• Title/Summary/Keyword: Thermal Sensor

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Sensing performance evaluation under various environment condition of stroke sensing cylinder using magnetic sensor (자기센서를 이용한 위치검출 실린더의 환경변화에 따른 성능평가)

  • 김성현;이민철;양순용
    • 제어로봇시스템학회:학술대회논문집
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    • 1996.10b
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    • pp.636-639
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    • 1996
  • We have developed a part of hydraulic stroke sensing cylinder using magnetic sensor that can detect each position under severe construction fields. In this paper, for evaluating the developed cylinder under various environment condition, thermal control systems and two hydraulic systems to be coupled consist of. The former is composed of an heater case, temperature sensor, and interface circuits which include SCR(silicon controlled rectifier) for the control of the voltage's phase. The latter is composed of an hydraulic cylinder for position control with solenoid valve (ON/OFF motion) and a load cylinder with proportional reducing valve. To obtain the various performance evaluation, it is carried out under high temperature condition in thermal system controlled by using Ziegler-Nichols PID tuning method and artificial disturbances such as impulse or constant force. The results show that the developed cylinder has good performance under the various environment condition.

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Robot Design for Fire Detection and Data Processing (화재감지를 위한 로봇 설계 및 데이터 처리)

  • Moon, Yong-Seon;Seo, Young-Nam;Ko, Nak-Young;Roh, Sang-Hyun;Park, Jongkyu
    • The Journal of the Korea institute of electronic communication sciences
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    • v.5 no.1
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    • pp.31-36
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    • 2010
  • In this paper, an autonomous mobile robot for fire detection is designed. The robot is equipped with thermal sensor which rotates for wide range of detection. The fire detector A2TPMI is used. A data processing method for robust fire detection is also implemented. AD converter and Kalman filter is applied to remove noisy signal from the fire detection sensor.

Si Micromachining for MEMS-lR Sensor Application (결정의존성 식각/기판접합을 이용한 MEMS용 구조물의 제작)

  • 박흥우;주병권;박윤권;박정호;김철주;염상섭;서상의;오명환
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.411-414
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    • 1998
  • In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PT layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PT layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PT layer of c-axial orientation rained thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PT layer were measured, too.

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Unmanned Multi-Sensor based Observation System for Frost Detection - Design, Installation and Test Operation (서리 탐지를 위한 '무인 다중센서 기반의 관측 시스템' 고안, 설치 및 시험 운영)

  • Kim, Suhyun;Lee, Seung-Jae;Son, Seungwon;Cho, Sungsik;Jo, Eunsu;Kim, Kyurang
    • Korean Journal of Agricultural and Forest Meteorology
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    • v.24 no.2
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    • pp.95-114
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    • 2022
  • This study presented the possibility of automatic frost observation and the related image data acquisition through the design and installation of a Multiple-sensor based Frost Observation System (MFOS). The MFOS is composed of an RGB camera, a thermal camera and a leaf wetness sensor, and each device performs complementary roles. Through the test operation of the equipment before the occurrence of frost, the voltage value of the leaf wetness sensor increased when maintaining high relative humidity in the case of no precipitation. In the case of Gapyeong- gun, the high relative humidity was maintained due to the surrounding agricultural waterways, so the voltage value increased significantly. In the RGB camera image, leaf wetness sensor and the surface were not observed before sunrise and after sunset, but were observed for the rest of the time. In the case of precipitation, the voltage value of the leaf wetness sensor rapidly increased during the precipitation period and decreased after the precipitation was terminated. In the RGB camera image, the leaf wetness sensor and surface were observed regardless of the precipitation phenomenon, but the thermal camera image was taken due to the precipitation phenomenon, but the leaf wetness sensor and surface were not observed. Through, where actual frost occurred, it was confirmed that the voltage value of leaf wetness sensor was higher than the range corresponding to frost, but frost was observed on the surface and equipment surface by the RGB camera.

Measurement of CTE Change in a Composite Laminate with Aging under Space Environment using Fiber Optic Sensors (광섬유센서를 이용한 우주환경하에서 복합재료 적층시편의 노화에 따른 열팽창계수변화 측정)

  • Gang,Sang-Guk;Gang,Dong-Hun;Kim,Cheon-Gon;Hong,Chang-Seon
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.31 no.10
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    • pp.21-26
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    • 2003
  • In this research, the change of coefficient of thermal expansion (CTE) of graphite/epoxy composite laminate under space environment was measured using fiber optic sensors. Two fiber Bragg grating (FBG) sensors have been adopted for the simultaneous measurement of thermal strain and temperature. Low Earth Orbit (LEO) conditions with high vacuum, ultraviolet and thermal cycling environments were simulated in a thermal vacuum chamber. As a pre-test, a FBG temperature sensor was calibrated and a FBG strain sensor was verified through the comparison with the electric strain gauge (ESG) attached on an aluminun specimen at high and low temperature respectively. The change of the CTE in a composite laminate exposed to space environment was measured for intervals of aging cycles in real time. As a whole, there was no abrupt change of the CTE after 1000 aging cycles. After aging, however, the CTE decreased a Little all over the test temperature range. These changes are caused by outgassing, moisture desorption, matrix cracking etc.

Development of SPM Dynamic Analysis Software (SPM의 동적해석 S/W 개발)

  • 이문성;김진석;조철희;홍성근;정광식
    • Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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    • 2000.10a
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    • pp.84-89
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    • 2000
  • Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. The thermal analyses for the proposed planar structure including temperatur distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of a actual device to investigate the acceptability of the computer simulation.

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A Study on Improvement Position Error induced Thermal Deformation of CNC Lathe Using Touch Sensor (접촉 센서를 이용한 CNC 선반 열변형에 따른 위치오차 개선에 관한 연구)

  • 홍성오
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.11 no.4
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    • pp.102-106
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    • 2002
  • Development of high speed feed drive system has been a major issue for the past few decades in machine tool industries. The reduction of the tool change time as well as rapid travel time can enhance the productivity. However, the high speed feed drive system generates more heat in nature, which leads thermal expansion that has adverse effects on the accuracy of machined parts. The detail of the model proposed is described in the paper together with the experimental methodologies using a proposed compact measurement system to examine the validity of the proposed approach. The results showed the machining accuracy could be maintained to better than $\pm$ 5$\mu\textrm{m}$ while using this sensor.

Thermal stress and IR radiation of poly-silicon IR source (Poly-silicon IR source의 thermal stress 및 방사특성 평가)

  • Shin, Kyu-Sik;Lee, Dae-Sung;Whang, Hak-In
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1549_1550
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    • 2009
  • 본 연구에서는 적외선 가스 센서용 IR source에 대한 연구를 진행하였다. MEMS 공정을 이용하여 poly-silicon을 IR source의 발열체로 사용하였다. Chip size는 $2{\times}2mm$ 이며 membrane의 면적은 $1{\times}1mm$로 설계, 제작 하였다. 제작된 IR source의 적외선 방출 특성을 적외선 카메라를 이용하여 관찰하였으며, 같은 온도에서의 thermal stress에 대한 관찰도 진행하였다.

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Pre-processing for the Design of Micro-fluid Flow Sensing Elements

  • Kim Jin-Taek;Pak Bock-Choon;Lee Cheul-Ro;Baek B.J.
    • KSTLE International Journal
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    • v.7 no.1
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    • pp.22-26
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    • 2006
  • A simple finite element analysis is performed to simulate the thermal characteristics of a micro sensor package with thin film heater embedded in the glass wall of a micro-channel. In this paper, Electric characteristics of ITO sputtered heater were presented in this study, which can be used as a map of heater design in the range of available system temperature. The effects of thermo-physical properties of materials, geometrical structure and boundary condition on the thermal performance are also investigated. Finally, the design of micro-flow induced thermal sensor that is capable of measuring fluid flow with a lower flow detection limit of approximately 24pL/s is presented.

Thermal Design and Heat Load Measurement of PSICS (적외선 우주망원경 냉각시스템 열설계 및 열침입량 측정)

  • Yang H. S.;Kim D. L.;Lee B. S.;Choi Y. S.
    • Progress in Superconductivity and Cryogenics
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    • v.7 no.3
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    • pp.43-46
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    • 2005
  • A Protomodel Space Infrared Cryogenic System (PSICS) cooled by a stirling cryocooler was designed. The PSICS has an IR sensor inside a cold box which is cooled by a stilting cryocooler with refrigeration capacity of 500mw at 80K in a vacuum vessel. It is important to minimize heat load for reducing background thermal noise. In order to design the cryogenic system of low heat load and to reduce heat load, we did several numerical analyses and tested using boil-off calorimetry with liquid nitrogen to measure the heat leak of the system. In this paper, we present the results obtained by thermal analysis and heat load measurement for designing the PSICS.