• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.138-145
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• 2009

A suspended membrane micro fluidic heat flux sensor that is able to measure the heat flow rate was designed and fabricated by a complementary-metal-oxide-semiconductor-compatible process. The combination of a thirty-junction gold and nickel thermoelectric sensor with an ultralow noise preamplifier, low pass filter, and lock-in amp has enabled the resolution of 50 nW power and provides the sensitivity of $11.4\;mV/{\mu}W$. The heater modulation method was used to eliminate low frequency noises from sensor output. It is measured with various heat flux fluid of DI-water to test as micro fluidic application. In order to estimate the heat generation of samples from the output measurement of a micro fluidic heat-flux sensor, a methodology for modeling and simulating electro-thermal behavior in the micro fluidic heat-flux sensor with integrated electronic circuit is presented and validated. The electro-thermal model was constructed by using system dynamics, particularly the bond graph. The electro-thermal system model in which the thermal and the electrical domain are coupled expresses the heat generation of samples converts thermal input to electrical output. The proposed electro-thermal system model shows good agreement with measured output voltage response in transient state and steady-state.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.732-734
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• 1998

Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.4
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• pp.104-110
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• 2001

The objective of this study is structural analysis of continuous casting mold. A two-dimensional finite element model was developed to compute the temperature distribution, thermal stress and thermal strain behavior for continuous casting mold. Structural analysis was made using thermal analysis result, utilizing transient analysis of ANSYS. This structural analysis results, many variables such as casting speed, cooling condition film coefficient, convection and load condition are considered.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2000.10a
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• pp.181-187
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• 2000

This study is object to structural analysis comparison of continuous casting mold. A two-dimensional finite element model was developed to compute the temperature distribution, thermal stress and thermal strain behavior for continuous casting mold. For structural analysis using thermal analysis result from ANSYS. In other to structural analysis of continuous casting mold, many variables such as casting speed, cooling condition, film coefficient, convection and load condition are considered.

• Laser Solutions
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• v.4 no.3
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• pp.40-44
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• 2001

Microbump formation during CO$_2$ laser texturing of glass substrates is examined in this paper. Experimental results show that different bump shapes (dome-shaped, with a central dimple, and with a peripheral rim) are generated depending on the laser fluence. A theoretical model for the process is suggested based on thermoelastic behavior but limited only to the dome-shaped bump. The dimensions (maximum height and base area) of the bump shows a logarithmic dependence on laser fluence as expected from the theory. Numerical computation reveals that the effect of thermal diffusion is not negligible for relatively long laser pulses.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 1989.10a
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• pp.15-18
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• 1989

The planar effects on the concrete pavements Is mainly due to the concrete shrinkage, subgrade friction, and thermal expansion or contraction. A complete understanding of analytical behavior of concrete pavement requires the development of computer model, stiffness matrix and equivalent nodal load matrices due to the effects mentioned above. A computer program, INPLANE II, has been written to evaluate the planar effects on concrete pavements. The planar effects determine to what degree the joint open and also help In determining factors which affect the joint stiffnesses and structural behavior of concrete Pavements.

• Transactions of the Korean hydrogen and new energy society
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• v.22 no.2
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• pp.178-183
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• 2011

Metal hydride alloys are a promising type of material in hydrogen storage applications, allowing for low-pressure, high-density storage. However, while many studies are being performed on enhancing the hydrogen storage properties of such alloys, there has been little research on large-scale storage vessels which make use of the alloys. In particular, large-scale, high-density storage devices must make allowances for the inevitable generation or absorption of heat during use, which may negatively impact functioning properties of the alloys. In this study, we develop a numerical model of the discharge properties of a high-density MH hydrogen storage device. Discharge behavior for a pilot system is observed in terms of temperature and hydrogen flow rates. These results are then used to build a numerical model and verify its calculated predictions. The proposed model may be applied to scaled-up applications of the device, as well as for analyses to enhance future device designs.

• Nuclear Engineering and Technology
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• v.40 no.1
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• pp.77-86
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• 2008

This paper describes the nonlinear analyses of a 1:4 scale model of a prestressed concrete containment vessel (PCCV) using an axisymmetric model and a three-dimensional model. These two models are refined by comparison of the analysis results and with testing results. This paper is especially focused on the analysis of behavior under pressure and the temperature effects revealed using an axisymmetric model. The temperature-dependent degradation properties of concrete and steel are considered. Both geometric and material nonlinearities, including thermal effects, are also addressed in the analyses. The Menetrey and Willam (1995) concrete constitutive model with non-associated flow potential is adopted for this study. This study includes the results of the predicted thermal and mechanical behaviors of the PCCV subject to high temperature loading and internal pressure at the same time. To find the effect of high temperature accident conditions on the ultimate capacity of the liner plate, reinforcement, prestressing tendon and concrete, two kinds of analyses are performed: one for pressure only and the other for pressure with temperature. The results from the test on pressurization, analysis for pressure only, and analyses considering pressure with temperatures are compared with one another. The analysis results show that the temperature directly affects the behavior of the liner plate, but has little impact on the ultimate pressure capacity of the PCCV.

• Journal of Mechanical Science and Technology
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• v.18 no.2
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• pp.230-239
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• 2004

A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.43-50
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• 1998

The purpose of the paper is to protect the damage of plastic IC package with searching the cause of the fracture due to the delamination and crack when the encapsulant of plastic IC package is on viscoelastic behavior with the effect of creep on high temperature, The model for analysis is the plastic SOJ package with dimpled diepad in the IR soldering process of surface mounting technology. The risk of delamination with calculating the distribution of viscoelastic thermal stress in the package without the crack in the surface mounting process is checked. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance against fracture in thermal loading with calculating C (t)-integrals according to the change of the design. The optimum design to depress the delamination and crack is presented.