• International Journal of Reliability and Applications
• /
• v.15 no.2
• /
• pp.125-150
• /
• 2014

Accelerated life tests (ALTs) are extensively used to determine the reliability of a product in a short period of time. Test units are subject to elevated stresses which yield quick failures. ALT can be carried out using constant-stress, step-stress, progressive-stress, cyclic-stress or random-stress loading and their various combinations. An ALT with linearly increasing stress is ramp-stress test. Much of the previous work on planning ALTs has focused on constant-stress, step-stress, ramp-stress schemes and their various combinations where the stress is generally increased. This paper presents an optimal design of ramp soak-stress ALT model which is based on the principle of Thermal cycling. Thermal cycling involves applying high and low temperatures repeatedly over time. The optimal plan consists in finding out relevant experimental variables, namely, stress rates and stress rate change points, by minimizing variance of reliability function with pre-specified mission time under normal operating conditions. The Burr type XII life distribution and time-censored data have been used for the purpose. Burr type XII life distribution has been found appropriate for accelerated life testing experiments. The method developed has been explained using a numerical example and sensitivity analysis carried out.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.40 no.3
• /
• pp.259-265
• /
• 2016

Recently, life prediction models for Pb-based and Pb-free solders used in chip resistor assemblies under thermal cycling have been introduced. The models suggest that the field lifetimes of Pb-free solders would be better than those of Pb-based solders when used for chip resistors under thermal cycling conditions, while the lifetime of the chip assemblies under accelerated test conditions show a reverse relationship. In this study, the prediction models were verified by applying the model to another research case. Finite element models were built, thermal cycling conditions were applied, and the energy densities were calculated. Finally, life prediction analysis was conducted for the cases where Pb-based and Pb-free solders were used. The prediction results were then compared with the test data of the case. It was verified that the predictions of the developed life cycle models are on the practical scale.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.3
• /
• pp.9-17
• /
• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2005.11a
• /
• pp.145-148
• /
• 2005

In this study, adaptation of two-way shape memory effect of SMA wire to the actuator is examined . Therefore the SMA characteristics which are training, material properties, response time at different thermal cycling rates are tested. During training, permanent deformation is accumulated till a certain number of cycle and then saturated. The amow1t of two-way strain is unchangeable over all cycle and the slope of strain(or stress)-temperature curve is slower as the increase of applied stress. The rate effect is observed resulted from the thermal distribution which heating profile differs from cooling as thermal cycling time. Using the estimated SMA properties, an experimental test for the simple smart wing is performed.

• The Journal of Korean Academy of Prosthodontics
• /
• v.38 no.4
• /
• pp.427-437
• /
• 2000

Recently the 2nd generation laboratory composite resins were introduced. Although the mechanical properties of these composite resins have been improved, there were some disadvantages such as discoloration, low abrasion resistance and debonding between metal and resin. The purpose of this study was to evaluate the tensile bond strength between non-pecious dental alloy(verabond) and four veneering reinforced composite resins ; Targis(Ivoclar Co., U.S.A.), Artglass(Kulzer CO., Germany), Sculpture(Jeneric Pentron Co., U.S.A.), and Estonia(Kurary Co., Japan). All test metal specimens were polished with #1,000 SiC paper, and sandblasted with $250{\mu}m$ aluminum oxide. After then. according to manufacturer's instructions metal adhesive primer and veneering resins were applied. All test specimens were divided into two groups. One group was dried in a desiccator at $25^{\circ}C$ for 3 days, the other group was subjected to thermal cycling($2,000{\times}$) in water($5/55^{\circ}C$). Tensile bond strength was measured using Instron Universal Testing machine and the fractured surface was examined under the naked eyes and scanning electron microscope. Within the limitations imposed in this study, the following conclusions can be drawn: 1. In no-thermal cycling groups, there were no significant differences between Estenia and VMK68 but there were significant differences between Targis, Artglass, Sculpture and VMK68(p<0.05). 2. In no-thermal cycling resin groups, the highest tensile bond strength was observed in Estenia and there were significant differences between Estenia and the other resins(p<0.05). 3. Before and after thermal cycling, there were significant differences in tensile bond strength of Targis and Artglass(p<0.05). The tensile bond strength of Artglass was decreased and that of Targis was increased. 4. In no-thermal cycling groups, Artglass showed mixed fracture modes(95%), but after thermal cycling, Artglass showed adhesive fracture modes(75%).

• Journal of the Korean Recycled Construction Resources Institute
• /
• v.5 no.4
• /
• pp.414-420
• /
• 2017

The thermal characteristics of concrete fabricated with blast furnace slag were investigated in this paper. Test parameters included water-binder ratio and the content of furnace slag. Experimental program were performed to measure mechanical properties including compressive strength and split tensile strength under high-temperature thermal cycling, and to measure thermal properties including thermal conductivity and specific heat. Test results showed that the residual compressive strength of mixtures with blast furnace slag was greater than that of mixture without blast furnace slag. In addition, thermal conductivity of mixtures with blast furnace slag was greater than that of mixtures without blast furnace slag. It indicates that blast furnace slag was favorable for charging and discharging in thermal energy storage system. Test results of this study would be used to design concrete module system of thermal energy storage.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.35 no.7
• /
• pp.799-804
• /
• 2011

A thermal cycling test was conducted on a chip resistor solder joint with real-time failure monitoring. In order to study the failure mechanism of the chip resistor solder joint during the test, the resistance between both ends of the resistor was monitored until the occurrence of failure. It was observed that the monitored resistance first fluctuated linearly according to the temperature change. The initial variation in the resistance occurred at the time during the cycle when there was a decrease in temperature. A more significant change in the resistance followed after a certain number of cycles, during the time when there was an increase in the temperature. In order to explain the failure patterns of the solder joint, a mechanism for the solder failure was suggested, and its validity was proved through FE simulations. Based on the explained failure mechanism, it was shown that prognostics for the solder failure can be implemented by monitoring the resistance change in a thermal cycle condition.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.3
• /
• pp.27-32
• /
• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.12
• /
• pp.1856-1863
• /
• 2004

In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.20 no.4
• /
• pp.9-18
• /
• 2016

The thermal and mechanical properties of fiber-reinforced cement-based composite for solar thermal energy storage were investigated in this paper. The effect of the addition of different cement-based materials to Ordinary Portland cement on the thermal and mechanical characteristics of fiber-reinforced composite was investigated. Experiments were performed to measure mechanical properties including compressive strength before and after thermal cycling and split tensile strength, and to measure thermal properties including thermal conductivity and specific heat. Test results showed that the residual compressive strength of mixtures with OPC and slag was greatest among cement-based composite. Thermal conductivity of mixtures including graphite was greater than that of any other mixtures, indicating favor of graphite for improving thermal transfer in terms of charging and discharging in thermal energy storage system. The addition of CSA or zirconium increased specific heat of fiber-reinforced cement-based composite. Test results of this study could be actually used for the design of thermal energy storage system in concentrating solar power plants.