Therefore, the mechanical and surface characteristics of the nonwovens used in disposable diaper are important for the skin health of infants. In this study, we have explored the mechanical and surface properties, such as friction coefficient, fluid permeability and strength, of the nonwovens used for disposable diaper top sheet and observed the variation of their properties with abrasion cycles. Nonwoven materials examined in this study are 100% cotton spunlace, 100% tencel spunlace, 100% polypropylene (PP) thermal bonding and 100% PP air through (Thru-air bonded carded web). From the result of KES-F analysis, we've found that 100% PP air through type nonwoven had a low friction coefficient and showed a little change in surface properties as increasing abrasion cycles. Moreover, it revealed superior fluid permeability and quick-drying character. On the other hand, though showing an excellent absorption force, the spun lace type nonwoven made of 100% cotton and 100% tencel displayed relatively low abrasion strength especially in wetting condition.

• Applied Chemistry for Engineering
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• v.7 no.4
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• pp.809-812
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• 1996

Generalized van der Waals equation of state combined with the core-softening theory and temperature dependent repulsive and attractive terms exhibit the anomalous thermal expansion, i.e. density anomaly. Density maxima occur at both positive and negative pressure when the hard-core diameter decreases with increasing temperature, $db_r/dT_r<0$, and at negative pressure when the repulsive force increases with increasing temperature, $da_r/dT_r>0$.

• Particle and aerosol research
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• v.5 no.3
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• pp.123-131
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• 2009

This paper presents simulation results of particle transport in low-pressure, low-temperature plasma environment. The size dependent transport of particles in the plasma is investigated with a two-dimensional simulation tool developed in-house for plasma chamber analysis and design. The plasma model consists of the first two and three moments of the Boltzmann equation for ion and electron fluids respectively, coupled to Poisson's equation for the self-consistent electric field. The particle transport model takes into account all important factors, such as gravitational, electrostatic, ion drag, neutral drag and Brownian forces, affecting the motion of particles in the plasma environment. The particle transport model coupled with both neutral fluid and plasma models is simulated through a Lagrangian approach tracking the individual trajectory of each particle by taking a force balance on the particle. The size dependant trap locations of particles ranging from a few nm to a few ${\mu}m$ are identified in both electropositive and electronegative plasmas. The simulation results show that particles are trapped at locations where the forces acting on them balance. While fine particles tend to be trapped in the bulk, large particles accumulate near bottom sheath boundaries and around material interfaces, such as wafer and electrode edges where a sudden change in electric field occurs. Overall, small particles form a "dome" shape around the center of the plasma reactor and are also trapped in a "ring" near the radial sheath boundaries, while larger particles accumulate only in the "ring". These simulation results are qualitatively in good agreement with experimental observation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.8
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• pp.732-736
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• 2006

This paper describes the physical characterizations of polycrystalline 3C-SiC thin films heteroepitaxially grown on Si wafers with thermal oxide, In this work, the 3C-SiC film was deposited by LPCVD (low pressure chemical vapor deposition) method using single precursor 1, 3-disilabutane $(DSB:\;H_3Si-CH_2-SiH_2-CH_3)\;at\;850^{\circ}C$. The crystallinity of the 3C-SiC thin film was analyzed by XPS (X-ray photoelectron spectroscopy), XRD (X-ray diffraction) and FT-IR (fourier transform-infrared spectometers), respectively. The surface morphology was also observed by AFM (atomic force microscopy) and voids or dislocations between SiC and $SiO_2$ were measured by SEM (scanning electron microscope). Finally, residual strain was investigated by Raman scattering and a peak of the energy level was less than other type SiC films, From these results, the grown poly 3C-SiC thin film is very good crystalline quality, surface like mirror, and low defect and strain. Therefore, the polycrystalline 3C-SiC is suitable for harsh environment MEMS (Micro-Electro-Mechanical-Systems) applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.2
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• pp.156-161
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• 2007

This paper describes the characteristics of polycrystalline ${\beta}$ or 3C (cubic)-SiC (silicon carbide) thin films heteroepitaxailly grown on Si wafers with thermal oxide. In this work, the poly 3C-SiC film was deposited by APCVD (atmospheric pressure chemical vapor deposition) method using HMDS (hexamethyildisilane: $Si_{2}(CH_{3}_{6})$ single precursor. The deposition was performed under various conditions to determine the optimized growth conditions. The crystallinity of the 3C-SiC thin film was analyzed by XPS (X-ray photoelectron spectroscopy), XRD (X-ray diffraction) and FT-IR (fourier transform-infrared spectometers), respectively. The surface morphology was also observed by AFM (atomic force microscopy) and voids or dislocations between SiC and $SiO_{2}$ were measured by SEM (scanning electron microscope). Finally, depth profiling was invesigated by GDS (glow discharge spectrometer) for component ratios analysis of Si and C according to the grown 3C-SiC film thickness. From these results, the grown poly 3C-SiC thin film is very good crystalline quality, surface like mirror and low defect. Therfore, the poly 3C-SiC thin film is suitable for extreme environment, Bio and RF MEMS applications in conjunction with Si micromaching.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.16-22
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• 2018

Silicon carbide (SiC) is used in various semiconductor processes because it has superior thermal, mechanical, and electrical characteristics as well as higher chemical and corrosion resistance than existing materials. Due to these characteristics, various manufacturing technologies have been developed for SiC. A recent development among these technologies is Chemical Vapor Deposition SiC (CVD-SiC). Many studies have been carried out on the processing and manufacturing of CVD-SiC due to its different material characteristics compared to existing materials like RB-SiC or Sintered-SiC. CVD-SiC is physically stable and has excellent chemical and corrosion resistance. However, there is a problem with increasing the thickness, because it is manufactured through a deposition process. Additionally, due to its high strength and hardness, it is difficult to subject to machining.