• Elastomers and Composites
• /
• v.52 no.2
• /
• pp.136-142
• /
• 2017

Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

• Proceedings of the KIEE Conference
• /
• 1991.07a
• /
• pp.259-262
• /
• 1991

Carbon fiber/Aluminum composites were fabricated vacuum hot press method with condition of $10^{-3}$ torr, 100MPa, $600^{\circ}C$, 30min. Microstructure, mechanical properties, electrical properties and thermal properties of CF/Al composites were studied.

• Journal of Welding and Joining
• /
• v.20 no.1
• /
• pp.76-82
• /
• 2002

In these days, many advanced nations have enforced import restrictions against things emitting electromagnetic wave which has report that it is so harmful. In general, electromagnetic wave is composed of electric wave and magnetic wave. The reflection of electromagnetic wave is mainly reflected by conductive materials and the magnetism loss is generated by magnetic ferrite. The magnetism loss of ferrite is separated by eddy current loss, residual magnetism loss and hysteresis loss. Thermal sprayed coating is intended to manufacture because of simple processes and high efficient electromagnetic wave shielding. The high efficient thermal sprayed coatings were made from the magnetic ferrite materials that characterizes absorption of electromagnetic wave, and the electric conductive materials that characterize emitting of electromagnetic wave. This study was manufactured thermal sprayed coatings to improve absorption-efficiency, and measured the electromagnetic wave shielding efficiency. As the experimental results, high electromagnetic wave shield efficiency was obtained at wave frequency 2GHz to thermal sprayed ferrite coatings manufactured by size distribution range of spray powders, $38~88\mu\textrm{m}$.

• Applied Chemistry for Engineering
• /
• v.31 no.1
• /
• pp.73-83
• /
• 2020

As electronic devices become more advanced and smaller, one of the biggest problems to solve is the heat affecting the efficiency and lifetime of instruments. High thermal conductivity materials, in particular, metal or ceramic ones, have been used to reduce the heat generated from devices. However, due to their low mechanical properties and high weight, thermally conductive composites composed with polymers having a light-weight and good mechanical properties as a matrix and carbon materials having high thermal conductivity as a thermally conductive filler have been attracting great attention. To improve the thermal conductivity of the composites, a phonon scattering must be suppressed to move phonon effectively. In this review, we classified researches related to phonon migration and scattering inhibition of carbon/polymer composites, and discussed various methods to improve thermal conductivity.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.2
• /
• pp.13-21
• /
• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Composites Research
• /
• v.35 no.2
• /
• pp.69-74
• /
• 2022

In this study, the conductive paste used in a wide range such as wiring in the electronic packaging field, the automobile industry, and electronic products is manufactured under various process conditions due to the simplicity of the process, and then the thermal, mechanical, and electrical characteristics are analyzed and simulation studies are conducted to optimize the process. to establish the conditions of the conductive paste manufacturing process. First, a conductive paste was prepared by setting various types of binder resin, an essential component of the conductive paste, and characteristics such as thermal conductivity, tensile strength, and elongation were analyzed. Among the binder resins, the conductive paste applied with a flexible epoxy material had the best physical properties, and a simulation study was conducted based on the physical property data base of the conductive face. As a result of the simulation, the best physical properties were exhibited when the Ag flake volume fraction was 60%.

• Korean Journal of Materials Research
• /
• v.27 no.8
• /
• pp.422-430
• /
• 2017

Al/expanded graphite was successfully synthesized through a facile method including ultrasonic and heat treatment. In the well-designed three dimensional structure, expanded graphite(EG) works as a conductive matrix to support coated Al particles. The effects of the fabrication parameters on the microstructures and thermal conductivities of these composites were investigated. As a result, it was found that composites with graphite volume fraction of 17.4-69.4 % sintered at $600^{\circ}C$/45MPa exhibit in-plane thermal conductivities of 380-940 W/mK, over 90 % of the predictions by rule of mixture. According to the non-destructive analysis results, the synergistic enhancement was caused by the formation of efficient thermally conductive pathways due to the hybrid of the differently sized EG. The structure integrates the advantages of expanded graphite as a conductive support, preserving the electrode activity and integrity and improving the electrochemical performance.

• Tribology and Lubricants
• /
• v.5 no.2
• /
• pp.42-47
• /
• 1989

The thermal behaviour of layerd solids, typified in practice by surface coated materials, is evaluated for the specific case of a fast moving heat source. This is intended to represent the particular instance of solids in sliding contact and the consequences of friction. The finite difference method has been utilised to establish the temperature distributions at the surface and also the sub-surface region for coating materials which are either less conductive or more conductive than the substrate to which they are attached. The effects of variation in layer thickness, and also the load, speed and friction coefficient, are evaluated.

• Journal of the Korean Solar Energy Society
• /
• v.33 no.1
• /
• pp.66-72
• /
• 2013

In this study, the thermal conductive characteristics and basic properties of the nine commercial products of bentonite grouts were studied. Six of the nine products for ground heat exchanger systems are imported and others for civil engineering are domestic. The thermal conductivities of all bentonite products are nearly similar among products. The free swell indexes, viscosities and filter losses of the ground heat exchanger grouts are lower than those of the civil engineering ones. These characteristics seem to increase of the fluidity to fill the bentonite slurry to bore-hall perfectly, rather than to prevent underground water penetration. Thus, the mixtures of bentonites and sands are recommended for high thermal conduction grouts.

• Journal of computational fluids engineering
• /
• v.15 no.2
• /
• pp.28-34
• /
• 2010

Conductive and radiative thermal model configurations of an imager of a geostationary satellite are presented. A two-plane method is introduced for three dimensional conductive coupling which is not able to be treated by thin shell plate thermal modeling technique. Especially the two-plane method is applied to massive matters and PIP(Payload Interface Plate) in the imager model. Some massive matters in the thermal model are modified by adequate correction factors or equivalent thickness in order to obtain the numerical results of thermal modeling to be consistent with the analytic model. More detailed nodal breakdown is specially employed to the object which has the rapid temperature gradient expected by a rule of thumb. This detailed thermal model of the imager is supposed to be used for analyses and test predictions, and be correlated with the thermal vacuum test results before final in-flight predictions.