• Journal of the korean academy of Pediatric Dentistry
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• v.24 no.1
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• pp.139-147
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• 1997

Argon laser used in this case report, is special in having two wavelength of 488, 514nm blue-green visible light spectrum. Blue light is used for composite resin polymerization and caries detection. Green light is used for soft tissue surgery and coagulation. Maximum absorption of this laser light occurs in red pigmentation such as hemoglobin. The argon laser may be well-suited for selective destruction of blood clots and hemangioma with minimal damage to adjacent tissues. Argon laser light penetrates tissue to the 1 mm depth, so its thermal intensity is lower than $CO_2$ laser light. Also, due to its short wavelength it can be focused in a small spot and even single gene can be excised by this laser and microscopy. After applicating argon laser to 4 patient for surgical procedure and to 1 patient for curing the composite resin, following results were obtained. 1. Improved visibility were gained due to hemostasis and no specific technique were needed according to easy recontouring of the tissue. 2. Ability to use by contact mode, tactile sense was superior but tissue dragability and accumulation of tissue on the tip needed sweeping motion. 3. Additive local anesthetic procedure was needed. 4. No suture and less curing time reduced chair time, this made argon laser available in pediatric dentistry.

• Journal of the Korean Ceramic Society
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• v.48 no.4
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• pp.293-297
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• 2011

The thermodynamic behavior of phenolic resin was investigated to verify the relation between the properties of porous ceramics with $ZrO_2$-C system for submerged entry nozzle and the characteristics of phenolic resin with various relative humidity. The green and the sintered density were decreased between 25% and 50% relative humidity, whereas they were gradually enhanced above 50% relative humidity. The highest value of apparent porosity was 20.1% and the minimum compressive strength was 69MPa in the specimen using the powder exposed to 50% relative humidity. As a result of thermal analysis for phenolic resin, the shift of endothermic peak to low temperature and the reduction of exothermic peak were observed, and the peaks corresponded to melting and curing of phenolic resin, respectively. The melting and the curing of phenolic resin generate the change of green density, and it can affect the properties of submerged entry nozzle.

• Design & Manufacturing
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• v.8 no.2
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• Elastomers and Composites
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• v.31 no.1
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• pp.33-42
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• 1996

NR, NBR, and CR rubber were prepared by mixing filler in various ratios. Their vulcanization characteristics and thermal properties were studied. Vulcanization characteristics were investigated using cure curve that had been obtained from oscillating disk rheometer study. The Arrhenius law is known to describe the relationship between cure time and temperature of most elastomers. Curing could be done by the addition of sulfur, peroxides, and proper acceleratores. The optimum cure time that affects desirable values of modulus and tensile strength of the vulcanizate is taken as t90 as measured by a rheometer. Rubbers were cured in the rheometer at temperatures ranging from $130^{\circ}C\;to\;180^{\circ}C$ in order to check the validity of the curing system used. A linear relationship between ln(ts2) and ln(t90) was found for all elastomers. The term sensitivity has been used to describe the relationship between a change of ts2 to the corresponding change of t90 due to an increment of temperature. This is related to the formula of the compound.

• Tribology and Lubricants
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• v.19 no.4
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• pp.203-210
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• 2003

In order to enhance the thermal stability of binder materials of bonded type solid lubricants, several metal-alkoxide based sol-gel materials such as methyltrimethoxysilane(MTMOS), titaniumisopropoxide (Ti(Opr$\^$i/)$_4$), zirconiumisopropoxide (Zr(Opr$\^$i/)$_4$) and aluminumbutoxide (Al(Obu$\^$t/)$_4$) were modified chemically by both epoxy and acrylic silane compounds. Friction and wear characteristics of the bonded solid lubricants, whose binders were of several hybrid ceramic materials, were tested with a reciprocating tribo-tester. Wear life was evaluated with respect to the heat-curing temperature, friction temperature, type of supplement lubricants, and ratio of binder materials. Test results showed that the Si-Zr hybrid ceramic materials modified by epoxy-silane compounds had a higher wear life compared to others. Sb$_2$O$_3$ was the most effective supplement lubricants in the high temperature, and BUS analyses revealed that it was caused mainly by a strong anti-oxidation effect to MoS$_2$ particles. The higher heat-curing temperature resulted in the higher wear life, and the higher friction temperature resulted in the lower wear life.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2008.11a
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• pp.49-52
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• 2008

The present study was to develop a dry PFB method similar to the existing gypsum board construction method in order to apply the existing wet PFB method that uses fire-resistant adhesive. It was found that the existing wet method can produce concrete compressive strength of 80MPa and fire resistance of 3 hours with 30mm PF boards. The goal of development in this study was fire resistance of 3 hours through dry construction of 15mm fire-resistant boards. 1. Improved PF board was prepared by adding inorganic fiber to existing board and using aggregate with grain size of 3mm or less. Molding was done at temperature higher than that for existing PF board molding. While wet curing is used for existing PF boards, this study used dry curing in order to enhance heat insulation performance. 2. According to the results of fire resistance test, when the dry PF method was applied, the temperature of the main reinforcing bar was 116℃ in 15mm, 103.8℃ in 20mm, and 94℃ in 25mm, and these results satisfied the current standards for fire resistance control presented by the Ministry of Land, Transport and Maritime Affairs. When a 3-hour fire resistance test was performed and the external properties of the specimen were examined, the outermost gypsum board hardly remained and internal PF board maintained its form without thermal strain.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• Electrical & Electronic Materials
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• v.7 no.1
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• pp.32-41
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• 1994

In this study, the TSC spectroscopy has been applied to investigate the influence of structural change due to a process of curing reaction on the electrical properties of epoxy composites cured with acid-anhydride. Five TSC peaks appeared in -160-250[.deg.C]: in the low temperature region below glass transition temperature(T$\_$g/), three relaxation mode peaks due to action of side chains, substitution group or terminal groups have been observed, a peak associated with T$\_$g/, appeared in 110[.deg. C] and p peak due to ionic space charges located in 150[.deg.C]. Each peak was separated into elementary peaks by the partial polarization procedure, and the distribution of activation energy and relaxation time were analized to clearify the origin of each peak. Also, overaboundantly added hardener separated a .betha. peak near 10[.deg. C] into two peaks of .betha.$\_$1/(10.deg. C) and .betha.$\_$2/(20.deg. C) according to increasement of forming field, and the separated hardener was oxidated thermally with increasing surrounding temperatures. The expansion of the free volume need in molecular motion and the reduction of the structural packing density through thermal oxidation process increased TSC between .alpha. peak and .betha. peak and decreased T$\_$g/.

• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Polymer(Korea)
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• v.28 no.5
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• pp.391-396
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• 2004

In order to overcome drawbacks in the conventional preparation of epoxy/silica nanocomposites, such as formation of micro voids and dimensional instability caused by evolution of volatile by-products during curing reaction, a novel preparation method using Si-N precursor has been proposed. When prepared through in-situ reaction of epoxy curing reaction with sol-gel reaction of Si-N precursor, methyltripiperidinylsilane (MTPS) which does not produce by-products during reaction, epoxy/silica nanocomposites of extremely even dispersion of inorganic phase could be successfully prepared, resulting in high enhancement of mechanical and thermal properties as well as outstanding transparency.