• Journal of Welding and Joining
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• v.14 no.3
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• pp.48-57
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• 1996

A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied by impact test, optical microscopy and scanning electron microscopy. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at $660^{\circ}C$ for HY-100 steel and thermal cycled from $1350^{\circ}C$ to $25^{\circ}C$ with a cooling time of $\Delta$t_${800^{circ}C/500^{circ}C}$=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of $570~620^{\circ}C$. The time to failure$(t_f)$ at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. By the precipitation of $\varepsilon$-Cu phase, the differential strengthening of grain interior relative to grain boundary may be greater in the Cu-bearing HSLA-100 steel than in HY-100 steel. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility. The activation energies for SRC of HSLA-100 steel are 103.9kcal/mal for 387MPa and 87.6kcal/mol for 437MPa and that of HY-100 steel is 129.2kcal/mol for 437MPa.

• Proceedings of the KWS Conference
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• 1996.05a
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• pp.186-189
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• 1996

A study was made to examine the characteristics of base metal and stress relief cracking(SRC) of heat affected zone(HAZ) for HY-100 and Cu-bearing HSLA-100 steels. The Gleeble thermal/mechanical simulator was used to simulate the SRC/HAZ. The details of mechanical properties of base plate and SRC tested specimens were studied. The specimens were aged at $650^{\circ}C$ for HSLA-100 steel and at 66$0^{\circ}C$ for HY-100 steel and thermal cycled from 135$0^{\circ}C$ In $25^{\circ}C$ with a cooling time of $\Delta$ $t_{800^{\circ}50}$ $0^{\circ}C$/=21sec. corresponds to the heat input of 30kJ/cm. The thermal cycled specimens were stressed to a predetermined level of 248~600MPa and then reheated to the stress relief temperatures of 570~62$0^{\circ}C$. The time to failure( $t_{f}$) at a given stress level was used as a measure of SRC susceptibility. The strength, elongation and impact toughness of base plate were greater in HSLA-100 steel than in HY-100 steel. The time to failure was decreased with increasing temperature and/or stress. HSLA-100 steel was more susceptible to stress relief cracking than HY-100 steel under same conditions. It is thought to be resulted from the precipitation of $\varepsilon$-Cu phase by dynamic self diffusion of solute atoms. Therefore, greater strain concentration at grain boundary of HSLA-100 steel results in the increased SRC susceptibility.y.

• Geomechanics and Engineering
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• v.10 no.3
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• pp.357-386
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• 2016

In this research work, an exact analytical solution for thermal stability of solar functionally graded rectangular plates subjected to uniform, linear and non-linear temperature rises across the thickness direction is developed. It is assumed that the plate rests on two-parameter elastic foundation and its material properties vary through the thickness of the plate as a power function. The neutral surface position for such plate is determined, and the efficient hyperbolic plate theory based on exact neutral surface position is employed to derive the governing stability equations. The displacement field is chosen based on assumptions that the in-plane and transverse displacements consist of bending and shear components, and the shear components of in-plane displacements give rise to the quadratic distribution of transverse shear stress through the thickness in such a way that shear stresses vanish on the plate surfaces. Therefore, there is no need to use shear correction factor. Just four unknown displacement functions are used in the present theory against five unknown displacement functions used in the corresponding ones. The non-linear strain-displacement relations are also taken into consideration. The influences of many plate parameters on buckling temperature difference will be investigated. Numerical results are presented for the present theory, demonstrating its importance and accuracy in comparison to other theories.

• Journal of the Korean Institute of Gas
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• v.18 no.5
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• pp.72-77
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• 2014

It is known that there is no demand for building the arctic environment in Korea. However, it is important to use the different energy source instead of fuel source due to global warming. It is now demanded of using gas of Alaska and Siberia for long term developing the natural gas. The design of gas pipelines in Korea is very different from the arctic region. The operation of gas in arctic region have to consider of arctic region such as permafrost and active regions. It is needed to understand of gas pipeline design with different arctic soil properties. Nowadays, the pipelines is designed with stress-based and but there is demanded for strain based design with more deformed pipeline. We study of arctic environment with different active region using Finite Element Method of thermal elasto-plastic analysis.

• Structural Engineering and Mechanics
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• v.90 no.3
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• pp.219-232
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• 2024

In current study, for the first time, Nonlinear Bending of a skew microplate made of a laminated composite strengthened with graphene nanosheets is investigated. A mixture of mechanical and thermal stresses is applied to the plate, and the reaction is analyzed using the First Shear Deformation Theory (FSDT). Since different percentages of graphene sheets are included in the multilayer structure of the composite, the characteristics of the composite are functionally graded throughout its thickness. Halpin-Tsai models are used to characterize mechanical qualities, whereas Schapery models are used to characterize thermal properties. The microplate's non-linear strain is first calculated by calculating the plate shear deformation and using the Green-Lagrange tensor and von Karman assumptions. Then the elements of the Couple and Cauchy stress tensors using the Modified Coupled Stress Theory (MCST) are derived. Next, using the Hamilton Principle, the microplate's governing equations and associated boundary conditions are calculated. The nonlinear differential equations are linearized by utilizing auxiliary variables in the nonlinear solution by applying the Frechet approach. The linearized equations are rectified via an iterative loop to precisely solve the problem. For this, the Differential Quadrature Method (DQM) is utilized, and the outcomes are shown for the basic support boundary condition. To ascertain the maximum values of microplate deflection for a range of circumstances-such as skew angles, volume fractions, configurations, temperatures, and length scales-a parametric analysis is carried out. To shed light on how the microplate behaves in these various circumstances, the resulting results are analyzed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Korean Society of Hazard Mitigation
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• v.8 no.3
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• pp.1-9
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• 2008

Fiber Reinforced Polymer (FRP) composites are used extensively in aerospace, marine, automotive, infrastructure, chemical processing and sporting good applications. A concern with using FRP composites in some engineering structures is their high flammability and poor fire resistance In this research, material properties of FRP composites at increasingly high temperatures was measured and verified. The obtained mechanical properties of FRP composites were performed according to ASTM D3039/D3039M and tested to a wide range of heat conditions with temperatures from Room-temp. to 300 for times up to 30 min. It is found that the mechanical properties of FRP composites dropped with increasing heat or temperature. The reduction to the properties was due mainly to thermal degradation and combustion of the polymer matrix.

• Journal of the Society of Naval Architects of Korea
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• v.56 no.4
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• pp.335-342
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• 2019

The objective of this study is to analyze the mechanical properties of plywood used as a thermal insulating material for LNG CCS (Liquefied Natural Gas, Cargo Containment System). It is created by bonding an odd number of parallel and perpendicular direction for preventing contraction and expansion of wood. Also plywood is widely used as LNG CCS insulating material because of its durability, light weight and high stiffness. Since LNG CCS is loaded with liquid cargo, the impact load by sloshing during operation and the wide temperature range (room temperature, low temperature, cryogenic temperature) exposed during loading, unloading should be considered. The thickness of the plywood which is used for the membrane type MARKIII was selected as the thickness of the test specimen. In this present study, plywood is analyzed by the fracture behavior and mechanical properties of plywood by temperature and grain direction. In addition, it is necessary to analyze the fracture shape and predict the fracture strain by using regression model because the critical load may cause cracks inside the tank, which may affect the leakage of cryogenic liquid.

• Korean Journal Plant Pathology
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• v.2 no.2
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• pp.121-128
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• 1986

The biochemical properties of ribonucleic acid (RNA) and coat protein of the mild tobacco mosaic virus (TMV) mutant, Tw 333 are described. The molecular weight of the RNA calculated from polyacrylamide gel electrophoresis was $2.03\times10^6$ daltons. The molar ratio of the bases of the RNA was 25.4 guanine, 29.2 adenine, 17.5 cytosine and 27.9 uracil in moles. The hyperchromicity on Tw 333-RNA by thermal denaturation was $25.1\%$, indicating Tm value of $47^{\circ}C$. The virus coat protein migrated as a single component in SDS-polyacrylamide gel electrophoresis and had a molecular weight of 17,500 daltons. A total of 158 amino acid residues are present in the protein. Separation of the tryptic peptides by electrophoresis and chromatography yielded ninhydrin-positive compounds. The biochemical properties of RNA and coat protein of the mild mutant we very similar to those of wild type of TMV-OM strain, but some difference between the strains were observe in the base composition, hyperchromicity, amino acid composition and tryptic peptide map.