• 제목/요약/키워드: Thermal Deflection

검색결과 176건 처리시간 0.026초

절삭공구의 열변형 오차 및 절삭력 변형 오차에 관한 연구 (Study of the thermal deflection error and the deflection error induced by the cutting force)

  • 오명석;윤인준;백대균
    • 한국산업융합학회 논문집
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    • 제5권4호
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    • pp.373-378
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    • 2002
  • This paper presents a method to predict tool deflection induced by the thermal distribution and the cutting force using FEM in milling operation. The thermal distribution of cutting tool was predicted using FEM after measuring the temperature of the end of tool and of the tool holder. The thermal deflection of cutting tool was predicted using FEM as well. The tool deflection induced by the cutting force was analyzed with the solid model of cutting tool. An end mill tool caused most of tool deflection comparing to tool holder. Most of thermal deflection came from Z-direction and most of tool deflection induced by the cutting force came from X and Y direction. Precision cutting will be accomplished when tool locations are generated considering the thermal deflection of cutting tool and the tool deflection induced by the cutting force in CAD/CAM.

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광열편향법을 이용한 이방성 재료의 열전도계수 측정에 관한 이론적 연구 (A Theoretical Study for the Thermal Conductivity Measurement of Anisotropic Material using Photothermal Deflection Spectroscopy)

  • 전필수;김현정;유재석
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2007년도 춘계학술대회B
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    • pp.2465-2470
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    • 2007
  • We have analyzed the three-dimensional thermal conduction in anisotropic materials using nonsymmetric-Fourier transforms. And a complete theoretical treatment of the photothermal deflection spectroscopy has been performed for thermal conductivity measurement in anisotropic medium. Thermal conductivity tensor was determined by the deflection angle and phase angle with the relative position between the heating and probe beams. The influence of the parameters, such as modulation frequency of the heating beam, the thermal conductivity tensor, was investigated.

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TSOP(Thin Small Outline Package) 열변형 개선을 위한 전산모사 분석 (Numerical Analysis for Thermal-deformation Improvement in TSOP(Thin Small Outline Package) by Anti-deflection Adhesives)

  • 김상우;이해중;이효수
    • 마이크로전자및패키징학회지
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    • 제20권3호
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    • pp.31-35
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    • 2013
  • TSOP(Thin Small Outline Package)는 가전제품, 자동차, 모바일, 데스크톱 PC등을 위한 저렴한 비용의 패키지로, 리드 프레임을 사용하는 IC패키지이다. TSOP는 BGA와 flip-chip CSP에 비해 우수한 성능은 아니지만, 저렴한 가격 때문에 많은 분야에 널리 사용되고 있습니다. 그러나, TSOP 패키지에서 몰딩공정 할 때 리드프레임의 열적 처짐 현상이 빈번하게 일어나고, 반도체 다이와 패드 사이의 Au 와이어 떨어짐 현상이 이슈가 되고 있다. 이러한 문제점을 해결하기 위해서는 리드프레임의 구조를 개선하고 낮은 CTE를 갖는 재료로 대체해야 한다. 본 연구에서는 열적 안정성을 갖도록 리드프레임 구조 개선을 위해 수치해석적 방법으로 진행하였다. TSOP 패키지에서 리드프레임의 열적 처짐은 반도체와 다이 사이의 거리(198 um~366 um)에서 안티-디플렉션의 위치에 따라 시뮬레이션을 진행하였다. 안티-디플렉션으로 TSOP 패키지의 열적 처짐은 확실히 개선되는 것을 확인 했다. 안티-디플렉션의 위치가 inside(198 um)일 때 30.738 um 처짐을 보였다. 이러한 결과는 리드프레임의 열적 팽창을 제한하는데 안티-디플렉션이 기여하고 있기 때문이다. 그러므로 리드프레임 패키지에 안티-디플렉션을 적용하게 되면 낮은 CTE를 갖는 재료로 대체하지 않아도 열적 처짐을 향상시킬 수 있음을 기대할 수 있다.

Thermal post-buckling behavior of imperfect graphene platelets reinforced metal foams plates resting on nonlinear elastic foundations

  • Yin-Ping Li;Gui-Lin She;Lei-Lei Gan;H.B. Liu
    • Earthquakes and Structures
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    • 제26권4호
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    • pp.251-259
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    • 2024
  • In this paper, the thermal post-buckling behavior of graphene platelets reinforced metal foams (GPLRMFs) plate with initial geometric imperfections on nonlinear elastic foundations are studied. First, the governing equation is derived based on the first-order shear deformation theory (FSDT) of plate. To obtain a single equation that only contains deflection, the Galerkin principle is employed to solve the governing equation. Subsequently, a comparative analysis was conducted with existing literature, thereby verifying the correctness and reliability of this paper. Finally, considering three GPLs distribution types (GPL-A, GPL-B, and GPL-C) of plates, the effects of initial geometric imperfections, foam distribution types, foam coefficients, GPLs weight fraction, temperature changes, and elastic foundation stiffness on the thermal post-buckling characteristics of the plates were investigated. The results show that the GPL-A distribution pattern exhibits the best buckling resistance. And with the foam coefficient (GPLs weight fraction, elastic foundation stiffness) increases, the deflection change of the plate under thermal load becomes smaller. On the contrary, when the initial geometric imperfection (temperature change) increases, the thermal buckling deflection increases. According to the current research situation, the results of this article can play an important role in the thermal stability analysis of GPLRMFs plates.

열팽창을 고려한 심압대의 실험적 설계에 관한 연구 (A Study on the Experimental Design of Tail stock with Consideration Thermal Expansion)

  • 김경석
    • 한국생산제조학회지
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    • 제9권3호
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    • pp.123-129
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    • 2000
  • To make high accuracy cutting of long materials and a piston for the engines it must be necessary to keep the thermal stability of spindle and tail stock in CNC lathe. If a object is clamped at the ends the thermal expansion and cutting process generate the deflection of cutting objects. Especially in the case of a piston ring piston ovality and piston profile the influences of deflection are very serious. In order to solve the problems most of piston cutting are worked under simply support. However the prob-lems exist yet. Therefore this paper proposes the new structure of tail stock which can compensates the deflection.

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INVERSE HEAT CONDUCTION PROBLEM IN A THIN CIRCULAR PLATE AND ITS THERMAL DEFLECTION

  • Tikhe, A.K.;Deshmukh, K.C.
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • 제9권2호
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    • pp.75-82
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    • 2005
  • An inverse problem of transient heat conduction in a thin finite circular plate with the given temperature distribution on the interior surface of a thin circular plate being a function of both time and position has been solved with the help of integral transform technique and also determine the thermal deflection on the outer curved surface of a thin circular plate defined as $0\;{\leq}\;r\;{\leq}\;a,\;0\;{\leq}\;z\;{\leq}\;h$. The results, obtained in the series form in terms of Bessel's functions, are illustrated numerically.

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GREEN'S FUNCTION APPROACH TO THERMAL DEFLECTION OF A THIN HOLLOW CIRCULAR DISK UNDER AXISYMMETRIC HEAT SOURCE

  • GAIKWAD, KISHOR R.;NANER, YOGESH U.
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • 제25권1호
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    • pp.1-15
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    • 2021
  • A Green's function approach is adopted to solve the two-dimensional thermoelastic problem of a thin hollow circular disk. Initially, the disk is kept at temperature T0(r, z). For times t > 0, the inner and outer circular edges are thermally insulated and the upper and lower surfaces of the disk are subjected to convection heat transfer with convection coefficient hc and fluid temperature T∞, while the disk is also subjected to the axisymmetric heat source. As a special case, different metallic disks have been considered. The results for temperature and thermal deflection has been computed numerically and illustrated graphically.

ANALYSIS OF NON-INTEGER ORDER THERMOELASTIC TEMPERATURE DISTRIBUTION AND THERMAL DEFLECTION OF THIN HOLLOW CIRCULAR DISK UNDER THE AXI-SYMMETRIC HEAT SUPPLY

  • KHAVALE, SATISH G.;GAIKWAD, KISHOR R.
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • 제26권1호
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    • pp.67-75
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    • 2022
  • Analysis of non-integer order thermoelastic temperature distribution and it's thermal deflection of thin hollow circular disk under the axi-symmetric heat supply is investigated. Initially, the disk is kept at zero temperature. For t > 0 the parametric surfaces are thermally insulated and axi-symmetric heat supply on the thickness of the disk. The governing heat conduction equation has been solved by integral transform technique, including Mittag-Leffler function. The results have been computed numerically and illustrated graphically with the help of PTC-Mathcad.

Nonlinear static analysis of smart beams under transverse loads and thermal-electrical environments

  • Ali, Hayder A.K.;Al-Toki, Mouayed H.Z.;Fenjan, Raad M.;Faleh, Nadhim M.
    • Advances in Computational Design
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    • 제7권2호
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    • pp.99-112
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    • 2022
  • This research has been devoted to examine nonlinear static bending analysis of smart beams with nano dimension exposed to thermal environment. The beam elastic properties are corresponding to piezo-magnetic material of different compositions. The large deflection analysis of the beam has been performed assuming that the beam is exposed to transverse uniform pressure. Based on the rule of Hamilton, the governing equations have been derived for a nonlocal thin beam and solved using differential quadrature method. Temperature variation effect on nonlinear deflection of the smart beams has been studied. Also, the beam deflection is shown to be affected by electric voltage, magnetic intensity and material composition.