• Structural Engineering and Mechanics
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• 제10권3호
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• pp.245-262
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• 2000

The objective of this study is to analyze the deformational characteristics of a high-vacuum insulation panel that is evacuated to eliminate significant gas-phase conductance through its thickness. The panel is composed of a metal envelope and low thermal conductance spacers. The problem is very challenging because several nonlinearities are involved concurrently. Not only are various finite element models such as triangular, rectangular, beam and circular plate models used to simulate the panel, but also several finite element programs are used to solve the problem based on the characteristics of the finite element model. The numerical results indicate that the effect of the diameter of the spacer on the vertical deformation of the plate panel is negligibly small. The parameter that mainly influences the maximum sag is the spacing between the spacers. The maximum vertical deformation of the panel can be predicted for a practical range of the spacing between the spacers and the thickness of the plate. Compared with the numerical results obtained by the finite element models and the experimental tests, they have a good agreement. The results are represented in both tabular and graphical forms. In order to make the results useful, a curve fitting technique has been applied to predict the maximum deformation of the panel with various parameters. Moreover, the panel was suggested to be a "smart" structure based on thermal effect.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1400-1405
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• 2004

Experimental study is performed to investigate the effect of heat load and operating temperature on the thermal performance of a heat pipe with screen mesh wick. The heat pipe was designed in 200 screen meshes, 500mm length and 12.7mm O.D tube of copper, water as working fluid(4.8g) and nitrogen as non-condensible gas(NCG). The heat pipe used in this study has evaporator, condenser and adiabatic section, respectively. Experimental data of axial wall temperature distribution is presented for heat transport capacity, the temperature of cooling water of condenser, inclination angle, and operating temperature. For the results from this study, it is found that, for the same charging mass of working fluid, the initial operating temperature and the overall wall temperatures of heat pipe are higher for NCG charging mass of $5.0{\times}10^{-6}kg$ and $3.4{\times}10^{-6}kg$, than that of $1.0{\times}10^{-6}kg$.

• 설비공학논문집
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• 제20권10호
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• pp.689-695
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• 2008

Experimental study has been performed to investigate the influence of non-condensible gas(NCG) charged mass on the thermal performance of a variable conductance heat pipe(VCHP) with screen mesh wick. The VCHP is furnished by screen mesh number 200 for the pipe outer diameter of 12.7mm and the pipe length of 500 mm. The VCHP is filled with water as working fluid of 4.8g and nitrogen as NCG and has evaporator, condenser and adiabatic section, respectively. For the results from experiment, it is found that, for the same charged mass of working fluid, the overall wall temperatures of heat pipe grows up with increasing NCG charged mass. The variation of operating temperature of VCHP reduces with increasing NCG mass. In addition, the profile of axial wall temperature distribution is presented for heat transport capacity of heat pipe, the temperature of cooling water of condenser, inclination angle, and operating temperature.

• 한국전산유체공학회지
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• 제15권2호
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• pp.28-34
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• 2010

Conductive and radiative thermal model configurations of an imager of a geostationary satellite are presented. A two-plane method is introduced for three dimensional conductive coupling which is not able to be treated by thin shell plate thermal modeling technique. Especially the two-plane method is applied to massive matters and PIP(Payload Interface Plate) in the imager model. Some massive matters in the thermal model are modified by adequate correction factors or equivalent thickness in order to obtain the numerical results of thermal modeling to be consistent with the analytic model. More detailed nodal breakdown is specially employed to the object which has the rapid temperature gradient expected by a rule of thumb. This detailed thermal model of the imager is supposed to be used for analyses and test predictions, and be correlated with the thermal vacuum test results before final in-flight predictions.

• 한국전자통신학회논문지
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• 제5권1호
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• pp.88-92
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• 2010

본 연구에서는 기존의 반도체 공정을 이용하여 bottom gate, top gate구조의 탄소나노튜브 트랜지스터를 제작하였다. 게이트 특성에 따른 특성을 연구하기 위하여 열화학 기상 증착법(CVD)으로 탄소나노튜브를 디바이스에 직접 성장시키고, 탄소나노튜브의 성장 특성 및 I-V동작 특성을 분석하였다. 제작된 탄소나노튜브 FET는 p-type, 즉 hole이 다수 캐리어로 존재하는 트랜지스터이며 구동전압에 따라 conductance 변화하는 특성을 보였다.

• 한국전기전자재료학회논문지
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• 제20권5호
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• pp.389-393
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• 2007

We fabricated field-effect transistor based carbon nanotubes(CNTs) directly grown by thermal chemical vapor deposition(CVD) and analyzed their performance. The Ethylene ($C_2H_4$), hydrogen($H_2$) and Argon(Ar) gases were used for the growth of CNTs at $700\;^{\circ}C$. The growth properties of CNTs on the device were analyzed by SEM and AFM. The electrical transport characteristics of CNT FET were investigated by I-V measurement. Transport through the nanotubes is dominated by holes at room temperature. By varying the gate voltage, we successfully modulated the conductance of FET device by more than 7 orders of magnitude.

• 센서학회지
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• 제16권4호
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• pp.313-318
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• 2007

Single-wall carbon nanotube field-effect transistors (SWCNT FETs) of top gate structure were fabricated in a conventional metal-oxide-semiconductor field effect transistor (MOSFET) with gate electrodes above the conduction channel separated from the channel by a thin $SiO_{2}$ layer. The carbon nanotubes (CNTs) directly grown using thin Fe film as catalyst by thermal chemical vapor deposition (CVD). These top gate devices exhibit good electrical characteristics, including steep subthreshold slope and high conductance at low gate voltages. Our experiments show that CNTFETs may be competitive with Si MOSFET for future nanoelectronic applications.

• Nuclear Engineering and Technology
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• 제27권3호
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• pp.344-357
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• 1995

핵연료 소결체와 피복관 사이의 간극 크기에 크게 좌우되는 간극 열전도도는 연료봉내 초기 저장에너지 양에 중요한 영향을 끼친다. 정상상태 계산용 ELESTRES 코드에서 사용 중인 수정된 Ross-Stoute 의 간극 열전도도 모델은 단순한 열적 변형 모델에 기초한다. 최근의 실험에서 핵연료 소결체가 연소됨에 따라서 균열, 소결체 재배열 등이 발생되고, 피복관 내부의 편심에 위치하게 된다는 것이 알려졌다. 본 논문에서는, 최근에 제안된 편심형 간극 모델과 소결체 재배열형 간극 모델 등이 기술되었고, 실험 조건과 중수로 핵연료봉의 운전조건 하에서의 소결체와 피복관 사이의 간극 열전도도를 계산하는데 이용되었다. 실험 치와 계산치가 잘 일치됨으로써, 수정된 Ross-Stoute 모델이 ELESTRES 코드 내에서 사용된 열전달 관련 가정들과 잘 부합됨을 보여 주었다. 출력 경계곡선을 따라서 수정된 Ross-Stoute 모델로 계산된 간극내 열전달과 핵연료 표면 온도 등이 편심형 간극 모델과 소결체 재배열형 간극모델에 의한 예측치보다 보수적이었다.

• 센서학회지
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• 제27권5호
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of Electrical Engineering and Technology
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• 제6권2호
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• pp.270-274
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• 2011

This paper presents a parameterized simulation program with integrated circuit emphasis (SPICE) model of a two-level microbolometer based on negative-temperature-coefficient thin films, such as vanadium oxide or amorphous silicon. The proposed modeling begins from the electric-thermal analogy and is realized on the SPICE modeling environment. The model consists of parametric components whose parameters are material properties and physical dimensions, and can be used for the fast design study, as well as for the co-design with the readout integrated circuit. The developed model was verified by comparing the obtained results with those from finite element method simulations for three design cases. The thermal conductance and the thermal capacity, key performance parameters of a microbolometer, showed the average difference of only 4.77% and 8.65%, respectively.