• Journal of the Computational Structural Engineering Institute of Korea
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• v.32 no.2
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• pp.103-108
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• 2019

Non-equilibrium molecular dynamics simulation on the thermal boundary resistance(TBR) of an aluminum(Al)/silicon(Si) interface was performed in the present study. The constant heat flux across the Si/Al interface was simulated by adding the kinetic energy in hot Si region and removing the same amount of the energy from the cold Al region. The TBR estimated from the sharp temperature drop at the interface was independent of heat flux and equal to $5.13{\pm}0.17K{\cdot}m^2/GW$ at 300K. The simulation result was experimentally confirmed by the time-domain thermoreflectance technique. A 90nm thick Al film was deposited on a Si(100) wafer using an e-beam evaporator and the TBR on the film/substrate interface was measured using the time-domain thermoreflectance technique based on a femtosecond laser system. A numerical solution of the transient heat conduction equation was obtained using the finite difference method to estimate the TBR value. Experimental results were compared to the prediction and discussions on the nanoscale thermal transport phenomena were made.

• Bulletin of the Society of Naval Architects of Korea
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• v.9 no.2
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• pp.21-32
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• 1972

The problems of thermal stress and residual stress in resistance spot welding are studied from two standpoint namely, effect of temperature distributions and effect of the radius of free boundary. The radius of the region where the temperature distributions are occured is taken as a function of time after welding and as a finite size, 6 times of heated zone. The region of the radial stress distribution is treated as a function of time under Saint-Venant's principle and 6 or 12 times of originally heated zone. Thermal stresses and strains are obtained by analytic solution under constant mechanical properties and by the finite difference method for varing properties under temperature variation. From the computed results following conclusions are derived (1) For the engineering purpose, the region of temperature distribution and stress distribution can be treated as a finite region, $R=r_o=6r_e$ (2) If the maximum temperature of the aluminum alloy plate is less than $500^{\circ}F$, thermal stresses and strains can be obtained with constant mechanical properties. (3) The residual stresses and strains will be remained in welds and its vicinity.

• Electrical & Electronic Materials
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• v.8 no.6
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.21 no.11
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• pp.613-620
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• 2009

The thermal stresses of a ceramic heat exchanger were analyzed numerically since the ceramic material is good in heat resistance but weak in the thermal stress. The analysis of thermal stress was conducted in the ceramic core with two boundary conditions depending on bolt jointing. The thermal stresses were computed by applying temperature and pressure distributions obtained from the numerical results of conjugate heat transfer to ANSYS WORKRBENCH. When number of bolt joining halls was reduced from $8\times2$ to $4\times2$, the maximum principal stresses decrease by 47.6~50.5% and increase in safety factors by 2.18~2.5 for ultimate tensile strength. Thus, it can be said that bolt joining halls should be minimized in ceramic heat exchanger to be efficient in reducing thermal stress. In addition, the width of particular gas flow passages were revised from 52 mm to 42 mm to reduce maximum thermal stresses since certain passages experienced high thermal stresses. From the revision, safety factors were increased by 13.8~14.1% for the boundary condition of $4\times2$ bolt joining halls. Therefore, it is suggested that thermal stress can be reduced by changing local geometry of a ceramic heat exchanger.

• Fire Science and Engineering
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• v.24 no.6
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• pp.69-75
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• 2010

A concrete filled square steel tube (CFT) is composed of the external steel material, which its strength is reduced in fire due to sudden temperature increase, and the internal concrete with high thermal capacity that can ensure the fire resistance performance of the structure. Therefore, research about the influence factors of the structural performance of CFT column is required in order to apply CFT column to a fire resisting structure, and additional research about influence for each condition is also necessary. Among the influence factors, the boundary condition between column and beam is important structurally, and it is one of the major factors that determine overall fire resisting performance. This study performed a fire experiment under loading in order to analyse the influences of CFT column to the boundary condition. As the results of the experiment, fire resistance time of 106 minutes was ensured for the clamped-end condition but 89 minutes for the hinge-end condition in case of the 360 cross section. And, fire resistance time of 113 minutes was ensured for the clamped-end condition but 78 minutes for the hinge-end condition in case of the 280 cross section.

• Nuclear Engineering and Technology
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• v.34 no.2
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• pp.132-141
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• 2002

The effects of microstructure on fretting wear were investigated in Inconel 690 tube. The microstructure observation indicated that the solution annealing temperature and time affected the grain size of the Inconel 690 tubes. The carbide morphology, along grain boundaries, was mainly affected by thermal treatment time and temperature. The wear test results showed that specimens with larger grain size and with coarse carbides along grain boundaries had better wear resistance. Cracks were found in specimens with carbides along the grain boundary, while few cracks were found in carbide free specimens. It seemed that the carbides on grain boundary assisted crack formation and propagation in carbide containing specimens. On the other hand, the micro-hardness of specimen did not have a major role in fretting wear. It could be inferred from the SEM images of worn surfaces that the main wear mechanism of carbide containing specimen was delamination, while that of carbide free specimen was abrasion.

• Korean Journal of Materials Research
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• v.16 no.9
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• pp.564-570
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• 2006

Silicides have been required to be below 40 nm-thick and to have low contact resistance without agglomeration at high silicidation temperature. We fabricated composite silicide layers on the wafers from Ni(20 nm)/Co(20 nm)/poly-Si(70 nm) structure by rapid thermal annealing of $700{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance, surface composition, cross-sectional microstructure, and surface roughness were investigated by a four point probe, a X-ray diffractometer, an Auger electron spectroscopy, a field emission scanning electron microscope, and a scanning probe microscope, respectively. The sheet resistance increased abruptly while thickness decreased as silicidation temperature increased. We propose that the fast metal diffusion along the silicon grain boundary lead to the poly silicon mixing and inversion. Our results imply that we may consider the serious thermal instability in designing and process for the sub-0.1 um CMOS devices.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Korean Journal of Agricultural Science
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• v.38 no.1
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• pp.115-120
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• 2011

20% of total energy use to sustain temperature of building inside. In this reasons, researchers effort to improve the thermal insulation capacity with new wall system. Using appropriate materials and consisting new wall system should considered in energy saving design. OSB(Oriented strand board), Larch lining board used to consist wall system. $2{\sim}6$ Larch lining board has tongue & groove shape for preventing moisture. Comparing with gypsum board and green timber lining board as interior sheathing material, temperature difference of Green timber wall system was bigger than temperature difference of gypsum board wall system. This aspects indicate that Green timber wall system was revealed higher thermal insulation property than gypsum board wall system. Gypsum board portion transfer heat easily because temperature difference gradient of gypsum board wall system was smaller than OSB wall system. Total temperature variation shape of G-4-S and G-6-S show similar model but, temperature variation shape in green timber wall portion assume a new aspect. The purpose of this study was that possibility of thermal insulation variation and new composition of wall system identify to improve thermal insulation performance. In the temperature case, this study shows possibility of improving thermal insulation performance. Humidity, sunshine and wind etc. should considered to determine building adiabatic properties.

• Membrane and Water Treatment
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• v.2 no.3
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• pp.159-173
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• 2011

The air gap membrane distillation (AGMD) process was applied for water desalination. The main objective of the present work was to study the heat and mass transfer mechanism of the process. The experiments were performed on a flat sheet module using aqueous NaCl solutions as a feed. The membrane employed was hydrophobic PTFE of pore size 0.22 ${\mu}m$. A mathematical model is proposed to evaluate the membrane mass transfer coefficient, thermal boundary layers' heat transfer coefficients, membrane / liquid interface temperatures and the temperature polarization coefficients. The mass transfer model was validated by the experimentally and fitted well with the combined Knudsen and molecular diffusion mechanism. The mass transfer coefficient increased with an increase in feed bulk temperature. The experimental parameters such as, feed temperature, 313 to 333 K, feed velocity, 0.8 to 1.8 m/s (turbulent flow region) were analyzed. The permeation fluxes increased with feed temperature and velocity. The effect of feed bulk temperature on the boundary layers' heat transfer coefficients was shown and fairly discussed. The temperature polarization coefficient increased with feed velocity and decreased with temperature. The values obtained were 0.56 to 0.82, indicating the effective heat transfer of the system. The fouling was observed during the 90 h experimental run in the application of natural ground water and seawater. The time dependent fouling resistance can be added in the total transport resistance.