• 제목/요약/키워드: Thermal Residual Stress

검색결과 522건 처리시간 0.029초

The effect of initial stress induced during the steel manufacturing process on the welding residual stress in multi-pass butt welding

  • Park, Jeong-ung;An, Gyubaek;Woo, Wanchuck
    • International Journal of Naval Architecture and Ocean Engineering
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    • 제10권2호
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    • pp.129-140
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    • 2018
  • A residual stress generated in the steel structure is broadly categorized into initial residual stress during manufacturing steel material, welding residual stress caused by welding, and heat treatment residual stress by heat treatment. Initial residual stresses induced during the manufacturing process is combined with welding residual stress or heat treatment residual stress, and remained as a final residual stress. Because such final residual stress affects the safety and strength of the structure, it is of utmost importance to measure or predict the magnitude of residual stress, and to apply this point on the design of the structure. In this study, the initial residual stress of steel structures having thicknesses of 25 mm and 70 mm during manufacturing was measured in order to investigate initial residual stress (hereinafter, referred to as initial stress). In addition, thermal elastic plastic FEM analysis was performed with this initial condition, and the effect of initial stress on the welding residual stress was investigated. Further, the reliability of the FE analysis result, considering the initial stress and welding residual stress for the steel structures having two thicknesses, was validated by comparing it with the measured results. In the vicinity of the weld joint, the initial stress is released and finally controlled by the weld residual stress. On the other hand, the farther away from the weld joint, the greater the influence of the initial stress. The range in which the initial stress affects the weld residual stress was not changed by the initial stress. However, in the region where the initial stress occurs in the compressive stress, the magnitude of the weld residual compressive stress varies with the compression or tension of the initial stress. The effect of initial stress on the maximum compression residual stress was far larger when initial stress was considered in case of a thickness of 25 mm with a value of 180 MPa, while in case of thickness at 70 mm, it was 200 MPa. The increase in compressive residual stress is almost the same as the initial stress. However, if initial stress was tensile, there was no significant change in the maximum compression residual stress.

온도 및 잔류응력을 고려한 플라스틱 부품의 점탄성 해석 (Thermal Viscoelastic Analysis of Plastic Part Considering Residual Stress)

  • 문형일;김헌영;최철우;정갑식
    • 소성∙가공
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    • 제17권7호
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    • pp.496-500
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    • 2008
  • Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behavior of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

온도 및 잔류응력을 고려한 플라스틱 부품의 점탄성 해석 (Thermal Viscoelastic Analysis of Plastic Part Considering Residual Stress)

  • 문형일;김헌영;최철우;정갑식
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.288-292
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    • 2008
  • Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But plastic parts are usually distorted after injection molding due to the residual stress after filling, packing, cooling process, and etc. And plastic material is to be deteriorated according to various temperature conditions and operating time, which can be characterized by stress relaxation and creep. The viscoelastic behaviour of plastic materials in time domain can be expressed by the Prony series of the commercial code, ABAQUS. In the paper, the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

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HDM을 이용한 잔류응력측정과 압축·인장 잔류응력이 인가된 재료의 피로수명평가 (Fatigue Life Evaluation on Compressive & Tensional Residual Stress Induced Materials and Residual Stress Measurement using Hole Drilling Method)

  • 백승엽
    • Journal of Welding and Joining
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    • 제31권2호
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    • pp.43-48
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    • 2013
  • This paper Investigated the characteristics of residual stress in weld is composed of typical specimens, are investigated by using three dimensional thermal elasto-plastic FEM analysis. Numerically calculated residual stresses in the gas welds were then compared with experimental results obtained by the hole-drilling method. Using the stress amplitude (${\sigma}a$)R at the hot spot point of gas weld, the relations obtained as the fatigue test results for typical specimens having various dimensions and shapes were systematically rearranged to obtain the (${\sigma}a$)R-Nf relationship. It was found that more systematic and accurate evaluation of the fatigue strength of plug- and ring-type gas-welded joints can be achieved by using (${\sigma}a$)R.

치아응용을 위한 층상 세라믹스에서의 접촉손상 및 잔류응력의 영향 (Effects of Contact Damage and Residual Stress in Dental Layered Ceramics)

  • 정종원;최성철
    • 한국세라믹학회지
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    • 제37권3호
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    • pp.288-293
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    • 2000
  • Effects of contact damage and residual stress for two kinds of dental restorative layered ceramics, porcelain/alumina and porcelain/zirconia bilayers, were observed with Hertzian and Vickers indentation methods. Indentation stress-strain behavior of each material, strength degradation of the coating material, and crack propagation behavior in the coating layer after Vickers indentation were examined by an optical microscope. As a result, porcelain as coating materials showed the classical brittleness. It was inferred that damage and strength in two bilayer system were dependent on thermal expansion mismatch between the coating material and the substrate, which affected the strength degradation. Residual stress resulting from thermal expansion mismtch was formed in the coating layer, and specially in the case of porcelain/zirconia, residual stress was eliminated as coating thickness decreased.

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The Effect of Welding Residual Stress on Whole Structure with T-Joint RHS

  • Rajesh S. R.;Bang H. S.;Kim H.
    • International Journal of Korean Welding Society
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    • 제5권1호
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    • pp.60-65
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    • 2005
  • In the field of welding the mechanical behavior of a welded structure under consideration may be predicted via heat transfer and welding residual stress analysis. Usually such numerical analyses are limited to small regular mesh models or test specimens. Nevertheless, there is very few strength assessment of the whole structure that includes the effect of welded residual stress. The present work is based on the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress including the external load on the welded RHS (Rectangular Hollow Section) T-joint connections of the whole structure. First the thermal history of the combined fillet and butt-welded T-joint equal width cold-formed RHS are calculated using nonlinear finite element analysis (FEA) considering the quarter model of the joint. Then using this thermal history the residual stress around the joints has been evaluated. To validity the FEA result, the calculated residual stresses were compared with the available experimental results. The residual stress obtained from the quarter model is mapped to the full model and then to the whole structure model using FEM codes. The results from the FEM codes were exported to the commercial package for visualization and further analysis applying loads and boundary conditions on the whole structure. The residual stress redistribution along with the external applied load is examined computationally.

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와이어 방전 가공 시 발생되는 열응력 분포에 관한 유한요소법적 고찰 (A study on the Thermal Stress Distribution for Wire Electrical Discharge by Finite Element Method)

  • 반재삼;김승욱;김선진;조규재
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.210-213
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    • 2002
  • The Purpose of this study is to know temperature and thermal stress distribution in specimens during processing of WEDM. If it is constant to the cutting speed and the thickness of material, it is very important to the effect of temperature and the thermal stress distribution after cutting processing. This paper show the analysis result of the distribution of temperature and the residual stress along the direction of thickness before processing of WEDM and after when the cooling temperature is$20^{\circ}C$. The maximum temperature of edge of specimens is $1600^{\circ}C$. It has little temperature gradient in the depth which is 5mm away from edge of specimens. Equivalent residual stress is result in 180.7 MPa at maximum temperature.

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액정 소자의 열적 안전성에 관한 연구 (Study for Thermal Stability of Liquid Crystal Device)

  • 이상극;황정연;서대식;이준웅
    • 한국전기전자재료학회논문지
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    • 제17권4호
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    • pp.439-442
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    • 2004
  • In this study, we investigated about electrooptics characteristic of three kinds of TN cell on the polyimide surface. Monodomain alignments of thermal stressed TN cell over temperature of liquid crystal isotropic phase were almost the same as that of no thermal stressed TN cells. However, the thermal stressed TN cells have many defects. Also, threshold voltage and response time of thermal stressed TN cells show the same performances as no thermal stressed TN cells. There were little changes of value in these TN cells. However, transmittances of TN cells on the polyimide surface decrease with increasing thermal stress time. Finally, the residual DC voltage of the thermal stressed TN cell on the polyimide surface shows decrease of characteristics as increasing thermal stress time. Therefore, the thermal stability of TN cell was decreased by high thermal stress for the long times.

평판용접에 관한 평면변형 열탄소성 해석 (The Plane-Deformation Thermal Elasto-Plastic Analysis During Welding of Plate)

  • 방한서;한길영
    • 한국해양공학회지
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    • 제8권1호
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    • pp.33-40
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    • 1994
  • Welding of structure produces welding residual stresses which influence buckling strength, brittle fracture strength and cold crack on the weld parts. Therefore, it is very important to accurately analyze the residual stress before welding in order to guarantee the safety of weldment. If the weld length is long enough compared to the thickness and the breadth of plate, thermal and mechanical behaviors in the middle portion of the plate are assumed to be uniform along the thickness direction(z-axis). Thus, the following conditions(so-called plane deformation) can be assumed for the plate except near its end;1) distributions of stress and strain are independent on the z-axis;2) plane normal to z-axis before deformation remains plane during and after deformation. In this paper, plane-deformation thermal elasto-plastic problem is formulated by being based on the finite element method. Moreover special regards and paid to the fact that material properties in elastic and plastic region are temperature-dependence. And the method to solve the plane-deformation thermal elasto-plastic problem is shown by using the incremental technique. From the results of analysis, the characterisics of distribution of welding residual stress and plastic strain with the production mechanism are clarified.

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무잔류 응력상태 결정을 통한 표면 잔류응력장 평가에의 레이저 간섭계 적용 (Application of Laser Interferometry for Assessment of Surface Residual Stress by Determination of Stress-free State)

  • 김동원;이낙규;나경환;권동일
    • 반도체디스플레이기술학회지
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    • 제3권2호
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    • pp.35-40
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    • 2004
  • The total relaxed stress in annealing and the thermal strain/stress were obtained from the identification of the residual stress-free state using electronic speckle pattern interferometry (ESPI). The residual stress fields in case of both single and film / substrate systems were modeled using the thermo-elastic theory and the relationship between relaxed stresses and displacements. We mapped the surface residual stress fields on the indented bulk Cu and the 0.5 $\mu\textrm{m}$ Au film by ESPI. In indented Cu, the normal and shear residual stress are distributed over -1.7 GPa to 700 MPa and -800 GPa to 600 MPa respectively around the indented point and in deposited Au film on Si wafer, the tensile residual stress is uniformly distributed on the Au film from 500 MPa to 800 MPa. Also we measured the residual stress by the x-ray diffractometer (XRD) for the verification of above residual stress results by ESPI...

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